IP Library Granted Patent US 12,429,264
Granted Patent B2
US 12,429,264 · App. 18/108,973 · Granted Sep 30, 2025

Refrigeration circuit and refrigeration device

Inventors: Takashi Toyooka (Saitama, JP); Minoru Suto (Gunma, JP)
Assignee: PHC HOLDINGS CORPORATION
F25B43/043F25B39/02F28D9/0062
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Quick Facts
Patent No.
US 12,429,264
App. No.
18/108,973
Granted
Sep 30, 2025
Kind
B2
Abstract

A refrigeration circuit includes: a gas-liquid separator into which a gas-liquid two-phase refrigerant flowed out from a condenser flows, the gas-liquid separator being configured to separate the gas-liquid two-phase refrigerant into a vapor phase refrigerant and a liquid phase refrigerant; and a plate heat exchanger including a first heat exchanging part and a second heat exchanging part, the first heat exchanging part being a part where the vapor phase refrigerant flowed out from the gas-liquid separator and the liquid phase refrigerant flowed out from the gas-liquid separator exchange heat, the second heat exchanging part being a part where the vapor phase refrigerant flowed out from the first heat exchanging part and a returning refrigerant flowed out from an evaporator exchange heat.

Claims (17)

1. A refrigeration circuit comprising:

a gas-liquid separator into which a gas-liquid two-phase refrigerant flowed out from a condenser flows, the gas-liquid separator being configured to separate the gas-liquid two-phase refrigerant into a vapor phase refrigerant and a liquid phase refrigerant; and

a plate heat exchanger including a first heat exchanging part and a second heat exchanging part, the first heat exchanging part being a part where the vapor phase refrigerant flowed out from the gas-liquid separator and the liquid phase refrigerant flowed out from the gas-liquid separator exchange heat, the second heat exchanging part being a part where the vapor phase refrigerant flowed out from the first heat exchanging part and a returning refrigerant flowed out from an evaporator exchange heat,

wherein in the plate heat exchanger, a plurality of plates are disposed side by side in order with plate surfaces of the plurality of plates facing each other,

between adjacent two plates, a channel through which the vapor phase refrigerant or the liquid phase refrigerant flows is formed, so that a plurality of channels are formed in order between a first end of the plate heat exchanger and a second end of the plate heat exchanger,

a first channel is formed between a first plate and a second plate, a second channel is formed between the second plate and a third plate, a third channel is formed between the third plate and a fourth plate, and a fourth channel is formed between the fourth plate and a fifth plate,

the second channel and the fourth channel communicate with each other, and the second channel and the fourth channel do not communicate with adjacent channels, and

the third plate forming the second channel has a protruding part bent toward the fourth plate to form a U shape, the U shape has a bottom, at least part of the bottom of the U shape is in direct contact with the fourth plate, and a through hole is formed at the bottom of the U shape.

2. The refrigeration circuit according to claim 1 , wherein in the first heat exchanging part, the vapor phase refrigerant flowed out from the gas-liquid separator, and a refrigerant that is a mixture of the liquid phase refrigerant flowed out from the gas-liquid separator and the returning refrigerant flowed out from the second heat exchanging part exchange heat.

3. The refrigeration circuit according to claim 1 ,

wherein at a plate surface of a first plate disposed at the first end of the plate heat exchanger, a vapor phase refrigerant inflow part where the vapor phase refrigerant flows in, a liquid phase refrigerant inflow part where the liquid phase refrigerant flows in, and a liquid phase refrigerant outflow part where the liquid phase refrigerant flows out are disposed, and

wherein at a plate surface of a plate disposed at a second end of the plate heat exchanger, a vapor phase refrigerant outflow part where the vapor phase refrigerant flows out, a returning refrigerant inflow part where the returning refrigerant flows in, and a returning refrigerant outflow part where the returning refrigerant flows out are disposed.

4. The refrigeration circuit according to claim 1 , further comprising a double tube heat exchanger including an inner pipe through which the vapor phase refrigerant flowed out from the second heat exchanging part flows, and an outer pipe through which the returning refrigerant that flows into the second heat exchanging part flows.

5. A refrigeration device comprising the refrigeration circuit according to claim 1 .

6. The refrigeration circuit according to claim 1 , wherein a through hole is formed at the fourth plate, and the through hole formed at the bottom of the U shape of the protruding part of the third plate communicates with the through hole formed at the fourth plate.

7. The refrigeration circuit according to claim 6 , wherein peripheries of the through hole formed at the bottom of the U shape of the protruding part of the third plate and the through hole formed at the fourth plate are in contact with each other and welded.

8. The refrigeration circuit according to claim 1 , wherein the vapor phase refrigerant flowed out from the gas-liquid separator flows from the second channel directly to the fourth channel.

Assignments (2)
CHANGE OF ADDRESS Recorded Dec 12, 2024
From: PHC HOLDINGS CORPORATION
To: PHC HOLDINGS CORPORATION
Reel/Frame 069618/0382 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2023
From: TOYOOKA, TAKASHI; SUTO, MINORU
To: PHC HOLDINGS CORPORATION
Reel/Frame 062676/0407 →
Priority Claims (1)
JP 2021-004787 · Jan 15, 2021 · national
Continuity (2)
Continuation PCTJP2021045834 · Dec 13, 2021
Related Publication 20230184472A1 · Jun 15, 2023
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