Low-power static random access memory

1. A static random-access memory comprising:

a word line circuit for generating a word line signal on a word line;

a plurality of six-transistor memory cells arranged between a first bitline, a second bitline and the word line for simultaneously selecting one of either all or a portion of the plurality of six-transistor memory cells for data reading or writing, and wherein each memory cell comprises:

a first inverter;

a second inverter, the first inverter and the second inverter configured to operate at a power supply voltage (Vdd);

a first n-channel transistor having a gate for receiving the word line signal on the word line and in response connecting a first output of the first inverter to the first bitline;

a second n-channel transistor having a gate for receiving the word line signal on the word line and in response connecting a second output of the second inverter to the second bitline; and

a bitline precharge circuit for precharging the first bitline and second bitline to a voltage of Vdd/2 prior to the first and second n-channel transistors receiving the word line signal, wherein the word line circuit selects a portion of the plurality of six transistor memory cells along a selected word-line for simultaneous data reading or writing, and comprises a first PMOS transistor, a second PMOS transistor and an NMOS transistor,

wherein the first PMOS transistor has a drain connected to the word line, a source connected to a first power supply voltage Vdd 1 less than Vdd and greater than Vdd/2 when reading and writing to said memory cell, and a gate for receiving a first control signal (A),

wherein the second PMOS transistor has a drain connected to the word line, a source connected to one of either Vdd when reading said memory cell or a boosted voltage Vdd_boost when writing to said memory cell, and a gate for receiving one of either a second control signal (B) or third control signal (B′), and

wherein the NMOS transistor has a drain connected to the word line, a source connected to a low power supply voltage reference (Vss), and a gate connected to a third control input (WL_clear), such that the word line signal is provided in two steps including: a first step where in response to receiving the first control signal (A) the amplitude is at the first power supply voltage (Vdd 1 ) when reading and writing to said memory cell; and a second step, following the first step, where in response to receiving the second control signal (B) the amplitude is at the power supply voltage (Vdd) when reading said memory cell or where in response to receiving the third control signal (B′) the amplitude is at the boosted voltage Vdd_boost when writing to said memory cell.

2. The static random-access memory of claim 1 , wherein the first power supply voltage (Vdd 1 ) is generated by one of either an on-chip voltage generator, an on-chip voltage divider or an external voltage, wherein the on-chip voltage generator comprises: a driver path having two sets of a source follower and driver in parallel; and a sink path having two source followers in series, wherein drivability of transistors of the sink path is weaker than respective drivability of transistors of the driver path.

3. A static random-access memory comprising:

a word line circuit for generating a word line signal on a word line;

a plurality of six-transistor memory cells arranged between a first bitline, a second bitline and the word line for simultaneously selecting one of either all or a portion of the plurality of six-transistor memory cells for data reading or writing, and wherein each memory cell comprises:

a first inverter;

a second inverter, the first inverter and the second inverter configured to operate at a power supply voltage (Vdd);

a first n-channel transistor having a gate for receiving the word line signal on the word line and in response connecting a first output of the first inverter to the first bitline;

a second n-channel transistor having a gate for receiving the word line signal on the word line and in response connecting a second output of the second inverter to the second bitline; and

a bitline precharge circuit for precharging the first bitline and second bitline to a voltage of Vdd/2 prior to the first and second n-channel transistors receiving the word line signal, wherein the word line circuit selects all of the plurality of six transistor memory cells along a selected word-line for simultaneous data reading or writing, and wherein the amplitude of the word line signal when reading said memory cells is at Vdd, and the amplitude of the word line signal when writing to said memory cells is boosted larger than Vdd, and the rise time of the word line signal when reading said memory cells and writing to said memory cells is slower than the fall time to reduce a peak of low data stored in the bit cells when the word line signal is less than 20% of the Vdd/2 precharge voltage, and wherein the slower rise time is slow enough to raise the first bitline voltage to more than 50 mV with a split between the first and second bitline voltages when the word line signal reaches more than 90% of its maximum amplitude, and wherein the

word line circuit includes a monitoring circuit having resistance and capacitance to detect when the low data bit line signal reaches less than 10% of its precharge amplitude.

