MANUFACTURING METHOD OF DISPLAY DEVICE

1 . A manufacturing method of a display device, comprising:

forming a first display element on a substrate, the first display element including a first lower electrode, a first upper electrode and a first organic layer located between the first lower electrode and the first upper electrode;

forming a first sealing layer which covers the first display element;

forming a first resist on the first sealing layer; and

removing, of the first sealing layer and the first display element, a portion exposed from the first resist by a first patterning process including washing of the substrate with a cleaning liquid containing water.

2 . The manufacturing method of claim 1 , wherein

the cleaning liquid is pure water.

3 . The manufacturing method of claim 1 , wherein

the first patterning process includes:

removing, of the first sealing layer, a portion exposed from the first resist by dry etching; and

washing the substrate using the cleaning liquid after the dry etching.

4 . The manufacturing method of claim 3 , wherein

the first patterning process further includes removing, of the first upper electrode, a portion exposed from the first sealing layer after the dry etching by etching, and

after the dry etching for the first sealing layer, the washing with the cleaning liquid is performed before the etching for the first upper electrode.

5 . The manufacturing method of claim 3 , wherein

the first display element further includes a first cap layer which is provided between the first upper electrode and the first sealing layer and which adjusts an optical property of the first display element,

the first patterning process further includes removing, of the first cap layer, a portion exposed from the first sealing layer after the dry etching by etching, and

after the dry etching for the first sealing layer, the washing with the cleaning liquid is performed before the etching for the first cap layer.

6 . The manufacturing method of claim 3 , further comprising:

forming a partition on the substrate before forming the first display element, the partition including a conductive lower portion and an upper portion which protrudes from a side surface of the lower portion.

7 . The manufacturing method of claim 6 , wherein

a part of the side surface of the lower portion is washed by the cleaning liquid.

8 . The manufacturing method of claim 6 , wherein

an etching gas containing fluorine is used for the dry etching for the first sealing layer, and

the lower portion contains aluminum.

9 . The manufacturing method of claim 1 , further comprising:

forming a second display element on the substrate after the first patterning process, the second display element including a second lower electrode, a second upper electrode and a second organic layer located between the second lower electrode and the second upper electrode;

forming a second sealing layer which covers the second display element;

forming a second resist on the second sealing layer; and

removing, of the second sealing layer and the second display element, a portion exposed from the second resist by a second patterning process including washing of the substrate with the cleaning liquid.

10 . The manufacturing method of claim 9 , further comprising:

forming a third display element on the substrate after the second patterning process, the third display element including a third lower electrode, a third upper electrode and a third organic layer located between the third lower electrode and the third upper electrode;

forming a third sealing layer which covers the third display element;

forming a third resist on the third sealing layer; and

removing, of the third sealing layer and the third display element, a portion exposed from the third resist by a third patterning process including washing of the substrate with the cleaning liquid.