Module package with high illumination efficiency
There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
1. A module package, comprising:
a circuit board having an upper surface;
a photo sensor chip attached to the upper surface of the circuit board;
a light emitting die attached to the upper surface of the circuit board;
a first transparent layer covering the photo sensor chip and a part of the upper surface of the circuit board, wherein the first transparent layer has a receptacle opposite to the photo sensor chip;
a second transparent layer covering the light emitting die and another part of the upper surface of the circuit board;
an opaque layer covering the first transparent layer and having a through hole opposite to the receptacle; and
a filter accommodated in the receptacle, and secured by transparent adhesive in the receptacle of the first transparent layer.
2. The module package as claimed in claim 1 , wherein the first transparent layer and the second transparent layer are separated from each other.
3. The module package as claimed in claim 1 , wherein the second transparent layer has a light guiding structure opposite to the light emitting die.
4. The module package as claimed in claim 3 , wherein the opaque layer
covers the first transparent layer and the second transparent layer, and
has another through hole opposite to the light guiding structure.
5. The module package as claimed in claim 4 , wherein the opaque layer is a cover or a molded light blocking layer.
6. The module package as claimed in claim 4 , wherein the light guiding structure is a convex dome and accommodated in said another through hole.
7. The module package as claimed in claim 3 , wherein the light guiding structure is integrally formed with the second transparent layer.
8. The module package as claimed in claim 1 , wherein the receptacle has a circular shape or a rectangular shape.
9. The module package as claimed in claim 1 , wherein the filter fully fits in the receptacle.
10. The module package as claimed in claim 1 , wherein a transmitting spectrum of the filter is between 920 nm and 960 nm.
11. A module package, comprising:
a circuit board having an upper surface;
an opaque cover, attached to the upper surface of the circuit board, and having a first inner space, a first through hole above the first inner space, a second inner space and a second through hole above the second inner space;
a photo sensor chip attached to the upper surface of the circuit board in the first inner space and opposite to the first through hole;
a light emitting die attached to the upper surface of the circuit board in the second inner space and opposite to the second through hole;
a transparent layer covering the photo sensor chip, the light emitting die and a part of the upper surface of the circuit board, wherein the transparent layer has a receptacle opposite to the photo sensor chip; and
a filter accommodated in the receptacle, and secured by transparent adhesive in the receptacle of the transparent layer.
12. The module package as claimed in claim 11 , wherein the transparent layer is filled in the first inner space and the second inner space.
13. The module package as claimed in claim 11 , wherein the transparent layer further has a light guiding structure accommodated in the second through hole.
14. The module package as claimed in claim 13 , wherein the light guiding structure is integrally formed with the transparent layer.
15. The module package as claimed in claim 11 , wherein the receptacle has a circular shape or a rectangular shape.
16. The module package as claimed in claim 11 , wherein the photo sensor chip comprises a pixel array arranged under the filter.
17. The module package as claimed in claim 11 , wherein a transmitting spectrum of the filter is between 920 nm and 960 nm.
18. The module package as claimed in claim 11 , wherein the filter fully fits in the receptacle.