Audio systems, devices, and methods
In one embodiment of an audio system, a transducer can be coupled to a passive acoustic directional amplifier to provide various benefits and improvements, including improvements to: speech intelligibility, signal-to-noise ratio, effective equivalent input noise, at-a-distance acoustic signal reception, and directional preference. In another embodiment, the shape of an interior surface of a passive acoustic directional amplifier is provided. In another embodiment, the material properties of an interior surface of a passive acoustic directional amplifier are provided.
1. An audio system, comprising:
a three-dimensional structure comprising a material having a Shore-A hardness less than 50, wherein the three-dimensional structure has a concave interior surface that is symmetrical about a central axis, wherein greater than 50% of all points on the concave interior surface have a tangent plane that forms a minimum angle with respect to the central axis that is between 3 degrees and 16 degrees, and wherein the concave interior surface forms a cavity, and wherein the concave interior surface forms an opening, and wherein the concave interior surface has a vertex point located opposite the opening;
a circuit board positioned at least partially within the cavity;
a battery coupled to the circuit board and positioned at least partially within the cavity;
a digital signal processor coupled to the circuit board and positioned at least partially within the cavity; and,
a MEMS microphone coupled to the circuit board and positioned within the cavity, wherein a port hole of the MEMS microphone is located within 10 millimeters of the vertex point.
2. The audio system of claim 1 , wherein at least a portion of the MEMS microphone is embedded in the three-dimensional structure.
3. The audio system of claim 1 , wherein the three-dimensional structure comprises silicone rubber.
4. The audio system of claim 1 , further comprising an interference tube coupled to the three-dimensional structure and extending outward from the three-dimensional structure along the central axis.
5. The audio system of claim 1 , further comprising an electrical cable coupled to the circuit board, wherein the electrical cable passes through a hole in the three-dimensional structure.
6. The audio system of claim 1 , further comprising a wireless transmitter coupled to the circuit board and positioned at least partially within the cavity.
7. An audio system, comprising:
a three-dimensional structure comprising a material having a Shore-A hardness less than 50, wherein the three-dimensional structure has a concave interior surface, an exterior surface, and an opening formed at a boundary between the interior surface and the exterior surface, wherein the concave interior surface forms a cavity about a central axis, wherein the concave interior surface has a vertex point defined as a point where the central axis intersects the interior surface, and wherein all straight lines formed between a point along the opening and the vertex point form a form an angle with respect to the central axis that is less than 30 degrees;
a circuit board positioned at least partially within the cavity;
a battery coupled to the circuit board and positioned at least partially within the cavity;
a digital signal processor coupled to the circuit board and positioned at least partially within the cavity; and,
a MEMS microphone coupled to the circuit board and positioned within the cavity, wherein a port hole of the MEMS microphone is located within 10 millimeters of the vertex point.
8. The audio system of claim 7 , wherein the three-dimensional structure comprises silicone rubber.
9. The audio system of claim 7 , wherein at least a portion of the MEMS microphone is embedded in the three-dimensional structure.
10. The audio system of claim 7 , further comprising an interference tube coupled to the opening of the three-dimensional structure and extending outward from the three-dimensional structure along the central axis.
11. The audio system of claim 7 , further comprising an electrical cable coupled to the circuit board, wherein the electrical cable passes through a hole in the three-dimensional structure.
12. The audio system of claim 7 , further comprising a wireless transmitter coupled to the circuit board and positioned at least partially within the cavity.
13. An audio system, comprising:
a concave structure comprising a material having a having a Shore-A hardness less than 50, wherein the concave structure has an interior surface defining a cavity within the concave structure, a rim defining an opening of the concave structure, an interior surface vertex within the cavity at a point on the interior surface that is furthest away from a centroid of the opening, and an exterior surface defining an exterior shape of the concave structure, wherein the exterior surface abuts the interior surface at the rim;
wherein the rim comprises a lower rim point which is a point along the rim that is located closer to the interior surface vertex than all other points along the rim, and wherein the rim comprises an upper rim point that is a point along the rim which is located further from the interior surface vertex than all other points along the rim, and wherein a first angle is formed by the lower rim point, the upper rim point and the interior surface vertex, wherein the first angle has a first angle vertex at the upper rim point, and wherein the rim of the concave structure is configured such that the first angle has a value between 8° and 20′;
a circuit board positioned at least partially within the cavity;
a battery coupled to the circuit board and positioned at least partially within the cavity;
a digital signal processor coupled to the circuit board and positioned at least partially within the cavity; and,
a MEMS microphone coupled to the circuit board and positioned within the cavity, wherein a port hole of the MEMS microphone is located within 10 millimeters of the interior surface vertex.
14. The audio system of claim 13 , wherein the concave structure comprises silicone rubber.
15. The audio system of claim 13 , wherein at least a portion of the MEMS microphone is embedded in the concave structure.
16. The audio system of claim 13 , further comprising an electrical cable coupled to the circuit board, wherein the electrical cable passes through an hole in the concave structure.
17. The audio system of claim 13 , further comprising a wireless transmitter coupled to the circuit board and positioned at least partially within the cavity.