ELECTROCALORIC SYSTEM
A support layer is disposed between a first layer of first electrocaloric capacitors and the second layer of second electrocaloric capacitors. The support layer has thermally conductive vias. A voltage source is configured to apply a first voltage thereby applying a first electric field to the first electrocaloric capacitors and a second voltage thereby applying a second electric field to the second electrocaloric capacitors. The first and second electric fields are complementary such that when the first and second electric fields are applied, heat is transferred through the thermally conductive vias from the first electrocaloric capacitors to the second electrocaloric capacitors or from the second electrocaloric capacitors to the first electrocaloric capacitors.
1 . A system comprising:
a first layer of first electrocaloric capacitors, the first electrocaloric capacitors separated from each other by a first set of insulation regions;
a second layer of second electrocaloric capacitors proximate the first electrocaloric capacitors, the second electrocaloric capacitors separated from each other by a second set of insulation regions;
a support layer disposed between the first layer and the second layer, the support layer comprising thermally conductive vias; and
a voltage source configured to apply a first voltage thereby applying a first electric field to the first electrocaloric capacitors and a second voltage thereby applying a second electric field to the second electrocaloric capacitors, wherein the first and second electric fields are complementary such that when the first and second electric fields are applied, heat is transferred through the thermally conductive vias from the first electrocaloric capacitors to the second electrocaloric capacitors or from the second electrocaloric capacitors to the first electrocaloric capacitors.
2 . The system of claim 1 , wherein the support layer comprises a thermally insulating material, the thermally insulating material maintaining a low thermal conductance between adjacent capacitors on a same layer of the first and second layers.
3 . The system of claim 1 , wherein the support layer is a structural support layer.
4 . The system of claim 3 , wherein the structural support layer comprises:
a first support structure proximate the first layer;
a second support structure proximate the second layer; and
a lubricant disposed between the first support structure and the second support structure, and wherein the thermally conductive vias comprises first and second vias through the respective first and second support structures.
5 . The system of claim 4 , wherein the lubricating layer has low thermal conductivity.
6 . The system of claim 1 , wherein the support layer has a relatively low thermal conductivity in a lateral direction, wherein the thermal vias comprise a relatively high thermal conductivity in a vertical direction resulting in thermal conductance between the first and second electrocaloric capacitors wherein the first and second electrocaloric capacitors are aligned.
7 . The system of claim 6 , wherein the support layer comprises a glass, a polymer, a ceramic or a printed circuit board material, and wherein the thermally conductive vias are filled with metal.
8 . The system of claim 1 , wherein the first and second electrocaloric capacitors comprise multilayer chip capacitors.
9 . The system of claim 1 , further comprising an actuator configured to cause a relative shift between the first layer and the second layer to cause a change in alignment between the first and second electrocaloric capacitors.
10 . The system of claim 9 , wherein the actuator causes the relative shift intermittently or continuously in correspondence with the heat transfer between the first and second electrocaloric capacitors.
11 . The system of claim 9 , wherein the relative shift comprises moving one or both of the first and second layers according to a linear motion.
12 . The system of claim 9 , wherein the relative shift comprises moving one or both of the first and second layers according to a rotational motion.
13 . A system comprising:
a first layer of first electrocaloric capacitors, the first electrocaloric capacitors separated from each other by a first set of insulation regions;
a second layer of second electrocaloric capacitors proximate the first electrocaloric capacitors, the second electrocaloric capacitors separated from each other by a second set of insulation regions;
a support layer disposed between the first layer and the second layer, the support layer comprising thermally conductive vias between vertically aligned pairs of the first and second electrocaloric capacitors, the support layer comprising a thermally insulating material between vertically aligned ones of the first and second insulation regions; and
a voltage source configured to apply a first voltage thereby applying a first electric field to the first electrocaloric capacitors and a second voltage thereby applying a second electric field to the second electrocaloric capacitors, wherein the first and second electric fields are complementary such that when the first and second electric fields are applied, heat is transferred through the thermally conductive vias from the first electrocaloric capacitors to the second electrocaloric capacitors or from the second electrocaloric capacitors to the first electrocaloric capacitors.
14 . The system of claim 13 , wherein the support layer comprises a glass, a polymer, a ceramic or a printed circuit board material, and wherein the thermally conductive vias are filled with metal.
15 . A method comprising:
moving a second layer of second electrocaloric capacitors a first direction relative to a first layer of first electrocaloric capacitors, the first electrocaloric capacitors separated from each other by first insulation regions, the second electrocaloric capacitors separated from each other by second insulation regions, the first and second layers separated by a support layer;
increasing a first electric field on the first electrocaloric capacitors while decreasing a second electric field on the second electrocaloric capacitors, thereby causing a first heat flux to be transferred from the first electrocaloric capacitors to the second electrocaloric capacitors through thermally conductive vias in the support layer;
moving the second layer of electrocaloric capacitors in a direction opposite the first direction relative to the first layer of electrocaloric capacitors; and
increasing the second electric field while lowering the first electric field, thereby causing a second heat flux to be transferred from the second electrocaloric capacitors to the first electrocaloric capacitors through the thermally conductive vias.
16 . The method of claim 15 , wherein the moving of the second layer comprises moving according to a linear or rotational motion.
17 . The method of claim 15 , wherein the support layer comprises a thermally insulating material that maintains a low thermal conductance between adjacent capacitors of the first and second layers.
18 . The method of claim 15 , wherein the support layer comprises:
a first support structure proximate the first layer;
a second support structure proximate the second layer; and
a lubricant disposed between the first support structure and the second support structure, and the thermally conductive vias comprise first and second vias through the first and second support structures.
19 . The method of claim 15 , wherein the support layer has low thermal conductivity in a lateral direction, wherein the thermally conductive vias comprise a high thermal conductivity in a vertical direction resulting in thermal conductance between the first and second electrocaloric capacitors through the thermally conductive vias.
20 . The method of claim 19 , wherein the support layer comprises a glass, a polymer, a ceramic or a printed circuit board material, and wherein the thermally conductive vias are filled with metal.