Single-package wireless communication device
A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.
1. A system-in-package transceiver comprising:
a single integrated circuit package that includes:
a first die including a front end module for processing radio frequency signals, configured to couple to an antenna;
a second die including a radio frequency integrated circuit coupled to the front end module and for converting radio frequency signals from the front end module to digital signals; and
a third die including a baseband module coupled to the radio frequency integrated circuit for communicating with an application processor;
wherein the application processor supports at least two standards selected from a group of standards including a personal area network standard, a local area network standard, and a wide area network standard.
2. The system-in-package transceiver of claim 1 , wherein the first die further includes a low noise amplifier.
3. A system comprising:
a system-in-package transceiver that comprises a single integrated circuit package that includes:
a first die including a front end module for processing radio frequency signals, configured to couple to an antenna;
a second die including a radio frequency integrated circuit coupled to the front end module and for converting radio frequency signals from the front end module to digital signals;
a third die including a baseband module coupled to the radio frequency integrated circuit for communicating with an application processor;
wherein the application processor supports at least two standards selected from a group of standards including a personal area network standard, a local area network standard, and a wide area network standard.
4. The system of claim 3 , further comprising:
the application processor coupled to the third die;
a memory coupled to the application processor; and
an input/output interface coupled to the application processor.
5. The system of claim 3 , further comprising a global positioning system coupled to the system-in-package transceiver.
6. The system of claim 4 , wherein the first die, the second die, and the third die comprise three distinct die.
7. The system of claim 5 , wherein the first die, the second die, and the third die comprise three distinct die.
8. The system of claim 3 , wherein the local area network standard comprises a Wi-Fi standard.
9. The system of claim 3 , wherein the wide area network standard comprises a cellular standard.
10. The system of claim 3 , further comprising the antenna coupled to the front end module.
11. The system of claim 3 , wherein the first die includes a low noise amplifier.
12. The system of claim 3 , further comprising a fourth die including a mass storage device coupled to the third die.
13. The system of claim 3 , wherein the first die, the second die, and the third die comprise three distinct die.
14. The system-in-package transceiver of claim 1 , wherein the personal area network standard comprises Bluetooth.
15. The system-in-package transceiver of claim 1 , wherein the local area network standard comprises a Wi-Fi standard.
16. The system-in-package transceiver of claim 1 , wherein the wide area network standard comprises a cellular standard.
17. The system-in-package transceiver of claim 1 , further comprising the antenna coupled to the front end module.
18. The system-in-package transceiver of claim 1 , further comprising a fourth die including a mass storage device coupled to the third die.
19. The system-in-package transceiver of claim 1 , wherein the first die is distinct from the second die and the third die.
20. The system-in-package transceiver of claim 1 , wherein the first die, the second die, and the third die comprise three distinct die.