3-D IC in Embedded Die Substrate
Three-dimensional (3-D) integrated circuit (IC) structures that are less constrained by the 2-D footprint of a conventional IC die. The novel 3-D IC structures combine 3-D ICs fabricated using various die and/or wafer bonding technologies with embedded die packaging technology. Embodiments include a 3-D IC structure including one or more 3-D IC dies embedded within a stack of one or more planar lamination layers. Combining one or more 3-D ICs with embedded die packaging technology results in a high degree of integration and miniaturization by taking advantage of electrical connection pad placement on both top and bottom surfaces of the 3-D ICs, enables better integration of active components as well as passive components, enables flexible partitioning of circuits and systems for 3-D integration, and enables low-profile 3-D IC structures that take advantage of economies of scale.
1 . A three-dimensional (3-D) integrated circuit (IC) structure including one or more 3-D IC dies embedded within a stack of one or more planar lamination layers.
2 . The invention of claim 1 , wherein the 3-D IC structure includes a top surface and a bottom surface opposite the top surface, the 3-D IC structure further including:
(a) one or more connection pads formed on at least one of the top surface and a bottom surface of the 3-D IC structure; and
(b) at least one electronic, electromechanical, and/or electro-optical component attached and electrically coupled to at least one of the one or more connection pads.
3 . The invention of claim 2 , wherein at least one of the one or more 3-D IC dies includes a plurality of contact die-pads on a first surface and on a second surface opposite the first surface.
4 . The invention of claim 3 , wherein the 3-D IC structure further includes at least one conductive path connecting at least one of the plurality of contact die-pads to at least one of the one or more connection pads.
5 . (canceled)
6 . The invention of claim 2 , wherein the at least one component is a multi-layer ceramic capacitor including interdigitated electrically-isolated internal electrodes, internal via-type main electrodes connected to respective sets of the internal electrodes, and connection pads located on a bonding surface of the multi-layer ceramic capacitor and connected to respective ones of the internal via-type main electrodes.
7 . The invention of claim 1 , wherein at least one of the one or more 3-D IC dies includes a plurality of contact die-pads on a first surface and on a second surface opposite the first surface.
8 . The invention of claim 7 , wherein the at least one of the one or more 3-D IC dies comprises first and second two-dimensional (2-D) IC dies each having a substrate, wherein the first and second 2-D IC dies are bonded together such that the substrate of the first 2-D IC die faces the substrate of the second 2-D IC die.
9 . (canceled)
10 . The invention of claim 7 , wherein the at least one of the one or more 3-D IC dies comprises first and second two-dimensional (2-D) IC dies each having a substrate and a substructure/superstructure formed on the substrate, wherein the first and second 2-D IC dies are bonded together such that the substructure/superstructure of the first 2-D IC die faces the substrate of the second 2-D IC die.
11 . The invention of claim 7 , wherein the at least one of the one or more 3-D IC dies comprises first and second two-dimensional (2-D) dies each having a substrate, a substructure formed on the substrate, and a superstructure formed on the substructure, wherein the first and second 2-D IC dies are bonded together such that the substructure of the first 2-D IC die faces the substrate of the second 2-D IC die and the substrate of the first 2-D IC die is removed.
12 . The invention of claim 7 , wherein the at least one of the one or more 3-D IC dies comprises a substrate having a first surface and a second surface opposite the first surface, wherein the first surface is processed to form a combined substructure/superstructure on the first surface and the second surface is processed to form a combined substructure/superstructure on the second surface.
13 . The invention of claim 1 , wherein the 3-D IC structure includes at least two 3-D IC dies horizontally spaced with respect to each other within the 3-D IC structure.
14 . The invention of claim 1 , wherein the 3-D IC structure includes at least two 3-D IC dies vertically spaced with respect to each other within the 3-D IC structure.
15 . A three-dimensional (3-D) integrated circuit (IC) structure having a top surface and a bottom surface opposite the top surface, the 3-D IC structure including:
(a) one or more 3-D IC dies embedded within a stack of one or more planar lamination layers, wherein at least one of the one or more 3-D IC dies includes a plurality of contact die-pads on a first surface and on a second surface opposite the first surface; and
(b) one or more connection pads formed on at least one of the top surface and a bottom surface of the 3-D IC structure.
16 . The invention of claim 15 , wherein the 3-D IC structure further includes at least one conductive path connecting at least one of the plurality of contact die-pads to at least one of the one or more connection pads.
17 . The invention of claim 15 , further including at least one electronic, electromechanical, and/or electro-optical component attached and electrically coupled to at least one of the one or more connection pads.
18 . (canceled)
19 . The invention of claim 17 , wherein the at least one component is a multi-layer ceramic capacitor including interdigitated electrically-isolated internal electrodes, internal via-type main electrodes connected to respective sets of the internal electrodes, and connection pads located on a bonding surface of the multi-layer ceramic capacitor and connected to respective ones of the internal via-type main electrodes.
20 . The invention of claim 15 , wherein the at least one of the one or more 3-D IC dies comprises first and second two-dimensional (2-D) IC dies each having a substrate, wherein the first and second 2-D IC dies are bonded together such that the substrate of the first 2-D IC die faces the substrate of the second 2-D IC die.
21 . (canceled)
22 . The invention of claim 15 , wherein the at least one of the one or more 3-D IC dies comprises first and second two-dimensional (2-D) IC dies each having a substrate and a substructure/superstructure formed on the substrate, wherein the first and second 2-D IC dies are bonded together such that the substructure/superstructure of the first 2-D IC die faces the substrate of the second 2-D IC die.
23 . The invention of claim 15 , wherein the at least one of the one or more 3-D IC dies comprises first and second two-dimensional (2-D) IC dies each having a substrate, a substructure formed on the substrate, and a superstructure formed on the substructure, wherein the first and second 2-D IC dies are bonded together such that the substructure of the first 2-D IC die faces the substrate of the second 2-D IC die and the substrate of the first 2-D IC die is removed.
24 . The invention of claim 15 , wherein the at least one of the one or more 3-D IC dies comprises a substrate having a first surface and a second surface opposite the first surface, wherein the first surface is processed to form a combined substructure/superstructure on the first surface and the second surface is processed to form a combined substructure/superstructure on the second surface.
25 . The invention of claim 15 , wherein the 3-D IC structure includes at least two 3-D IC dies horizontally spaced with respect to each other within the 3-D IC structure.
26 . The invention of claim 15 , wherein the 3-D IC structure includes at least two 3-D IC dies vertically spaced with respect to each other within the 3-D IC structure.
27 .- 38 . (canceled)