EMITTER ASSEMBLY WITH LOCKING PINS
In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip, and a conductive pillar, of the plurality of conductive pillars, may have a solder cap at an end of the conductive pillar. The emitter assembly may include a pin extending into the solder cap.
1 . An emitter assembly, comprising:
a vertical cavity surface emitting laser (VCSEL) chip comprising a plurality of VCSELs;
a plurality of conductive pillars electrically connected to the VCSEL chip,
wherein a conductive pillar, of the plurality of conductive pillars, has a solder cap at an end of the conductive pillar; and
a pin extending into the solder cap.
2 . The emitter assembly of claim 1 , wherein the pin extends from the VCSEL chip into the solder cap.
3 . The emitter assembly of claim 1 , wherein the pin is electrically connected to an electrical contact associated with a VCSEL of the plurality of VCSELs.
4 . The emitter assembly of claim 1 , further comprising:
a carrier,
wherein the plurality of conductive pillars electrically connect the VCSEL chip and the carrier.
5 . The emitter assembly of claim 4 , wherein the pin extends from the carrier into the solder cap.
6 . The emitter assembly of claim 1 , wherein the pin is electrically connected to the conductive pillar and to the VCSEL chip.
7 . The emitter assembly of claim 1 , wherein the pin is one of multiple pins, and
wherein a first quantity of the multiple pins corresponds to a second quantity of the plurality of VCSELs.
8 . The emitter assembly of claim 1 , wherein the pin is one of multiple pins, and
wherein a first quantity of the multiple pins is less than a second quantity of the plurality of VCSELs.
9 . The emitter assembly of claim 1 , wherein each of the plurality of conductive pillars has a maximum diameter less than 25 micrometers.
10 . An emitter assembly, comprising:
a vertical cavity surface emitting laser (VCSEL) chip comprising a plurality of VCSELs in a bottom-emitting configuration,
wherein the plurality of VCSELs are respectively associated with a plurality of first electrical contacts;
a carrier having a plurality of second electrical contacts,
wherein the VCSEL chip is in a flip chip configuration with the carrier;
a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts,
wherein a conductive pillar, of the plurality of conductive pillars, has a solder cap at an end of the conductive pillar; and
a pin extending from one of the VCSEL chip or the carrier into the solder cap.
11 . The emitter assembly of claim 10 , wherein the carrier comprises an integrated circuit chip or a substrate.
12 . The emitter assembly of claim 10 , wherein the plurality of conductive pillars extend from the VCSEL chip to the carrier, and
wherein the pin extends from the carrier.
13 . The emitter assembly of claim 10 , wherein the plurality of conductive pillars extend from the carrier to the VCSEL chip, and
wherein the pin extends from the VCSEL chip.
14 . The emitter assembly of claim 10 , wherein the pin is electrically connected to an electrical contact, of the plurality of first electrical contacts, associated with a VCSEL of the plurality of VCSELs.
15 . The emitter assembly of claim 10 , wherein the pin is electrically connected to the conductive pillar, to the VCSEL chip, and to the carrier.
16 . The emitter assembly of claim 10 , wherein the carrier comprises a surface layer and a base layer, and
wherein the surface layer comprises a redistribution layer configured to decrease a pitch of the plurality of second electrical contacts.
17 . The emitter assembly of claim 10 , wherein a spacing of the plurality of first electrical contacts defines a pitch that is less than 45 micrometers.
18 . A method, comprising:
assembling a vertical cavity surface emitting laser (VCSEL) chip in a flip chip configuration with a carrier to produce an emitter assembly,
wherein a plurality of conductive pillars electrically connect the VCSEL chip and the carrier,
wherein a conductive pillar, of the plurality of conductive pillars, has a solder cap at an end of the conductive pillar, and
wherein one of the VCSEL chip or the carrier comprises a pin for the solder cap; and
performing a solder reflow procedure on the emitter assembly.
19 . The method of claim 18 , wherein assembling the VCSEL chip in the flip chip configuration with the carrier comprises:
heating the solder cap below a melting point of the solder cap; and
tacking the pin into the solder cap.
20 . The method of claim 18 , further comprising:
applying solder flux on the carrier prior to assembling the VCSEL chip in the flip chip configuration with the carrier.