IP Library Granted Patent US 12,038,654
Granted Patent B2
US 12,038,654 · App. 18/133,073 · Granted Jul 16, 2024

Display device

Inventors: Tsung-Han Tsai (Miao-Li County, TW); Hsia-Ching Chu (Miao-Li County, TW); Mei-Chun Shih (Miao-Li County, TW)
Assignee: INNOLUX CORPORATION
G02F1/134309G02F1/133345G02F1/13439G02F1/136286G02F1/1368G02F1/133707G02F1/134363G02F1/136227G02F2202/10
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Quick Facts
Patent No.
US 12,038,654
App. No.
18/133,073
Granted
Jul 16, 2024
Kind
B2
Abstract

A semiconductor substrate includes: a substrate; a first conductive line disposed on the substrate and extending along a first direction; a semiconductor layer disposed on the substrate; an electrode disposed on the semiconductor layer and including an arc edge outside the first conductive line; and a conductive layer disposed on the electrode, wherein a part of the semiconductor layer extends along a second direction different from the first direction and the arc edge overlaps the part of the semiconductor layer.

Claims (15)

1. A semiconductor substrate, comprising:

a substrate;

a first conductive line disposed on the substrate and extending along a first direction;

a semiconductor layer disposed on the substrate;

an electrode disposed on the semiconductor layer and comprising an arc edge outside the first conductive line; and

a conductive layer disposed on the electrode,

wherein a part of the semiconductor layer extends along a second direction different from the first direction and the arc edge overlaps the part of the semiconductor layer.

2. The semiconductor substrate of claim 1 , wherein the part of the semiconductor layer and the first conductive line are crossed.

3. The semiconductor substrate of claim 1 , further comprising a display medium layer disposed on the conductive layer, wherein the display medium layer is an organic light emitting layer.

4. The semiconductor substrate of claim 1 , further comprising a display medium layer disposed on the conductive layer, wherein the display medium layer is a liquid crystal layer.

5. The semiconductor substrate of claim 1 , further comprising two second conductive lines disposed on the substrate, wherein the two second conductive lines and the first conductive line are crossed, the first conductive line comprises a first part and a second part, the first part is disposed between the two second conductive lines, the second part is overlapped with one of the two second conductive lines, and a maximum width of the first part along a third direction perpendicular to the first direction is greater than a maximum width of the second part along the third direction perpendicular to the first direction.

6. The semiconductor substrate of claim 1 , wherein the first conductive line comprises a first protrusion part and a second protrusion part, the first protrusion part and the second protrusion part protrude in two opposite directions parallel to a third direction perpendicular to the first direction, and a width of the first protrusion part along the third direction perpendicular to the first direction is different from a width of the second protrusion part along the third direction perpendicular to the first direction.

7. The semiconductor substrate of claim 1 , wherein the electrode and the first conductive line are overlapped.

8. The semiconductor substrate of claim 1 , wherein the electrode extends along a third direction perpendicular to the first direction.

9. The semiconductor substrate of claim 8 , wherein an end of the electrode comprises the arc edge.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2024
From: INNOLUX CORPORATION
To: RED OAK INNOVATIONS LIMITED
Reel/Frame 069206/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2023
From: TSAI, TSUNG-HAN; CHU, HSIA-CHING; SHIH, MEI-CHUN
To: INNOLUX CORPORATION
Reel/Frame 063287/0743 →