IP Library Granted Patent US 12,476,842
Granted Patent B2
US 12,476,842 · App. 18/113,094 · Granted Nov 18, 2025

Direct encapsulation of sensor data over ethernet

Inventors: Amir Bar-Niv (Sunnyvale, CA); Dance Wu (Palo Alto, CA)
Assignee: Infineon Technologies Americas Corp.
H04L12/40091H04L12/40071H04L2012/40273
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Quick Facts
Patent No.
US 12,476,842
App. No.
18/113,094
Granted
Nov 18, 2025
Kind
B2
Abstract

A sensor bridge, for use in an Ethernet network in a vehicle, includes a sensor interface, a mapper and a communication processor. The sensor interface is configured to receive sensor data from a sensor installed in the vehicle. The mapper is configured to form mapped sensor data by applying to the sensor data a direct mapping that maps specified parts of the sensor data to corresponding bit positions in one or more Ethernet packets. The communication processor is configured to generate the one or more Ethernet packets including the mapped sensor data, and to transmit the one or more Ethernet packets over the Ethernet network.

Claims (17)

1 . A sensor bridge for use in an Ethernet network in a vehicle, the sensor bridge comprising:

a sensor interface, configured to receive sensor data from a sensor installed in the vehicle;

a mapper, configured to:

hold a direct mapping that maps specified parts of the sensor data to corresponding bit positions in one or more Ethernet packets; and

populate a memory buffer with the received sensor data in accordance with the direct mapping, wherein the memory buffer is preconfigured according to a format of the Ethernet packets and has respective memory locations designated to buffer the specified parts of the sensor data; and

a communication processor, configured to generate the one or more Ethernet packets comprising the sensor data buffered in the memory buffer, and to transmit the one or more Ethernet packets over the Ethernet network.

2 . The sensor bridge according to claim 1 , wherein the mapper is further configured to add to the mapped sensor data, at specified positions, routing information for routing the one or more Ethernet packets in the Ethernet network.

3 . The sensor bridge according to claim 1 , wherein the mapper is further configured to add to the mapped sensor data, at specified positions, Operations, Administration and Management (OAM) information for transmission in the one or more Ethernet packets.

4 . The sensor bridge according to claim 1 , wherein the mapper is configured to map the sensor data with a latency that does not exceed one microsecond.

5 . A method for transmitting sensor data in an Ethernet network in a vehicle, the method comprising:

receiving sensor data from a sensor installed in the vehicle;

holding a direct mapping that maps specified parts of the sensor data to corresponding bit positions in one or more Ethernet packets;

populating a memory buffer with the received sensor data in accordance with the direct mapping, wherein the memory buffer is preconfigured according to a format of the Ethernet packets and has respective memory locations designated to buffer the specified parts of the sensor data; and

generating the one or more Ethernet packets comprising the sensor data buffered in the memory buffer, and transmitting the one or more Ethernet packets over the Ethernet network.

6 . The method according to claim 5 , wherein applying the direct mapping further comprises adding to the mapped sensor data, at specified positions, routing information for routing the one or more Ethernet packets in the Ethernet network.

7 . The method according to claim 5 , wherein applying the direct mapping further comprises adding to the mapped sensor data, at specified positions, Operations, Administration and Management (OAM) information for transmission in the one or more Ethernet packets.

8 . The method according to claim 5 , wherein applying the direct mapping comprises mapping the sensor data with a latency that does not exceed one microsecond.

Assignments (4)
MERGER Recorded Sep 5, 2025
From: INFINEON TECHNOLOGIES US NEWCO LLC
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 072563/0932 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2025
From: MARVELL ASIA PTE LTD
To: INFINEON TECHNOLOGIES US NEWCO LLC
Reel/Frame 072517/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2025
From: BAR-NIV, AMIR; WU, DANCE
To: MARVELL SEMICONDUCTOR, INC.
Reel/Frame 070643/0190 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2025
From: MARVELL SEMICONDUCTOR, INC.
To: MARVELL ASIA PTE LTD
Reel/Frame 070643/0254 →
Continuity (2)
Provisional Application 63313291 · Feb 24, 2022
Related Publication 20230269112A1 · Aug 24, 2023
References Cited (15)
US 11654938B1 · Kumar · 2023 [cited by examiner]
US 20190306287A1 · Kniplitsch · 2019 [cited by examiner]
US 20200059438A1 · Ogawa · 2020 [cited by examiner]
US 20230021603A1 · Ichimaru · 2023 [cited by examiner]
US 20230379186A1 · Kim · 2023 [cited by examiner]
CN 106961437A · 2017 [cited by applicant]
CN 112272132B · 2021 [cited by applicant]
KR 102125875B1 · 2020 [cited by applicant]
IEEE Standard 1722-2016, “IEEE Standard for a Transport Protocol for Time-Sensitive Applications in Bridged Local Area Networks”, pp. 1-233, Dec. 7, 2016. [cited by applicant]
MIPI Alliance, Inc., “Errata 01 for MIPI CSI-2 Specification (Camera Serial Interface 2) Specification Version 2.1,” pp. 1-290, Apr. 26, 2018. [cited by applicant]
IEEE P802.3cy/D3.2, “Draft Standard for Ethernet—Amendment 8: Physical Layer Specifications and Management Parameters for 25 GB/s Electrical Automotive Ethernet”, pp. 1-141, year 2023. [cited by applicant]
IEEE 802.3ch-2020, “IEEE Standard for Ethernet—Amendment 8: Physical Layer Specifications and Management Parameters for 2.5 GB/s, 5 GB/s, and 10 GB/s Automotive Electrical Ethernet,” IEEE Computer Society, pp. 1-207, Ju… [cited by applicant]
MIPI Alliance, Inc., “Mipi Alliance Specification for D-PHY”, pp. 1-234, version 2.5, Jul. 5, 2019. [cited by applicant]
International Application # PCT/IB2023/051664 Search Report dated Apr. 25, 2023. [cited by applicant]
Bar-Niv et al., U.S. Appl. No. 18/168,595, filed Feb. 14, 2023. [cited by applicant]