Modular cold plate for electronic control module
Disclosed herein are embodiments for a control module cooling system. For example, the control module is provided with a chassis and a circuit board assembly that is mounted to the chassis and includes electronics that generate heat during operation. A cold plate is mounted to the chassis and adjacent to the circuit board assembly and defines an opening. A cold block is coupled to the cold plate and comprises: a base disposed within the opening and coupled to the electronics; a plurality of fins extending from the base and spaced apart from each other to form channels; and a plate that is spaced apart from the base to form a cavity. The plate defines an inlet that is arranged over a central portion of the plurality of fins to receive a liquid therethrough to facilitate impinging flow of the liquid through the channels to transfer heat from the electronics.
1. A control module comprising:
a chassis;
a circuit board assembly mounted to the chassis and comprising electronics that generate heat during operation;
a cold plate mounted to the chassis and adjacent to the circuit board assembly, the cold plate defining an opening; and
a cold block coupled to the cold plate, the cold block comprising:
a base disposed within the opening of the cold plate and coupled to the electronics,
a plurality of fins extending from the base, the plurality of fins being spaced apart from each other to form channels therebetween,
a plate spaced apart from the base to form a cavity, the plate defining an inlet arranged over a central portion of the plurality of fins to receive a liquid therethrough to facilitate impinging flow of the liquid through the channels to transfer the heat from the electronics, and
at least one support extending from an outer portion of the plurality of fins to engage the plate and separate the cavity into at least one chamber isolated from the inlet, wherein an inner surface of the plate is contoured to guide the liquid within the at least one chamber toward an outlet formed in the cold block.
2. The control module of claim 1 , wherein the base is spring biased to engage the electronics.
3. The control module of claim 1 , wherein the electronics include a high-performance processor.
4. The control module of claim 1 , wherein the cold plate is in thermal communication with the circuit board assembly to transfer the heat.
5. The control module of claim 4 , wherein the cold plate defines a manifold, the manifold being connected to an outlet of the cold block to receive the liquid and transfer the heat generated by the circuit board assembly to the liquid.
6. The control module of claim 1 , wherein the cold block comprises at least two cold blocks arranged in parallel with each other and configured to provide equal resistance such that the liquid circulates through the at least two cold blocks at approximately equal pressure and speed.
7. A vehicle system comprising:
a range sensor configured to monitor an environment external to a vehicle; and
the control module according to claim 1 ;
wherein the circuit board assembly is further configured to control at least one of a steering system and a braking system based on data from the range sensor.
8. A vehicle comprising:
the vehicle system according to claim 7 , wherein the circuit board assembly is configured to control at least one of the steering system and the braking system to avoid an obstacle based on the data from the range sensor.
9. A vehicle comprising:
the control module according to claim 1 , wherein the circuit board assembly is configured to control at least one vehicle system.
10. A cooling system comprising:
a cold plate configured to mount to a chassis of a control module adjacent to a circuit board assembly, the circuit board assembly comprising electronics that generate heat during operation, the cold plate defining an opening; and
a cold block coupled to the cold plate, the cold block comprising:
a base disposed within the opening of the cold plate and spring biased to engage the electronics,
a plurality of fins extending from the base, the plurality of fins being spaced apart from each other to form channels therebetween,
a plate spaced apart from the base to form a cavity, the plate defining an inlet arranged over a central portion of the plurality of fins to receive a liquid therethrough to facilitate impinging flow of the liquid through the channels to transfer the heat from the electronics, and
at least one support extending from an outer portion of the plurality of fins to engage the plate and separate the cavity into at least one chamber isolated from the inlet, wherein an inner surface of the plate is contoured to guide the liquid within the at least one chamber toward an outlet formed in the cold block.
11. The cooling system of claim 10 , further comprising:
a manifold defined by the cold plate and connected to an outlet of the cold block to receive the liquid and transfer the heat generated by the circuit board assembly.
12. The cooling system of claim 10 , wherein the cold block comprises at least two cold blocks arranged in parallel with each other and configured to provide equal resistance such that the liquid circulates through the at least two cold blocks at approximately equal pressure and speed.
13. The cooling system of claim 10 , further comprising:
a pump coupled to the cold block and configured to increase a flow rate of the liquid circulating through the cold block.
14. A vehicle system comprising:
a range sensor configured to monitor an environment external to a vehicle; and
the cooling system according to claim 10 ;
wherein the circuit board assembly is further configured to control at least one of a steering system and a braking system based on data from the range sensor.
15. A vehicle comprising:
the vehicle system according to claim 14 ;
wherein the cooling system is configured to cool the circuit board assembly; and
the circuit board assembly is configured to control at least one of the steering system and the braking system to avoid an obstacle based on the data from the range sensor.
16. A control module comprising:
a chassis defining a first cavity and a second cavity;
a first circuit board assembly mounted to the chassis and disposed within the first cavity, the first circuit board assembly comprising electronics that generate heat during operation;
a first cold plate mounted to the chassis to enclose the first circuit board assembly within the first cavity, the first cold plate defines a first manifold in thermal communication with the first circuit board assembly to transfer the heat;
a second circuit board assembly mounted to the chassis and disposed within the second cavity, the second circuit board assembly comprising at least two high-performance processors that generate heat during operation;
a second cold plate mounted to the chassis adjacent to the second circuit board assembly within the second cavity, the second cold plate defining at least two openings, each opening being aligned with one of the at least two high-performance processors; and
at least two cold blocks coupled to the second cold plate, each cold block being disposed within one opening of the at least two openings and defining a chamber for receiving a liquid and facilitating impinging flow of the liquid through the chamber to absorb the heat from the aligned high-performance processor,
wherein the second cold plate defines a second manifold, the second manifold being configured to:
receive the liquid from each cold block;
transfer the heat generated by the second circuit board assembly to the liquid; and
provide the liquid to the first manifold.
17. The control module of claim 16 , wherein each cold block of the at least two cold blocks comprises;
a base spring biased to engage the at least two high-performance processors;
a plurality of fins extending away from the base, the plurality of fins being spaced apart from each other to form channels therebetween; and
a plate spaced apart from the base to form the chamber, the plate defining an inlet arranged over a central portion of the plurality of fins to receive the liquid therethrough to facilitate the impinging flow of the liquid through the channels to absorb the heat transferred from the aligned high-performance processor.
18. The control module of claim 17 , wherein each cold block further comprises:
at least one support extending from an outer portion of the plurality of fins to engage the plate and isolate the chamber from the inlet, wherein an inner surface of the plate is contoured to guide the liquid within the chamber toward an outlet formed in the cold block.
19. The control module of claim 16 , wherein the at least two cold blocks are arranged in parallel with each other and configured to circulate the liquid through the at least two cold blocks at approximately equal pressure and speed.
20. A vehicle comprising:
the control module according to claim 16 , wherein the circuit board assembly is configured to control at least one vehicle system.