MICRO LED, MICRO LED PANEL AND MICRO LED CHIP
A micro LED includes a light emitting structure; an electrical conductive layer formed on the light emitting structure; and a reflective layer formed on the electrical conductive layer, wherein a top surface of the reflective layer is lower than a top surface of the electrical conductive layer.
1 . A micro Light Emitting Diode (LED), comprising:
a light emitting structure;
an electrical conductive layer formed on the light emitting structure; and
a reflective layer formed on a portion of the electrical conductive layer, wherein a top surface of the reflective layer is lower than a top surface of the electrical conductive layer.
2 . The micro LED according to claim 1 , wherein the top surface of the reflective layer is higher than a top surface of the light emitting structure.
3 . The micro LED according to claim 1 , further comprising a passivation layer formed between the light emitting structure and the electrical conductive layer.
4 . The micro LED according to claim 3 , wherein a top surface of the passivation layer is higher than the top surface of the reflective layer.
5 . The micro LED according to claim 1 , wherein a material of the reflective layer is metal or oxide material.
6 . The micro LED according to claim 1 , wherein the reflective layer is formed by stacked layers.
7 . The micro LED according to claim 6 , wherein the reflective layer comprises stacked layers of Ni, Ag, or Au.
8 . The micro LED according to claim 1 , wherein an inclined angle of a sidewall of the light emitting structure is less than 90°.
9 . The micro LED according to claim 1 , wherein a thickness of the reflective layer is larger than half a thickness of the light emitting structure.
10 . The micro LED according to claim 1 , wherein the light emitting structure is a mesa structure with a flat top surface.
11 . The micro LED according to claim 10 , wherein the light emitting structure is a cone structure without a steeple top.
12 . The micro LED according to claim 1 , further comprising a micro lens formed on the electrically conductive layer and the reflective layer.
13 . The micro LED according to claim 1 , further comprising a conductive substrate electrically connected with the light emitting structure and formed under the light emitting structure.
14 . The micro LED according to claim 13 , wherein the conductive substrate is an integrated circuit (IC) substrate.
15 . The micro LED according to claim 13 , wherein the conductive substrate is bonded with the light emitting structure.
16 . A micro LED panel comprising two or more micro LEDs, wherein each one of the two or more micro LEDs comprises:
a light emitting structure;
an electrical conductive layer formed on the light emitting structure; and
a reflective layer formed on a portion of the electrical conductive layer, wherein a top surface of the reflective layer is lower than a top surface of the electrical conductive layer;
wherein the reflective layer is formed between adjacent ones of light emitting structures of the two or more micro LEDs.
17 . A micro LED chip comprising one or more micro LED panels, wherein each one of the one or more micro LED panels comprises two or more micro LEDs, and each one of the two or more micro LEDs comprises:
a light emitting structure;
an electrical conductive layer formed on the light emitting structure; and
a reflective layer formed on a portion of the electrical conductive layer, wherein a top surface of the reflective layer is lower than a top surface of the electrical conductive layer;
wherein the reflective layer is formed between adjacent ones of light emitting structures of the two or more micro LEDs.