LED luminaire with VOC barrier

1. A light emitting diode (LED) device, comprising:

a printed circuit board (PCB);

at least one LED chip electrically coupled to the PCB;

a LED package to encapsulate the at least one LED chip; and

at least one volatile organic compound (VOC) barrier layer coating the LED package, wherein the at least one VOC barrier layer comprises a cross-linked polymer, wherein the cross-linked polymer comprises an acrylic polymer, wherein the acrylic polymer is suspended in a mixture with N-butyl acetate.

2. The LED device of claim 1 , wherein the at least one VOC barrier layer coats the entire LED package.

3. The LED device of claim 1 , wherein the at least one VOC barrier layer has a thickness of between approximately 25 microns to approximately 100 microns.

4. The LED device of claim 3 , wherein the at least one VOC barrier layer has a thickness of between approximately 35 microns to approximately 75 microns.

5. The LED device of claim 1 , further comprising:

a coating layer on top of the at least one VOC barrier layer.

6. The LED device of claim 5 , wherein the coating layer comprises a blend of acrylic and urethane polymers.

7. A light emitting diode (LED) device, comprising:

a printed circuit board (PCB);

a plurality of arrays of LED chips electrically coupled to the PCB;

a LED package to encapsulate the plurality of arrays of LED chips;

a first layer of a VOC barrier layer deposited in a direction parallel to a mid-line of the plurality of arrays of LED chips; and

a second layer of the VOC barrier layer deposited in a direction perpendicular to the first layer, wherein the first layer of the VOC barrier layer and the second layer of the VOC barrier layer comprise an acrylic polymer suspended in a mixture with N-butyl acetate.

8. The LED device of claim 7 , wherein the second layer of the VOC barrier layer has a thickness that is approximately 1.5 times a thickness of the first layer of the VOC barrier layer.

9. A light emitting diode (LED) device, comprising:

a printed circuit board (PCB);

a plurality of arrays of LED chips electrically coupled to the PCB;

a LED package to encapsulate the plurality of arrays of LED chips;

a first layer of a VOC barrier layer deposited in a direction parallel to a mid-line of the plurality of arrays of LED chips;

a second layer of the VOC barrier layer deposited in a direction perpendicular to the first layer; and

a third layer of the VOC barrier layer deposited in a direction that is 45 degrees off axis relative to the first layer of the VOC barrier.

10. The LED device of claim 9 , wherein the third layer of the VOC barrier layer has a thickness that is greater than 25 microns.

11. The LED device of claim 9 , further comprising:

a coating layer on top of the third layer of the VOC barrier layer, wherein the coating layer comprises a blend of acrylic and urethane polymers.

12. The LED device of claim 11 , wherein the coating layer has a thickness less than 25 microns.

13. A method, comprising:

providing a light emitting diode (LED) device, wherein the LED device comprises at least one LED chip and an encapsulating LED package to enclose the at least one LED chip;

applying at least one volatile organic compound (VOC) barrier coating over the entire encapsulating LED package of the LED device, wherein the at least one VOC barrier coating comprises a suspended mixture of approximately 40 percent acrylic polymer and 60 percent n-butyl acetate; and

curing the at least one VOC barrier coating.

14. The method of claim 13 , wherein the applying comprises:

masking the LED device to only expose portions of the LED device that are to receive the at least one VOC barrier coating; and

spray coating the at least one VOC barrier coating onto the portions of the LED device that are exposed by the masking.