4. The static random-access memory of claim 3 , wherein the word line signal is provided in two steps including: a first step where the amplitude is at a first power supply voltage Vdd 1 when reading and writing to said memory cell; and a second step, following the first step, where the amplitude is at the power supply voltage Vdd when reading said memory cell or is at a boosted voltage Vdd_boost when writing to said memory cell,

and wherein the second step is provided when the difference between the first bitline and second bitline voltages is sufficient to compensate for SNM(Static Noise Margin) of the second step,

and wherein the slower rise time of the word line signal is applied to the first step word line where Vdd is applied during both read and write and the start of the second step whose amplitude is boosted during write, is determined by an output of the monitoring circuit, and

wherein the rise time of the second step is slower than the rise time of the first step.

5. The static random-access memory of claim 4 , wherein the first power supply voltage Vdd 1 is generated by one of either an on-chip voltage generator, an on-chip voltage divider or an external voltage, wherein the on-chip voltage generator comprises: a driver path having two sets of a source follower and driver in parallel; and a sink path having two source followers in series, wherein drivability of sink path is weaker than respective drivability of transistors of the driver path.

6. The static random-access memory of claim 4 , further including a word line boost circuit for precharging a primary boost capacitance of the word line circuit during the first step, and further boosting the primary boost capacitance at the second step.

7. The static random-access memory of claim 6 , wherein the word line boost circuit includes a plurality of boost capacitances equal in number to multiplexed columns, in addition to the primary boost capacitance, and wherein each boost capacitance is boosted according to timing of multiplexing column signals.

8. The static random-access memory of claim 3 , wherein a voltage Vddr is applied to one of the first bitline or second bitline during data reading wherein Vddr is equal to or less than the power supply voltage Vdd, and wherein the voltage Vddr is driven by cross-coupled first and second PMOS transistors and a third PMOS transistor,

wherein a source of the first cross-coupled PMOS transistor is connected to the voltage Vddr, a gate of the first cross-coupled PMOS transistor is configured to receive a cross-coupled enable PMOS signal (ΦA), and a drain of the first cross-coupled PMOS transistor is connected to respective sources of the second cross-coupled PMOS transistor and the third PMOS transistor,

wherein a drain of the second cross-coupled PMOS transistor is connected to the first bitline and a gate of the second cross-coupled PMOS transistor is connected to the second bitline,

wherein a drain of the third PMOS transistor is connected to the second bitline and a gate of the third PMOS transistor is connected to the first bitline,

wherein the cross-coupled enable PMOS signal (CP_en) is applied no earlier than the second step,

wherein a first source of the first NMOS transistor is connected to a Vss, a first gate of the first NMOS transistor is configured to receive a cross-coupled enable NMOS signal (CN_en), and a first drain of the first NMOS transistor is connected to respective sources of the second NMOS transistor and the third NMOS transistor,

wherein a second drain of the second NMOS transistor is connected to the first bitline and a second gate of the second NMOS transistor is connected to the second bitline,

wherein a third drain of the third NMOS transistor is connected to the second bitline and a third gate of the third NMOS transistor is connected to the first bitline, and

CN_en is applied after CP_en is applied.

9. The static random-access memory of claim 8 , wherein the voltage Vddr is less than the power supply voltage Vdd, and is generated by one of either an on on-chip voltage generator, an on-chip voltage divider or an external voltage, wherein the on-chip voltage generator comprises: a driver path having two sets of a source follower and driver in parallel; and a sink path comprising two source followers in series, wherein drivability of transistors of the sink path is weaker than respective drivability of transistors of the driver path.

10. The static random-access memory of claim 8 , wherein the voltage Vddr is less than the power supply voltage Vdd, and is generated by one of either an on on-chip voltage generator, an on-chip voltage divider or an external voltage, wherein the on-chip voltage generator is supplied by an external voltage.

11. The static random-access memory of claim 8 , wherein the first PMOS transistor is turned on by the cross-coupled enable signal (CP_en), during a final portion of data writing.

12. The static random-access memory of claim 8 , wherein the columns of a word line are connected to an AI logic element by N:1 Muxing (N≥1),

wherein, a data latch s provided every N columns for reading data,

wherein CP_en and CN_en consist of N phases, and CP_en of each phase is activated by an output of the monitoring circuit and CN_en of each phase is activated after the corresponding CP_en.