3-D Integrated Circuit Antenna Arrays
Antenna structures that can be located in close proximity with respect to an associated RFFE IC regardless of antenna element size. An antenna structure, including a grid or planar antenna or an array of antenna elements, is co-fabricated as part of or with one or more associated RFFE ICs using 3-D stacking of IC dies, either directly or as part of an embedded die packaging technology. Some embodiments include a combinable co-fabricated antenna element, including at least one internally co-fabricated RF antenna element configured to be electrically connectable to a corresponding RF antenna element in a second combinable co-fabricated antenna element by means of 3-D integrated circuit stacking. Some embodiments include a plurality of combinable co-fabricated antenna elements coupled together by means of 3-D integrated circuit stacking such that the antenna elements form a grid antenna or comprise an array of antenna patches.
1 - 8 . (canceled)
9 . A first combinable co-fabricated antenna element, including at least one internally co-fabricated radio frequency antenna element configured to be electrically connectable to a corresponding internally co-fabricated radio frequency antenna element in a second combinable co-fabricated antenna element, wherein the first combinable co-fabricated antenna element and the second combinable co-fabricated antenna element are couplable together by means of 3-D integrated circuit stacking.
10 . The invention of claim 9 , wherein the first combinable co-fabricated antenna element further includes an active circuitry region.
11 . The invention of claim 9 , wherein the first combinable co-fabricated antenna element further includes an active circuitry region containing multiple transistors.
12 . The invention of claim 9 , wherein the at least one internally co-fabricated radio frequency antenna element defines a first plane, and wherein at least one of the first and second combinable co-fabricated antenna elements includes an active circuitry region defining a second plane extending essentially perpendicular to the first plane.
13 . A plurality of combinable co-fabricated antenna elements coupled together by means of 3-D integrated circuit stacking, each combinable co-fabricated antenna element including at least one internally co-fabricated radio frequency antenna element configured to be electrically connected to a corresponding radio frequency antenna element in another combinable co-fabricated antenna element.
14 . The invention of claim 13 , wherein the electrically connected radio frequency antenna elements of the plurality of combinable co-fabricated antenna elements form a grid antenna.
15 . The invention of claim 13 , wherein at least one of the plurality of combinable co-fabricated antenna elements includes an active circuitry region.
16 . The invention of claim 15 , wherein the active circuitry region includes an active layer containing multiple transistors.
17 . The invention of claim 13 , wherein the at least one internally co-fabricated radio frequency antenna element defines a first plane, and wherein at least one of the plurality of combinable co-fabricated antenna elements includes an active circuitry region defining a second plane extending essentially perpendicular to the first plane.
18 . The invention of claim 13 , wherein at least one of the plurality of combinable co-fabricated antenna elements includes a radio frequency integrated circuit including the at least one internally co-fabricated radio frequency antenna element.
19 . The invention of claim 13 , wherein at least one of the plurality of combinable co-fabricated antenna elements includes an embedded die package including the at least one internally co-fabricated radio frequency antenna element.
20 . A plurality of combinable co-fabricated antenna elements coupled together by means of 3-D integrated circuit stacking, each combinable co-fabricated antenna element including at least one internally co-fabricated radio frequency antenna patch.
21 . The invention of claim 20 , wherein each combinable co-fabricated antenna element includes a plurality of radio frequency antenna patches.
22 . The invention of claim 20 , wherein a combination of the radio frequency antenna patches of the plurality of combinable co-fabricated antenna elements forms an antenna array.
23 . The invention of claim 20 , wherein at least one of the plurality of combinable co-fabricated antenna elements includes an active circuitry region.
24 . The invention of claim 23 , wherein the active circuitry region includes an active layer containing multiple transistors.
25 . The invention of claim 20 , wherein the at least one internally co-fabricated radio frequency antenna patch defines a first plane, and wherein at least one of the plurality of combinable co-fabricated antenna elements includes an active circuitry region defining a second plane extending essentially perpendicular to the first plane.
26 . The invention of claim 20 , wherein at least one of the plurality of combinable co-fabricated antenna elements includes a radio frequency integrated circuit including the at least one internally co-fabricated radio frequency antenna patch.
27 . The invention of claim 20 , wherein at least one of the plurality of combinable co-fabricated antenna elements includes an embedded die package including the at least one internally co-fabricated radio frequency antenna patch.
28 - 60 . (canceled)