BONDING METHOD, BONDING STRUCTURE, AND BATTERY
A method for bonding a current collector to an electrode body is provided. The electrode body includes electrode plate end portions arranged over each other in a thickness direction. The method includes forming a covering by integrally covering the electrode plate end portions with resin at a bonding position of the current collector, and bonding a bonding portion of the current collector, by performing solid-phase bonding, to edges of the electrode plate end portions integrated by the formed covering.
1 . A method for bonding a current collector to an electrode body, the electrode body including electrode plate end portions arranged over each other in a thickness direction, the method comprising:
forming a covering by integrally covering the electrode plate end portions with resin at a bonding position of the current collector; and
bonding a bonding portion of the current collector, by performing solid-phase bonding, to edges of the electrode plate end portions integrated by the formed covering.
2 . The method according to claim 1 , further comprising:
exposing the edges of the electrode plate end portions from the covering by partially removing the resin.
3 . The method according to claim 2 , further comprising:
bending the edges of the electrode plate end portions exposed from the covering.
4 . The method according to claim 1 , wherein the solid-phase bonding is performed through complex vibration bonding or electromagnetic pressure welding.
5 . The method according to claim 1 , wherein the resin includes a photocurable resin.
6 . A bonding structure bonding a current collector to an electrode body including electrode plate end portions arranged over each other in a thickness direction, the bonding structure comprising:
a resin covering integrally covering the electrode plate end portions at a bonding position of the current collector; and
a bonding portion of the current collector bonded to edges of the electrode plate end portions exposed from the covering.
7 . The bonding structure according to claim 6 , wherein the edges of the electrode plate end portions are bonded to the bonding portion in a bent state.
8 . A battery, comprising:
the bonding structure according to claim 6 .