METHOD OF MANUFACTURING DISPLAY DEVICE AND MOTHER SUBSTRATE

1 . A method of manufacturing a display device, comprising:

forming a partition including a lower portion disposed on a first surface of a base and an upper portion protruding from a side surface of the lower portion; and

measuring a distance between a side surface of the lower portion and an end portion of the upper portion from a side of a second surface opposing the first surface of the base.

2 . The method of claim 1 , wherein,

the base includes a plurality of panel regions in which display panels are formed and a peripheral region that compartmentalizes the plurality of panel regions,

the partition is formed in both the plurality of panel regions and the peripheral region, and

the measuring is carried out by capturing an image of the partition formed in the peripheral region from a side of the second surface with a length-measuring machine camera.

3 . The method of claim 2 further comprising:

forming a first insulating layer on a first surface of the base prior to the forming of the partition; and

forming a circuit layer including a pixel circuit that drives a pixel on the first insulating layer, forming a second insulating layer on the circuit layer, forming a lower electrode at a position overlapping the pixel on the second insulating layer, and forming a rib covering a part of the lower electrode and compartmentalizing the pixel, in the plurality of panel regions, wherein

the forming of the partition includes forming the partition on the rib in the plurality of panel regions and on a first surface of the base in the peripheral region.

4 . The method of claim 2 , wherein

in the plurality of panel regions, the partition is formed in a pattern that compartmentalizes the pixel,

in the peripheral region, the partition is formed in a pattern identical to that of the partition formed in the plurality of panel regions.

5 . The method of claim 3 , wherein

in the peripheral region, at least one of the first insulating layer, the second insulating layer and the rib is formed between the base and the partition.

6 . The method of claim 3 further comprising:

forming an organic layer on the lower electrode after the measuring;

forming an upper electrode on the organic layer;

forming a cap layer on the upper electrode;

forming a sealing layer on the cap layer;

forming a resist on the sealing layer; and

removing the sealing layer, the cap layer, the upper electrode and the organic layer using the resist as a mask.

7 . The method of claim 1 , wherein

the partition is formed by carrying out isotropic wet etching after carrying out anisotropic dry etching.

8 . The method of claim 1 , wherein

the upper portion of the partition is formed of a light-shielding material.

9 . A mother substrate comprising:

a base including a plurality of panel regions in which display panels are formed and a peripheral region that compartmentalizes the plurality of panel regions;

a first insulating layer disposed on a first surface of the base;

a circuit layer disposed on the first insulating layer and including a pixel circuit configured to drive a pixel in the plurality of panel regions;

a second insulating layer disposed on the circuit layer;

a lower electrode disposed at a position overlapping the pixel on the second insulating layer; and

a rib covering a part of the lower electrode and compartmentalizing the pixel; and

a partition disposed on the rib in the plurality of panel regions and in the peripheral region,

the partition including a lower portion and an upper portion protruding from a side surface of the lower portion.

10 . The mother substrate of claim 9 , wherein

the partition in the plurality of panel regions is disposed in a pattern that compartmentalizes the pixel, and

the partition in the peripheral region is disposed in a pattern identical to that of the partition in the plurality of panel regions.

11 . The mother substrate of claim 10 , wherein

a protrusion amount of the upper portion of the partition in the plurality of panel regions is equivalent to a protrusion amount of the upper portion of the partition in the peripheral region.

12 . The mother substrate of claim 9 , wherein

at least one of the first insulating layer, the second insulating layer and the rib is disposed between the base and the partition in the peripheral region.

13 . The mother board of claim 9 , wherein

the upper portion of the partition is formed of a light-shielding material.

14 . The mother substrate of claim 9 further comprising:

an organic layer disposed on the lower electrode; an upper electrode disposed on the organic layer and in

contact with the lower portion of the partition; a cap layer disposed on the upper electrode; and

an sealing layer disposed on the cap layer.