THERMALLY INKJETTABLE ACRYLIC DIELECTRIC INK FORMULATION AND PROCESS
An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.
1 . An aqueous composition comprising:
from about 5 to about 20 percent by weight of a dispersion of a polymeric binder;
from about 5 to about 30 percent by weight of a humectant;
from about 0.3 to about 3 percent by weight of a surfactant; and
an aqueous carrier fluid, wherein the dielectric layer has an average dielectric constant at 1 MHz of 3.44 to 4.12,
wherein the aqueous composition further comprises one or more additives that include at least BaTiO3, SrTiO3, Mg2TiO4, Bi2(TiO3)3, PbTiO3, NiTiO3, CaTiO3, ZnTiO3, Zn2TiO4, BaSnO3, Bi(SnO3)3, CaSnO3, PhSnO3, PbMgNbO3, MgSnO3, SrSnO3, ZnSnO3, BaZrO3, CaZrO3, PhZrO3, MgZnO3, SrZrO3, or ZnZrO3.
2 . The aqueous composition of claim 1 , wherein the humectant comprises propylene glycol.
3 . The aqueous composition of claim 1 , wherein the humectant has a boiling point below about 200° C.
4 . The aqueous composition of claim 1 , wherein the surfactant comprises at least one non-ionic surfactant.
5 . The aqueous composition of claim 1 , wherein the aqueous composition has a surface tension ranging from about 25 dynes/cm to about 55 dynes/cm.
6 . The aqueous composition of claim 1 , further comprising metal oxide particles dispersed in the aqueous composition.
7 . The aqueous composition of claim 1 , wherein the aqueous composition further comprises one or more additives selected from the group consisting of: TiO 2 and cerium oxide.
8 . The aqueous composition of claim 1 , wherein the aqueous composition further comprises one or more additives, wherein the additives are aluminum metal oxide, zinc metal oxide, titanium metal oxide or zirconium metal oxide.
9 . The aqueous composition of claim 1 , wherein the polymeric binder has a glass transition temperature of 50° C. to 100° C.
10 . The aqueous composition of claim 1 , wherein the aqueous composition has a viscosity ranging from about 2 to about 6 centipoise.
11 . A method of reducing silver migration between adjacent silver layers of a micro-electronic circuit comprising:
forming a dielectric layer, the step of forming a dielectric layer comprising:
micro-fluid jet printing onto a substrate an aqueous film forming composition comprising:
from about 5 to about 20 percent by weight of a dispersion of a polymeric binder emulsion;
from about 10 to about 30 percent by weight of a humectant;
from about 0 to about 3 percent by weight of a surfactant; and
an aqueous carrier fluid to provide a dielectric film layer, wherein the aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.; and
curing the dielectric film layer on the substrate to provide the dielectric layer; and
disposing the dielectric layer between the adjacent silver layers.
12 . The method of claim 11 , wherein the film layer made with the aqueous composition has a glass transition temperature ranging from about 40° to about 110° C.
13 . The method of claim 11 , wherein the humectant comprises a compound selected from the group consisting of dipropylene glycol, tripropylene glycol, triethylene glycol, tetraethylene glycol, 1-(2-hydroxyethyl)-2-pyrrolidone, trimethyolpropane, 1,2-propanediol, 1,3-propanediol, 1,5-pentanediol, 2-pyrrolidone, polyethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, 2,2-thiodiethanol, and mixtures thereof.
14 . The method of claim 11 , wherein the surfactant comprises at least one non-ionic surfactant.
15 . The method of claim 11 , wherein the polymeric binder emulsion is selected from the group consisting of polyacrylate binder emulsions, epoxy binder emulsions, shellac binder emulsions, and isocyanate binder emulsions.
16 . The method of claim 11 , wherein the dielectric film layer is cured with heat to raise the temperature of the film layer to above a glass transition temperature and below a decomposition temperature for the film layer.
17 . The method of claim 11 , wherein the substrate comprises a fluid composition receiving layer onto which the film forming composition is printed.
18 . The method of claim 11 , wherein the micro-fluid jet printing and curing steps were repeated from about 2 to about 20 times to provide the dielectric layer, further comprising curing the dielectric layer with a final cure step.