Antenna filter and electronic device including same in wireless communication system
The disclosure relates to a 5 th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than a 4 th generation (4G) communication system, such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a filter for filtering a radio frequency (RF) signal, and a sub printed circuit board (PCB), the sub-PCB comprises a passive circuit for processing the RF signal, and, the sub-PCB may be coupled to the filter such that the filter operates as a bumper when being coupled to a filter board.
1 . An antenna module comprising:
at least one antenna array including a plurality of antenna elements;
at least one radio frequency (RF) chip;
a board including a plurality of RF components for a plurality of RF paths;
a plurality of ceramic waveguide filters, each of the plurality of ceramic waveguide filters being disposed in a RF path of the plurality of RF paths; and
a plurality of sub-boards functioning as a bumper, each of the plurality of the sub-boards being coupled to a corresponding ceramic waveguide filter,
wherein the each of the plurality of the sub-boards includes, for the corresponding ceramic waveguide filter, an input port and an output port formed of a via, and a low-pass filter (LPF) for filtering an RF signal applied to the input port, and
wherein the plurality of sub-boards are disposed between the plurality of ceramic waveguide filters and the board.
2 . The antenna module of claim 1 ,
wherein the board includes at least one RF component for a beamforming calibration; and
wherein each of the plurality of the sub-boards includes a coupler for beamforming calibration.
3 . The antenna module of claim 2 , wherein each of the plurality of the sub-boards includes a connector for an RF interface.
4 . The antenna module of claim 3 ,
wherein each of the plurality of the sub-boards includes multiple layers.
5 . The antenna module of claim 4 ,
wherein the LPF is mounted on a first layer of the multiple layers,
wherein the coupler is mounted on a second layer of the multiple layers, and
wherein the connector is mounted on a third layer of the multiple layers.
6 . The antenna module of claim 1 , wherein each of the plurality of the sub-boards includes a groove structure for a direct matching connection unit or a blind matching connection unit.