MICRO PACKAGE STRUCTURE
A micro package structure includes a micro LED panel comprising an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate, the IC substrate comprising a first connected area corresponding to the micro LED array area and a second connected area away from the first connected area, a plurality of signal metal pads are formed on the second connected area; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and one or more bonding wires to connect the signal metal pads with an external circuit.
1 . A micro package structure, comprising:
a micro LED panel comprising an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate, the IC substrate comprising a first connected area corresponding to the micro LED array area and a second connected area away from the first connected area, a plurality of signal metal pads are formed on the second connected area;
a top cover plane formed above the micro LED panel, wherein light emitted from the micro LED array area is transmitted upward to the top cover plane; and
one or more bonding wires to connect the signal metal pads with an external circuit.
2 . The micro package structure according to claim 1 , wherein the signal metal pads comprise a plurality of IO (input/output) metal pads and a plurality of dummy metal pads; and all of the IO metal pads and at least some of the dummy metal pads are formed on the second connected area.
3 . The micro package structure according to claim 2 , wherein all of the dummy metal pads are formed on the second connected area.
4 . The micro package structure according to claim 1 , wherein the micro LED array area comprises a plurality of micro LEDs; and the IC substrate comprises:
a plurality of first metal connected holes connecting the plurality of micro LEDs and the IC substrate, and
a plurality of second metal connected holes connecting to the plurality of signal metal pads.
5 . The micro package structure according to claim 1 , further comprising a protective layer formed on a surface of the second connected area and covering around a surface of the one or more bonding wires.
6 . The micro package structure according to claim 5 , further comprising an external circuit plane formed at a bottom of the micro LED panel with an extruded part extending outside of the micro LED panel.
7 . The micro package structure according to claim 6 , wherein the protective layer is further formed on a surface of the extruded part.
8 . The micro package structure according to claim 6 , further comprising a support base plane formed at a bottom of the external circuit plane.
9 . The micro package structure according to claim 8 , wherein the support base plane is rigid.
10 . The micro package structure according to claim 5 , further comprising an external circuit plane formed extending outside of a bottom of the micro LED panel.
11 . The micro package structure according to claim 10 , wherein the protective layer is further formed on a part of the external circuit plane.
12 . The micro package structure according to claim 4 , further comprising a support base plane formed at a bottom surface of the micro LED panel.
13 . The micro package structure according to claim 12 , wherein the support base plane is rigid.
14 . The micro package structure according to claim 5 , wherein a top of the protective layer is lower than a top of the top cover plane.
15 . The micro package structure according to claim 14 , wherein the top of the protective layer is lower than a top of the micro LED array area.
16 . The micro package structure according to claim 5 , wherein a material of the protective layer comprises a resin and a polymer.
17 . The micro package structure according to claim 16 , wherein the resin is epoxy resin and the polymer is silicone.
18 . The micro package structure according to claim 4 , wherein the top cover plane is transparent.
19 . The micro package structure according to claim 18 , wherein a material of the top cover plane is organic glass or inorganic glass.
20 . The micro package structure according to claim 18 , wherein a thickness of the top cover plane is not greater than a thickness of the micro LED panel.