Low Z-height LED array package having TSV support structure
A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.
1 . A packaging structure for a light emitter pixel array, comprising:
a segmented monolithic structure comprising a plurality of pixels;
an inorganic substrate having a top redistribution layer attached to the pixels; and
at least one through via containing an electrical conductor and defined to pass through the inorganic substrate to support an electrical coupling with the top redistribution layer, the top redistribution layer disposed between the at least one through via and the pixels.
2 . The packaging structure for the light emitter pixel array of claim 1 , wherein the top redistribution layer is attached to each pixel using a copper post.
3 . The packaging structure for the light emitter pixel array of claim 2 , wherein the top redistribution layer is in direct contact with the copper post, and each pixel is in direct contact with solder material attaching the pixel to the copper post.
4 . The packaging structure for the light emitter pixel array of claim 1 , further comprising a pixel light confinement structure separating adjacent ones of the pixels from each other.
5 . The packaging structure for the light emitter pixel array of claim 4 , wherein the pixel light confinement structure is spaced apart from the top redistribution layer by silicone or epoxy.
6 . The packaging structure for the light emitter pixel array of claim 4 , wherein the pixel light confinement structure further comprises a diffusing layer aligned with phosphor material.
7 . The packaging structure for the light emitter pixel array of claim 1 , further comprising conductive lines electrically coupled to the pixels arranged in a non-rectangular arrangement.
8 . The packaging structure for the light emitter pixel array of claim 1 , wherein the segmented monolithic structure has infilled trenches laterally separating adjacent ones of the pixels from each other.
9 . The packaging structure for the light emitter pixel array of claim 1 , wherein the pixels are independently controllable.
10 . The packaging structure for the light emitter pixel array of claim 1 , further comprising underfill between the segmented monolithic structure and the inorganic substrate.
11 . The packaging structure for the light emitter pixel array of claim 1 , further comprising circuitry formed on the inorganic substrate.
12 . The packaging structure for the light emitter pixel array of claim 1 , further comprising a support upon which the inorganic substrate is disposed, and a CMOS die on the support.
13 . The packaging structure for the light emitter pixel array of claim 1 , further comprising an optical element disposed over at least some of the pixels.
14 . The packaging structure for the light emitter pixel array of claim 1 , wherein the pixels have a hexagonal or arcuate shape.
15 . The packaging structure for the light emitter pixel array of claim 1 , further comprising traces connected to the at least one through via, the traces having a greater density toward a center of the pixel array compared to an outer edge of the pixel array.
16 . A packaging structure for a light emitter array, comprising:
a segmented monolithic structure comprising a plurality of light emitting elements; and
a substrate attached to the segmented monolithic structure, the substrate having a top redistribution layer, a bottom redistribution layer, and a plurality of through vias extending through the substrate to provide electrical coupling between the top redistribution layer and the bottom redistribution layer.
17 . The packaging structure for the light emitter array of claim 16 , wherein the light emitting elements are arrayed in curving lines, and/or staggered rows or columns.
18 . The packaging structure for the light emitter pixel array of claim 16 , wherein a total Z-height of the packaging structure is less than 300 microns.
19 . A packaging structure for a light emitter pixel array, comprising:
a segmented monolithic structure comprising a plurality of pixels arranged in a 7×7 matrix; and
a silicon substrate attached to the segmented monolithic structure and having a total Z-height of 100 microns or less, the silicon substrate having a top redistribution layer, a bottom redistribution layer, and a plurality of through silicon vias (TSVs) extending through the silicon substrate to provide electrical coupling between the top redistribution layer and the bottom redistribution layer.
20 . The packaging structure for the light emitter pixel array of claim 19 , wherein the segmented monolithic structure is a segmented GaN layer.