Flexible interconnect circuits and methods of fabrication thereof
Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
1. A method of forming a flexible interconnect circuit assembly, the method comprising:
providing a flexible interconnect circuit comprising a first circuit portion and a second circuit portion monolithically integrated with the first circuit portion, wherein:
each of the first circuit portion and the second circuit portion is an elongated structure extending parallel to a primary axis of the flexible interconnect circuit,
each of the first circuit portion and the second circuit portion comprises a first side and a second side opposite to the first side, and
the first side of the first circuit portion and the first side of the second circuit portion face in a same direction;
folding the second circuit portion relative to the first circuit portion such that the second circuit portion is no longer parallel to the primary axis of the flexible interconnect circuit and such that the second side of the first circuit portion and the second side of the second circuit portion face in opposite directions after folding;
attaching a bonding film to the second side of the first circuit portion and the first side of the second circuit portion; and
attaching a temporary support film to the bonding film such that the first side of the first circuit portion and the second side of the second circuit portion face the temporary support film.
2. The method of claim 1 , wherein:
the first circuit portion terminates with a first connector, and
the first connector and a part of the first circuit portion, adjacent to the first connector, extend outside a boundary of the bonding film.
3. The method of claim 2 , wherein the first connector and the part the first circuit portion, adjacent to the first connector, overlap with a boundary of the temporary support film.
4. The method of claim 1 , wherein, before folding, the first circuit portion and the second circuit portion are coplanar.
5. The method of claim 1 , wherein, after folding, a part of the first side of the first circuit portion directly interfaces with a part of the first side of the second circuit portion.
6. The method of claim 1 , wherein:
the first side of the first circuit portion and the first side of the second circuit portion is formed by a first insulating layer, which is monolithic, and
the second side of the first circuit portion and the second side of the second circuit portion is formed by a second insulating layer, which is monolithic and bonded to the first insulating layer.
7. The method of claim 6 , wherein each of the first circuit portion and the second circuit portion comprises one or more conductive traces, positioned between the first insulating layer and the second insulating layer such that the first insulating layer and the second insulating layer are bonded together around the one or more conductive traces.
8. The method of claim 7 , wherein providing the flexible interconnect circuit comprises forming the one or more conductive traces of the first circuit portion and the second circuit portion by patterning a metal foil.
9. The method of claim 6 , wherein:
the first circuit portion and the second circuit portion form a primary circuit portion,
the flexible interconnect circuit comprises support tabs, each formed by at least the first insulating layer and the second insulating layer and extending from an edge of the primary circuit portion and monolithic with the primary circuit portion, and
each of the support tabs comprises a support-tab opening for receiving a fastener when securing the flexible interconnect circuit.
10. The method of claim 9 , wherein:
the flexible interconnect circuit comprises conductive traces and a support component, which are formed from same conductive materials and have same thicknesses,
the conductive traces are at least partially positioned between the first insulating layer and the second insulating layer in the primary circuit portion, and
the support component is at least partially positioned between the first insulating layer and the second insulating layer in the support tabs and is used to reinforce the support tabs providing additional strength.
11. The method of claim 10 , wherein the support component is electrically isolated from each of the conductive traces.
12. The method of claim 10 , wherein the support component is monolithic with at least one of the conductive traces.
13. The method of claim 10 , wherein:
the second insulating layer comprises a second-insulator opening that is larger and concentric with the support-tab opening, and
the second insulating layer at least partially exposes the support component.
14. The method of claim 1 , wherein the first circuit portion and the second circuit portion, extending parallel to each other, are separated by a slit.
15. The method of claim 1 , further comprising arranging the flexible interconnect circuit into a shipping configuration selected from the group consisting of a planar sheet and a roll, wherein the roll comprises additional flexible interconnect circuits.
16. A flexible interconnect circuit assembly comprising:
a flexible interconnect circuit comprising a first circuit portion and a second circuit portion monolithically integrated with the first circuit portion, wherein:
each of the first circuit portion and the second circuit portion comprises a first side and a second side opposite the first side,
the first side of the first circuit portion and the first side of the second circuit portion is formed by a first insulating layer,
the second side of the first circuit portion and the second side of the second circuit portion is formed by a second insulating layer, bonded to the first insulating layer, and
the second circuit portion is folded relative to the first circuit portion such that the second circuit portion is not parallel to the first circuit portion and such that the first side of the first circuit portion and the first side of the second circuit portion face in opposite directions;
a bonding film attached to the second side of the first circuit portion and the first side of the second circuit portion; and
a temporary support film attached to the bonding film such that the first side of the first circuit portion and the second side of the second circuit portion faces the temporary support film.
17. The flexible interconnect circuit assembly of claim 16 , wherein:
the first circuit portion terminates with a first connector, and
the first connector and a part of the first circuit portion, adjacent to the first connector, extend outside a boundary of the bonding film.
18. The flexible interconnect circuit assembly of claim 17 , wherein the first connector and the portion of the first circuit portion, adjacent to the first connector, overlap with a boundary of the temporary support film.
19. The flexible interconnect circuit assembly of claim 16 , wherein:
the first insulating layer is monolithic, and
the second insulating layer is monolithic.
20. The flexible interconnect circuit assembly of claim 16 , wherein each of the first circuit portion and the second circuit portion comprises one or more conductive traces, positioned between the first insulating layer and the second insulating layer such that the first insulating layer and the second insulating layer are bonded together around the one or more conductive traces.