Prepregs and laminates having a UV curable resin layer
Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.
1. A prepreg comprising:
a first thermally curable resin layer;
a second thermally curable resin layer; and
a UV curable resin layer between the first thermally curable resin layer and the second thermally curable resin layer.
2. The prepreg of claim 1 wherein at least one of the first thermally curable resin layer and the second thermally curable resin layer are b-staged thermally curable resin layers.
3. The prepreg of claim 2 wherein both the first thermally curable resin layer and the second thermally curable resin layer are b-staged.
4. The prepreg of claim 1 wherein the first thermally curable resin layer and the second thermally curable resin layers each have a thickness of from about 5 μm to about 40 μm.
5. The prepreg of claim 1 wherein the first thermally curable resin layer and the second thermally curable resin layer each have a thickness of about 5 μm to about 15 μm.
6. The prepreg of claim 1 wherein the UV curable resin layer has a thickness of from about 10 μm to about 500 μm.
7. The prepreg of claim 1 wherein the UV curable resin layer has a thickness of from about 20 μm to about 200 μm.
8. The prepreg of claim 1 wherein one of the first thermally curable resin layer and second thermally curable resin layer is a c-staged thermally curable resin layer.
9. The prepreg of claim 1 wherein the first thermally curable resin layer includes a copper coated surface.
10. A prepreg comprising:
a first thermally curable resin layer that is at least partially cured;
a second thermally curable resin layer that is at least partially cured; and
a UV curable resin layer between the first thermally curable resin layer and the second thermally curable resin layer wherein the first curable resin layer and the second curable resin layer each have a thickness of from about 5 μm to about 40 μm and the UV curable resin layer has a thickness of from about 10 μm to about 500 μm.