Sputter trap having a thin high purity coating layer and method of making the same
An aluminum or copper alloy sputtering chamber includes a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the front surface A coating of titanium particles is formed on the sputter trap.
1. A sputtering chamber component comprising:
a front surface formed of an aluminum or copper alloy;
a back surface opposite the front surface;
a sputter trap formed on at least a portion of the front surface, the sputter trap having a surface roughness greater than the back surface of the sputtering chamber component; and
a coating of titanium particles formed on the sputter trap, the coating having a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is at least about 99.99% pure, wherein the titanium particles of the coating are substantially diffused and have plastic deformation.
2. The sputtering chamber component of claim 1 , wherein the coating is at least about 99.995% pure.
3. The sputtering chamber component of claim 1 , wherein a concentration of metal-carbide at a surface of the coating is about 70% to 100% less than a concentration of metal-carbide on the front surface of the sputter trap before the coating is applied.
4. The sputtering chamber component of claim 1 , wherein a surface of the coating is substantially free of metal-carbides.
5. The sputtering chamber component of claim 1 , wherein a surface of the coating is substantially free of aluminum oxide.
6. The sputtering chamber component of claim 1 , wherein the titanium particles of the coating are uniformly distributed throughout the coating.
7. The sputtering chamber component of claim 1 , wherein the coating is formed from particles have an average particle size from about 200 mesh to about 320 mesh.
8. The sputtering chamber component of claim 1 , wherein the coating has a thickness from about 0.025 mm to about 0.25 mm (about 0.001 inches to about 0.01 inches).
9. The sputtering chamber component of claim 1 , wherein the sputtering chamber component is a backing plate of a sputtering target assembly.
10. The sputtering chamber component of claim 1 , wherein the sputtering chamber component is a backing plate of a monolithic sputtering target assembly.
11. The sputtering chamber component of claim 1 , wherein the sputter trap with the coating has a surface roughness greater than the roughness greater than the back surface of the sputtering chamber component.
12. A method of forming a sputter trap on an aluminum or copper alloy sputtering chamber component, the method comprising:
cold spraying titanium particles on at least a portion of a textured surface of the sputtering chamber component such that the particles undergo plastic deformation and adhere to the textured surface to form a layer in which the individual particles are substantially indistinguishable from one another, the layer having a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is from about 99.99% to about 99.995% pure.
13. The method of claim 12 , further comprising forming the textured surface on at least a portion of the sputtering chamber component by bead blasting, knurling, or machining.
14. The method of claim 12 , wherein a concentration of metal-carbide at a surface of the layer is less than 70% of a concentration of metal-carbide in the at least a portion of the textured surface of the sputtering chamber component before the layer is applied.
15. The method of claim 12 , wherein the thickness of the layer is from about 0.025 mm to about 0.25 mm (0.001 inches to about 0.01 inches).
16. The method of claim 12 , wherein the thickness of the layer is from about 0.025 mm to about 0.127 mm (0.001 inches to about 0.005 inches).
17. The method of claim 12 , wherein the cold spraying comprises cold spraying titanium particles having an average particle size from about 200 mesh to about 320 mesh.
18. The method of claim 12 , wherein the sputtering chamber component is a backing plate of a sputtering target assembly.
19. The method of claim 12 , wherein the sputtering chamber component is a backing plate of a monolithic sputtering target assembly.
20. The method of claim 12 , wherein after cold spraying the titanium particles, a surface texture of the textured surface is retained.