IP Library Granted Patent US 12,467,803
Granted Patent B2
US 12,467,803 · App. 18/094,165 · Granted Nov 11, 2025

Force sensor with bypass wire

Inventor: Hiroumi Kinjo (Tokyo, JP)
Assignee: Japan Display Inc.
G01L1/20
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Quick Facts
Patent No.
US 12,467,803
App. No.
18/094,165
Granted
Nov 11, 2025
Kind
B2
Abstract

A force sensor includes an array substrate having a first surface provided with a plurality of array electrodes, a node provided on the array substrate and supplied with constant potential, a sensor layer facing the first surface, and a plurality of bypass wires provided on the array substrate and coupling the respective array electrodes to the node. The resistance value of each bypass wire is larger than the resistance value of the sensor layer.

Claims (45)

1 . A force sensor having a plurality of detection regions, comprising:

an array substrate having a first surface;

a sensor layer facing the first surface,

wherein

each of the detection regions includes:

an array electrode on the first surface;

a node provided on the first surface and supplied with constant potential; and

a bypass wire provided on the first surface and coupling the array electrode to the node,

the resistance value of the bypass wire is larger than the resistance value of the sensor layer, when the value of an electric signal input to the array electrode through the sensor layer is minimum.

2 . The force sensor according to claim 1 , wherein the node is a common electrode.

3 . The force sensor according to claim 1 , wherein the node is a ground electrode buried in the array substrate.

4 . The force sensor according to claim 1 , wherein at least part of the bypass wire meanders on the first surface.

5 . The force sensor according to claim 2 , wherein at least part of the bypass wire meanders on the first surface.

6 . The force sensor according to claim 3 , wherein at least part of the bypass wire meanders on the first surface.

7 . The force sensor according to claim 1 , wherein at least part of the bypass wire is buried inside the array substrate beyond the first surface.

8 . The force sensor according to claim 2 , wherein at least part of the bypass wire is buried inside the array substrate beyond the first surface.

9 . The force sensor according to claim 3 , wherein at least part of the bypass wire is buried inside the array substrate beyond the first surface.

10 . The force sensor according to claim 1 , wherein

each of the detection regions includes

a drive transistor configured to drive array electrode, and

a bypass semiconductor layer made of the same material as a semiconductor layer of the drive transistor, and

the bypass semiconductor layer is included in the bypass wire.

11 . The force sensor according to claim 2 , wherein

each of the detection regions includes

a drive transistor configured to drive the array electrode, and

a bypass semiconductor layer made of the same material as a semiconductor layer of the drive transistor, and

the bypass semiconductor layer is included in the bypass wire.

12 . The force sensor according to claim 3 , wherein

each of the detection regions includes

a drive transistor configured to drive the array electrode, and

a bypass semiconductor layer made of the same material as a semiconductor

layer of the drive transistor, and

the bypass semiconductor layer is included in the bypass wire.

13 . A force sensor comprising:

an array substrate having a first surface;

a common electrode provided on the first surface; and

a sensor layer facing the first surface, wherein

the array substrate includes

a plurality of array electrodes provided on the first surface,

a plurality of common electrodes provided on the first surface,

a plurality of first gate lines,

a plurality of second gate lines,

a plurality of drive transistors that have gate electrodes coupled to the respective first gate lines and drive the respective array electrodes, and

a plurality of bypass transistors that have gate electrodes coupled to the respective second gate lines, have drain electrodes coupled to the respective array electrodes, and have source electrodes coupled to the common electrode, and

the resistance value of each bypass transistor is larger than the resistance value of the sensor layer, when the value of an electric signal input to the array electrode through the sensor layer is minimum.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2023
From: KINJO, HIROUMI
To: JAPAN DISPLAY INC.
Reel/Frame 062331/0083 →
Priority Claims (1)
JP 2022-010532 · Jan 26, 2022 · national
Continuity (1)
Related Publication 20230236076A1 · Jul 27, 2023
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