Rigid transaction card
View Patent ↗A transaction card can be manufactured from rigid materials, such as glass, stone, or ceramics. First, a rigid layer of a transaction card can be placed within a first recess of a first metallic sheet. The first recess can comprise a lip and an opening. Next, a binding layer can be placed on top of the first rigid layer of the transaction card where the binding layer comprises a binding medium. A second rigid layer can be placed on top of the binding layer. A second metallic sheet can be placed on top of the first metallic sheet where the second metallic sheet has a second recess with a lip and an opening. Next, the first metallic sheet can be fused together with the second metallic sheet to form a fused metal sheet. The fused metal sheet can be cut along a border of the opening of the first recess.
1. A method, comprising:
placing a first rigid layer of a transaction card within a first recess of a first metallic sheet, the first recess comprising a lip and an opening;
placing a binding layer on top of the first rigid layer of the transaction card, the binding layer comprising a binding medium;
placing a second rigid layer on top of the binding layer;
placing a second metallic sheet on top of the first metallic sheet, the second metallic sheet having a second recess with a lip and an opening;
fusing the lip of the first metallic sheet together with the lip of the second metallic sheet to form a fused metal band;
cutting the fused metal band along a border of the opening of the first recess; and
removing the first metallic sheet and the second metallic sheet.
2. The method of claim 1 , further comprising placing an antenna between the first rigid layer and the second rigid layer.
3. The method of claim 2 , further comprising connecting the antenna to an integrated circuit chip via a contact pad.
4. The method of claim 1 , further comprising affixing an integrated circuit chip within a pocket of the second rigid layer.
5. The method of claim 4 , wherein affixing the integrated circuit chip further comprises:
depositing an adhesive within the pocket of the second rigid layer;
placing the integrated circuit chip on top of the adhesive; and
curing the adhesive.
6. The method of claim 4 , further comprising inductively coupling the integrated circuit chip to an antenna.
7. The method of claim 1 , further comprising cutting the fused metal band along a border of the opening of the second recess.
8. The method of claim 1 , further comprising affixing a magnetic stripe to an interior surface of the first rigid layer of the transaction card.
9. The method of claim 1 , further comprising affixing a magnetic stripe to an exterior surface of the first rigid layer.
10. The method of claim 1 , wherein the first rigid layer and the second rigid layer comprise a chemically strengthened glass.
11. A transaction card manufactured by a process comprising:
placing a first rigid layer of a transaction card within a first recess of a first metallic sheet, the first recess comprising a lip and an opening;
placing a binding layer on top of the first rigid layer of the transaction card, the binding layer comprising a binding medium;
placing a second rigid layer on top of the binding layer;
placing a second metallic sheet on top of the first metallic sheet, the second metallic sheet having a second recess with a lip and an opening;
fusing the lip of the first metallic sheet together with the lip of the second metallic sheet to form a fused metal band;
cutting the fused metal band along a border of the opening of the first recess; and
removing the first metallic sheet and the second metallic sheet.
12. The transaction card manufactured by the process of claim 11 , further comprising placing an antenna between the first rigid layer and the second rigid layer.
13. The transaction card manufactured by the process of claim 12 , further comprising connecting the antenna to an integrated circuit chip via a contact pad.
14. The transaction card manufactured by the process of claim 11 , further comprising affixing an integrated circuit chip within a pocket of the second rigid layer.
15. The transaction card manufactured by the process of claim 14 ,
wherein affixing the integrated circuit chip further comprises:
depositing an adhesive within the pocket of the second rigid layer;
placing the integrated circuit chip on top of the adhesive; and
curing the adhesive.
16. The transaction card manufactured by the process of claim 11 , further comprising cutting the fused metal band along a border of the opening of the second recess.
17. The transaction card manufactured by the process of claim 11 , further comprising affixing a magnetic stripe to an interior surface of the first rigid layer of the transaction card.
18. The transaction card manufactured by the process of claim 11 , further comprising affixing a magnetic stripe to an exterior surface of the first rigid layer.
19. The transaction card manufactured by the process of claim 11 , wherein the first rigid layer and the second rigid layer comprise a chemically strengthened glass.
20. The transaction card manufactured by the process of claim 11 , wherein removing the first metallic sheet and the second metallic sheet leaves the fused metal band connecting the first rigid layer and the second rigid layer.