LIGHT EMITTING MODULE
A light emitting module is provided. The light emitting module includes a substrate, light emitting elements, an encapsulant material and dimming structures. The light emitting elements are disposed over the substrate. The encapsulant material covers the light emitting elements and the substrate, and the encapsulant material has an encapsulant height H. The dimming structures are disposed over the encapsulant material or embedded in the encapsulant material. The dimming structures have a maximum dimming thickness h. The encapsulant thickness H and the maximum dimming thickness h satisfy the following relationship: 0.01≤h/H≤1.
1 . A light emitting module, comprising:
a substrate;
light emitting elements disposed over the substrate;
an encapsulant material covering the light emitting elements and the substrate, the encapsulant material having an encapsulant height H; and
dimming structures disposed over the encapsulant material or embedded in the encapsulant material, wherein the dimming structures have a maximum dimming thickness h,
wherein the encapsulant thickness H and the maximum dimming thickness h satisfy the following relationship: 0.01≤h/H≤1.
2 . The light emitting module as claimed in claim 1 , wherein each of the dimming structures is located above one of the light emitting elements.
3 . The light emitting module as claimed in claim 1 , wherein each of the dimming structures has an outer diameter D, and the outer diameter D, the encapsulant thickness H and the maximum dimming thickness h satisfy the following relationship:
0<( H+h )/ D< 1.
4 . The light emitting module as claimed in claim 1 , wherein a spacing P between the neighboring light emitting elements and an outer diameter D of each of the dimming structures satisfy the following relationship: 0<D/P<1.
5 . The light emitting module as claimed in claim 1 , wherein a thickness W of the light emitting elements is smaller than an outer diameter D of the dimming structures.
6 . The light emitting module as claimed in claim 1 , wherein the encapsulant thickness H and the maximum dimming thickness h satisfy the following relationship:
0.1≤ h/H≤ 0.25.
7 . The light emitting module as claimed in claim 1 , wherein a position of the dimming structures with the maximum dimming thickness overlaps the light emitting elements in a normal direction of the substrate.
8 . The light emitting module as claimed in claim 1 , wherein a surface of each of the dimming structures is a curved surface with a gradient slope.
9 . The light emitting module as claimed in claim 8 , wherein a position of a maximum dimming thickness of each of the dimming structures corresponds to a center of the curved surface.
10 . The light emitting module as claimed in claim 8 , wherein a shape of the curved surface fits to a quadratic function: y=ax 2 +bx+c, wherein x is a position in a direction parallel to the substrate, and y is a position in a direction vertical to the substrate, and a<0.
11 . The light emitting module as claimed in claim 10 , wherein an absolute value of a constant term (|c|) of the quadratic function is equal to the maximum dimming thickness h.
12 . The light emitting module as claimed in claim 1 , wherein each of the dimming structures comprises:
a main dimming part having the maximum dimming thickness h; and
a plurality of sub-dimming parts disposed around the main dimming part, and having a smaller thickness than the maximum dimming thickness h.
13 . The light emitting module as claimed in claim 12 , wherein the plurality of sub-dimming parts comprise inner sub-dimming parts in contact with the main dimming part, and the plurality of sub-dimming parts and the main dimming part together form a stepped profile in a cross-sectional view.
14 . The light emitting module as claimed in claim 12 , wherein the plurality of sub-dimming structures comprises outer sub-dimming parts separated from the main dimming part.
15 . The light emitting module as claimed in claim 12 , wherein an outer diameter of the main dimming part is larger than a width of the light emitting elements.
16 . The light emitting module as claimed in claim 1 , wherein a refractive index inside the dimming structures is uniform.
17 . The light emitting module as claimed in claim 1 , wherein the dimming structures comprise a reflective material and a resin material.
18 . The light emitting module as claimed in claim 1 , wherein the light emitting elements comprise multiple light emitting diode chips or multiple chip-scale package light emitting diodes (CSP LEDs).
19 . The light emitting module as claimed in claim 1 , wherein the substrate has integrated circuit chips, and each of the integrated circuit chips controls the light emitting elements.
20 . The light emitting module as claimed in claim 1 , wherein the dimming structures comprises portions with different thicknesses.