SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.
1 . A system comprising:
a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and
at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink,
wherein the surface of the at least one heat sink includes a layer of thermal interface material.
2 . The system of claim 1 , wherein the power module includes the first interlocking feature on a second surface of the power module, wherein the second surface is separated from the first surface by a width of the power module.
3 . The system of claim 1 , wherein the first interlocking feature is a protruding interlocking feature.
4 . The system of claim 1 , wherein the second interlocking feature is a recessed interlocking feature.
5 . The system of claim 4 , wherein the recessed interlocking feature is a blind cavity.
6 . The system of claim 1 , wherein the layer of thermal interface material includes thermal tapes, gels, thermal epoxies, solders, greases, gap-filled pads, and phase change materials.
7 . The system of claim 2 , wherein the first surface and second surface include an epoxy mold compound or a copper layer.
8 . The system of claim 7 , wherein the first interlocking feature is located on either the epoxy mold compound or the copper layer.
9 . The system of claim 1 , wherein the at least one heat sink includes an inlet port or an outlet port.
10 . The system of claim 4 , wherein the layer of thermal interface material is uniformly extended across the surface between the recessed interlocking features of the at least one heat sink.
11 . A method for aligning a power module and a heat sink, the method comprising:
forming a first interlocking feature on a surface of a power module;
forming a second interlocking feature on a surface of a heat sink;
applying a layer of thermal interface material on the surface of the heat sink or power module; and
mating the first interlocking feature with the second interlocking feature.
12 . The method of claim 11 , wherein forming the second interlocking feature includes machining or laser drilling into the surface of the heat sink.
13 . The method of claim 11 , wherein the first interlocking feature is a protruding interlocking feature.
14 . The method of claim 11 , wherein the second interlocking feature is a recessed interlocking feature.
15 . The method of claim 14 , wherein the layer of thermal interface material is applied uniformly to the surface between the recessed interlocking feature of the heat sink.
16 . The method of claim 11 , further comprising:
conducting finite element analysis to determine ideal locations for both the first interlocking feature and second interlocking feature.
17 . The method of claim 11 , wherein applying the layer of thermal interface material includes using solder paste, silver sinter paste, or a pump to dispense the layer of thermal interface material onto the surface of the heat sink or power module.
18 . The method of claim 16 , wherein applying the layer of thermal interface material includes any suitable pattern such as a dot, serpentine, or spiral.
19 . The method of claim 11 , further comprising:
aligning the heat sink with the power module.
20 . The method of claim 19 , wherein the heat sink and power module are aligned by a deformable washer or spring clamp.