Force Sensing Device

1 . A force sensing device, comprising:

a first electrode and a second electrode;

a substrate comprising at least one groove; and

an active material between said first electrode and said second electrode; wherein

said at least one groove comprises a first face and a second face inclined to said first face, and said first face and said second face are arranged a distance apart from each other;

said first electrode is deposited on said first face and said second electrode is deposited on said second face;

said distance is configured to change on application of an applied force to deform said active material and provide a change in an electrical property of said active material; and

said substrate comprises a flexible non-conductive material.

2 . The force sensing device of claim 1 , wherein said electrical property is at least one of the following:

a change in resistance; or a change in capacitance.

3 . The force sensing device of claim 1 , wherein said active material comprises any one of the following:

a piezoresistive composite material; a quantum tunnelling material; a conductive foam; a mesh of conductive elastomeric fibers; a dielectric material; an elastomer; an elastomeric foam; or a substantially porous material.

4 . The force sensing device of claim 1 , wherein said at least one groove is formed by an embossing process.

5 . The force sensing device of claim 1 , wherein at least one of said first electrode or said second electrode comprises any one of the following:

a conductive material; a metallic material; aluminum; titanium; or copper.

6 . The force sensing device of claim 1 , wherein each of said first electrode and said second electrode is deposited by means of any one of the following:

a physical vapor deposition process; an evaporation process; a pulse laser deposition process; or molecular beam epitaxy.

7 . The force sensing device of claim 1 , further comprising an encapsulant configured to prevent contamination of said force sensing device.

8 . The force sensing device of claim 7 , wherein said encapsulant comprises an adhesive.

9 . The force sensing device of claim 7 , wherein said encapsulant comprises any one of the following:

an ultraviolet (UV) curable material; a thermally curable material; or a polymer resin.

10 . An electronic device comprising the force sensing device of claim 1 .

11 . A method of manufacturing a force sensing device, comprising the steps of:

forming a substrate comprising at least one groove comprising a first face and a second face inclined to said first face, said first face and said second face positioned a distance apart from each other;

depositing a first electrode on said first face;

depositing a second electrode on said second face; and

applying an active material between said first electrode and said second electrode, such that, in use, on application of an applied force, said distance changes and deforms said active material to provide a change in an electrical property of said active material; wherein

said substrate comprises a flexible non-conductive material.

12 . The method of claim 11 , wherein said step of forming said substrate comprises forming said at least one groove by an embossing process.

13 . The method of claim 11 , further comprising the step of:

integrating said force sensing device into an electronic device.

14 . The method of claim 11 , wherein at least one of said depositing said first electrode step or said depositing said second electrode step comprises any one of the following:

a physical vapor deposition process; an evaporation process; a pulse laser deposition process; or molecular beam epitaxy.

15 . The method of claim 11 , further comprising the step of:

applying an encapsulant to an upper surface of said active material.