Direct-bonded LED arrays drivers
Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer. The process provides a transparent and flexible micro-LED array display, with each micro-LED structure having an illumination area approximately the size of a pixel or a smallest controllable element of an image represented on a high-resolution video display.
1. A bonded apparatus comprising:
a light emitting diode (LED) array comprising a plurality of LED elements, wherein the LED array is configured to emit light from a first side of the LED array;
one or more first optical elements integrated over the first side of the LED array, wherein the one or more first optical elements are configured to transmit light from the plurality of LED elements; and
a driver circuit direct bonded to a second side of the LED array, wherein the second side of the LED array is opposite to the first side of the LED array, wherein a dielectric region of the LED array is directly bonded to a dielectric region of the driver circuit and metal regions of the LED array are directly bonded to metal regions of the driver circuit.
2. The apparatus of claim 1 , wherein the one or more first optical elements comprise a waveguide.
3. The apparatus of claim 1 , wherein the one or more first optical elements comprise a diffractive optical element.
4. The apparatus of claim 1 , wherein the one or more first optical elements comprise a beam splitter.
5. The apparatus of claim 1 , wherein the one or more first optical elements comprise at least one of a beam steering element or a beam shaping element.
6. The apparatus of claim 1 , further comprising a transparent substrate direct bonded to the first side of the LED array and positioned between the LED array and the one or more first optical elements.
7. The apparatus of claim 1 , further comprising one or more second optical elements integrated on one or more sides of the LED array and the driver circuit, wherein the one or more sides are orthogonal to both the first side of the LED array and the second side of the LED array.
8. The apparatus of claim 7 , wherein the one or more second optical elements comprise a waveguide.
9. The apparatus of claim 7 , wherein the one or more second optical elements comprise a diffractive optical element.
10. The apparatus of claim 7 , wherein the one or more second optical elements comprise a beam splitter.
11. The apparatus of claim 7 , wherein the one or more second optical elements comprise at least one of a beam steering element or a beam shaping element.
12. The apparatus of claim 1 , further comprising a first cooling structure on a third side of the LED array and the driver circuit and a second cooling structure on a fourth side of the LED array and the driver circuit, wherein the third side of the LED array and the fourth side of the LED array are orthogonal to both the first side of the LED array and the second side of the LED array.
13. A bonded apparatus comprising:
a light emitting diode (LED) array comprising a plurality of LED elements configured to emit light from a first side of the LED array, the LED array including a plurality of first contacts and a plurality of second contacts, wherein the first and second contacts are coplanar; and
a driver circuit having a first side direct bonded to the LED array on a second side of the LED array, wherein the second side of the LED array is opposite the first side of the LED array, wherein a dielectric region of the LED array is directly bonded to a dielectric region of the driver circuit, the driver circuit including third and fourth contacts directly bonded to the first and second contacts of the LED array such the driver circuit includes at least one contact at a bond interface for each LED element of the LED array.
14. The apparatus of claim 13 , wherein the driver circuit comprises a CMOS based device direct bonded to the LED array.
15. The apparatus of claim 13 , further comprising one or more optical elements integrated over the first side of the LED array.
16. The apparatus of claim 15 , wherein the one or more optical elements comprise one or more of a waveguide, a diffractive optical element, a beam splitter, a beam steering element, and a beam shaping element.
17. The apparatus of claim 15 , further comprising one or more second optical elements integrated on one or more sides of the LED array and the driver circuit, wherein the one or more sides of the LED array are orthogonal to both the first side of the LED array and the second side of the LED array.
18. The apparatus of claim 13 , further comprising a transparent substrate over the first side of the LED array.
19. The apparatus of claim 13 , further comprising a first cooling structure on a third side of the LED array and the driver circuit and a second cooling structure on a fourth side of the LED array and the driver circuit, wherein the third side of the LED array and the fourth side of the LED array are orthogonal to both the first side of the LED array and the second side of the LED array.