Light-emitting device, manufacturing method thereof and display module using the same
A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. An edge of the upper portion is protruded beyond the neck portion, and an edge of the lower portion is protruded beyond the upper portion.
1. A light-emitting module, comprising:
a carrier, comprising a first electrically conductive region and a second electrically conductive region;
a first light-emitting element which has failed to operate or meet a required performance, and comprises a first contact electrode and a first top surface;
a solder, arranged between the first electrically conductive region and the first contact electrode;
a second light-emitting element, comprising a second contact electrode and a second top surface; and
a connection structure, comprising a first electrical connection portion electrically connecting the second contact electrode and the second electrically conductive region, and a protective portion surrounding the second contact electrode and the first electrical connection portion,
wherein the protective portion does not cover the first top surface and the second top surface,
wherein the first electrical connection portion comprises an upper portion, a lower portion, and a neck portion between the upper portion and the lower portion, and the neck portion has a width which is smaller than those of the upper portion and the lower portion,
wherein the upper portion, the neck portion, and the lower portion comprise gold element, and
wherein the gold element in the upper portion has an atomic percentage larger than that of the gold element in the lower portion.
2. The light-emitting module of claim 1 , wherein the first electrical connection portion and the solder have different shapes.
3. The light-emitting module of claim 1 , wherein the first electrical connection portion and the solder have different materials.
4. The light-emitting module of claim 1 , wherein the second light-emitting element comprises a third contact electrode electrically connected to the second electrically conductive region.
5. The light-emitting module of claim 4 , wherein the protective portion has a portion between the second contact electrode and the third contact electrode.
6. The light-emitting module of claim 1 , wherein the second light-emitting element has an outermost surface which is not covered by the protective portion.
7. The light-emitting module of claim 1 , wherein the protective portion comprises thermosetting polymer.
8. The light-emitting module of claim 1 , wherein the first electrical connection portion comprises a hole.
9. The light-emitting module of claim 1 , wherein the protective portion does not contact the first light-emitting element.
10. The light-emitting module of claim 1 , wherein the first electrical connection portion and the solder have different shapes.
11. The light-emitting module of claim 1 , wherein the first electrical connection portion and the solder have different materials.
12. The light-emitting module of claim 1 , wherein the second light-emitting element comprises a third contact electrode electrically connected to the second electrically conductive region.
13. The light-emitting module of claim 12 , wherein the protective portion has a portion between the second contact electrode and the third contact electrode.
14. The light-emitting module of claim 1 , wherein the second light-emitting element has an outermost surface which is not covered by the protective portion.
15. The light-emitting module of claim 1 , wherein the protective portion comprises thermosetting polymer.
16. The light-emitting module of claim 1 , wherein the first electrical connection portion comprises a hole.
17. The light-emitting module of claim 1 , wherein the protective portion does not contact the first light-emitting element.
18. A light-emitting module, comprising:
a carrier, comprising a first electrically conductive region and a second electrically conductive region;
a first light-emitting element which has failed to operate or meet a required performance, and comprises a first contact electrode and a first top surface;
a solder, arranged between the first electrically conductive region and the first contact electrode;
a second light-emitting element, comprising a second contact electrode and a second top surface; and
a connection structure, comprising a first electrical connection portion electrically connecting the second contact electrode and the second electrically conductive region, and a protective portion surrounding the second contact electrode and the first electrical connection portion,
wherein the protective portion does not cover the first top surface and the second top surface,
wherein the first electrical connection portion comprises an upper portion, a lower portion, and a neck portion between the upper portion and the lower portion, and the neck portion has a width which is smaller than those of the upper portion and the lower portion, and
wherein the upper portion, the neck portion, and the lower portion comprise tin element.