Elongated modular heat sink with coupled light source
An elongated modular heat sink array having through power and/or data flowing from end to end powering and/or communicating with externally mounted coupled electronic devices.
1. An elongated heatsink array comprising:
a first heatsink module and a second heat sink module that are members of an array of heat sink modules and each is unitarily fabricated and displays a solid heatsink core with a longitudinal opening extending from end to end with at least one conductor extending inside from end to end, ends of the at least one conductor couple to a connector that couples to a reciprocating connector disposed on a surface of a device receptacle;
a joiner that aligns and secures the first heatsink module and the second heatsink module;
the device receptacle which is coupled to the joiner and configured to convey at least a portion of power from the first heatsink module to the second heatsink module;
a power supply coupled to a power line source;
a support structure includes a harness and/or a housing and is supported from a structure above, the support housing of the support structure retains the power supply, and at least one of the first heatsink module and the joiner are distally supported mechanically from above by the support structure; and
a power conductor is coupled to the power supply and also coupled to at least one distally located receptacle disposed on a surface of the device receptacle, wherein
a portion of power that enters the first heatsink module is conveyed through the device receptacle to the power supply and the power supply provides power to at least one power consuming device coupled to at least one of the first heatsink module, the second heatsink module or a device receptacle, and
another portion of the power that enters the first heatsink module continues through the device receptacle to at least the second heat sink module.
2. The heatsink array of claim 1 further comprising the at least one power consuming device, the at least one power consuming device is a different device than a light source.
3. The heatsink array of claim 1 wherein the portion of power being at least one of low voltage power and line voltage power.
4. The heatsink array of claim 1 wherein at least one of the harness and the housing of the support structure are suspended from a structure above.
5. The heatsink array of claim 1 further comprising:
a detachable conductor that couples the power supply to the device receptacle.
6. The heatsink array of claim 1 further comprising:
a mechanical fastener that secures against the heatsink array from mechanical disengagement and/or breaking of electrical connectivity.
7. The heatsink array of claim 1 wherein the support structure retains at least one electronic device other than the power supply.
8. The heatsink array of claim 7 , further comprising a device coupled to the support structure that is communicatively coupled to at least one of another device retained by the support structure, a device coupled to the first heatsink module, the joiner and/or the device receptacle, and a remote device.
9. An elongated heatsink array comprising:
a first heatsink module and a second heat sink module that are members of an array of heat sink modules and each have a longitudinal opening at a core thereof that retains an electrical conductor therein;
a light source that is covered by a light redirecting optical lens is coupled to at least one exterior surface of the first heatsink module and/or the second heatsink module;
a joiner that aligns and secures the first heatsink module and the second heatsink module;
a device receptacle retained inside the joiner is configured to electrically couple the first heatsink module to the second heatsink module, the device receptacle receives electrical power from the first heatsink module and conveys the electrical power through the device receptacle to at least one of a power supply that is distal to the heatsink module array and the second heatsink module;
a support structure includes a harness and a housing and is supported from a structure above, and at least one of the first heatsink module and the joiner are distally supported mechanically from above by the support structure, and the support structure mechanically supports the heatsink module array;
the power supply is coupled to the support structure, wherein
the electrical conductor is coupled to at least one electric device that is coupled to the support structure and provides electricity to a power consuming device coupled to one of the first heatsink module, the second heatsink module and the device receptacle, the electricity being at least one of power and an electrical signal.
10. The elongated heatsink module array of claim 9 , wherein a light redirecting property of the light redirecting optical lens over the light source is substitutable to account for at least one of a mounting height of the heatsink module array, a light source light output, and an area that the heatsink array is configured to illuminate.
11. The elongated heatsink module array of claim 9 wherein the joiner is configured to couple at least one of a linear heatsink module array and a nonlinear heatsink module array.
12. The elongated heatsink module array of claim 11 , wherein a shape of the joiner is one of an (I), (L), (T), and (cross) type.
13. The elongated heatsink module array of claim 9 , wherein the support structure retains at least one other power consuming device other than the power supply.
14. The elongated heatsink module array of claim 13 , wherein the at least one other power consuming device other than a light source is coupled to the array of heat sink modules.
15. The elongated heatsink module array of claim 9 , further comprising at least one of a detachable mechanical support and a detachable electrical conductor that couples the support structure to the heatsink module array.
16. An elongated heatsink module array comprising:
a first heatsink module and a second heat sink module that are members of an array of heat sink modules and each have a longitudinal opening at a core thereof that retain an electrical conductor therein;
a light source that is covered by a light redirecting optical lens is coupled to at least one exterior surface of the one first heatsink module and/or the second heatsink module;
a joiner that aligns and secures the first heatsink module and the second heatsink module;
a device receptacle retained inside the joiner is configured to electrically couple the first heatsink module to the second heatsink module, the device receptacle receives electrical power from the first heatsink module and conveys the electrical power through the device receptacle to an electric device distal to the heatsink array, the electric device is disposed above the heatsink array with a vertical axis thereof substantially aligned with the device receptacle that is below;
the electrical conductor is coupled to at least one electric device that is coupled to the support structure and provides electricity to the electric device coupled to one of the first heatsink module, the second heatsink module and the device receptacle, the electricity being at least one of power and an electrical signal, wherein
the device receptacle conveys the electricity to up to four heatsink modules, each having at least one power consuming device coupled thereto.
17. The elongated heatsink module array of claim 16 , further comprising a fastener in the joiner that secures the first heatsink module in place.
18. The elongated heatsink module array of claim 16 , further comprising a fastener that secures the device receptacle to the joiner.
19. The elongated heatsink module array of claim 16 , wherein the joiner comprises at least one of a metallic material, a non-metallic material, or a combination thereof.
20. The elongated heatsink module array of claim 16 , further comprising a current limiter disposed inside the joiner that couples to the device receptacle of the first heatsink module.
21. A method of distributing power and dissipating heat comprising:
distributing power to a plurality of power consuming devices using the elongated heatsink module array of claim 1 .
22. A method of distributing power and dissipating heat comprising:
distributing power to a plurality of power consuming devices using the elongated heatsink module array of claim 9 .
23. A method of distributing power and dissipating heat comprising:
distributing power to a plurality of power consuming devices using the elongated heatsink module array of claim 16 .