Semiconductor lasers and processes for the planarization of semiconductor lasers
A laser structure may include a substrate, an active region arranged on the substrate, and a waveguide arranged on the active region. The waveguide may include a first surface and a second surface that join to form a first angle relative to the active region. A material may be deposited on the first surface and the second surface of the waveguide.
1. A laser structure, comprising:
a substrate;
an active region over the substrate;
a semiconductor layer over the active region, the semiconductor layer comprising a dovetail waveguide, the dovetail waveguide comprising a central top waveguide surface;
a metal layer extending over the semiconductor layer and contacting the central top waveguide surface a first air gap under the metal layer at a first side of the dovetail waveguide and a second air gap under the metal layer at a second side of the dovetail waveguide; and
an insulating layer over the semiconductor layer, under the metal layer, under the first air gap at the first side of the dovetail waveguide, and under the second air gap at the second side of the dovetail waveguide.
2. The laser structure of claim 1 , wherein the metal layer comprises a bridge over the first air gap and the second air gap.
3. The laser structure of claim 1 , wherein:
the semiconductor layer comprises a first side surface, a second side surface, a top surface, and a lower surface; and
the dovetail waveguide is positioned between the first side surface and the second side surface of the semiconductor layer.
4. The laser structure of claim 3 , wherein the dovetail waveguide comprises a first waveguide side surface, a second waveguide side surface, and the central top waveguide surface.
5. The laser structure of claim 4 , wherein:
the first waveguide side surface joins the lower surface of the semiconductor layer at a first angle; and
the second waveguide side surface joins the lower surface of the semiconductor layer at a second angle.
6. The laser structure of claim 5 , wherein:
the first angle is less than ninety degrees; and
the second angle is less than ninety degrees.
7. The laser structure of claim 1 , wherein the insulating layer is on the semiconductor layer and under the metal layer.
8. The laser structure of claim 1 , wherein the insulating layer comprises SiO 2 .
9. The laser structure of claim 1 , insulating layer wherein:
the insulating layer comprises an opening at the central top waveguide surface of the dovetail waveguide; and
the metal layer contacts the central top waveguide surface of the dovetail waveguide through the opening.
10. The laser structure of claim 1 , wherein:
the semiconductor layer comprises a first side surface, a second side surface, a top surface, and a lower surface;
the dovetail waveguide is positioned between the first side surface and the second side surface of the semiconductor layer;
the dovetail waveguide comprises a first waveguide side surface, a second waveguide side surface, and the central top waveguide surface; and
the insulating layer is on the first side surface, the second side surface, the top surface, and the lower surface of the semiconductor layer and is on the first waveguide side surface, the second waveguide side surface, and at least a portion of the central top waveguide surface of the dovetail waveguide.
11. The laser structure of claim 10 , wherein:
the insulating layer comprises an opening at the central top waveguide surface of the dovetail waveguide; and
the metal layer contacts the central top waveguide surface of the dovetail waveguide through the opening.
12. The laser structure of claim 1 , further comprising a bond pad, wherein the metal layer is electrically connected between the bond pad and the central top waveguide surface of the dovetail waveguide.
13. A laser structure, comprising:
a substrate;
an active region over the substrate;
a semiconductor layer over the active region, the semiconductor layer comprising a waveguide, the waveguide comprising a central top waveguide surface;
a metal layer extending over the semiconductor layer and contacting the central top waveguide surface a first air gap under the metal layer at a first side of the waveguide and a second air gap under the metal layer at a second side of the waveguide; and
an insulating layer over the semiconductor layer, under the metal layer, under the first air gap at the first side of the waveguide, and under the second air gap at the second side of the waveguide.
14. The laser structure of claim 13 , wherein the metal layer comprises a bridge over the first air gap and the second air gap.
15. The laser structure of claim 13 , wherein:
the waveguide comprises a dovetail waveguide;
the semiconductor layer comprises a first side surface, a second side surface, a top surface, and a lower surface; and
the dovetail waveguide is positioned between the first side surface and the second side surface of the semiconductor layer.
16. The laser structure of claim 15 , wherein the dovetail waveguide comprises a first waveguide side surface, a second waveguide side surface, and the central top waveguide surface.
17. The laser structure of claim 16 , wherein:
the first waveguide side surface joins the lower surface of the semiconductor layer at a first angle;
the second waveguide side surface joins the lower surface of the semiconductor layer at a second angle;
the first angle is less than ninety degrees; and
the second angle is less than ninety degrees.
18. The laser structure of claim 13 , wherein the insulating layer is on the semiconductor layer and under the metal layer.
19. The laser structure of claim 13 ,
wherein:
the insulating layer comprises an opening at the central top waveguide surface of the waveguide; and
the metal layer contacts the central top waveguide surface of the waveguide through the opening.
20. The laser structure of claim 13 , wherein:
the semiconductor layer comprises a first side surface, a second side surface, a top surface, and a lower surface;
the waveguide is positioned between the first side surface and the second side surface of the semiconductor layer;
the waveguide comprises a first waveguide side surface, a second waveguide side surface, and the central top waveguide surface; and
the insulating layer is on the first side surface, the second side surface, the top surface, and the lower surface of the semiconductor layer and is on the first waveguide side surface, the second waveguide side surface, and at least a portion of the central top waveguide surface of the waveguide.