Granted Patent B2

US 12,552,087 · App. 18/248,927 · Granted Feb 17, 2026

Inventors: Raymond P. Johnston (Lake Elmo, MN); Jodi L. Connell (St. Paul, MN); Karl J. L. Geisler (St. Paul, MN); Jeffrey L. Solomon (Centerville, MN); Kristal L. Schutta (Forest Lake, MN); Conrad Lather (St. Paul, MN); Ta-Hua Yu (Woodbury, MN); Anthony F. Schultz (Forest Lake, MN); Duane D. Fansler (Dresser, WI); Richard J. Pokorny (Maplewood, MN)

Assignee: Solventum Intellectual Properties Company

B29C51/14B29C51/002B29K2029/14B29K2033/12

Abstract

Claims (22)

1 . A method of making an article, the method comprising:

providing a structured film comprising a thermoformable planar base layer and a structured surface layer disposed on a major surface of the planar base layer, wherein the structured surface layer comprises a different organic polymeric material than the thermoformable planar base layer, and wherein the structured surface layer is configured to maintain biocompatibility within an oral environment, and

thermoforming the structured film into a thermoformed article.

2 . The method of claim 1 , wherein the thermoformed article has a stretch ratio of at least 1.5.

3 . The method of claim 1 , wherein the thermoformed article comprises a cavity having a volume of at least 2.

4 . The method of claim 1 , wherein a land layer is present between the structured surface layer and the planar base layer.

5 . The method of claim 1 , wherein the planar base layer and land layer each have a thickness, and the thickness of the land layer divided by the thickness of the planar base layer, multiplied by 100%, is less than 15%.

6 . The method of claim 1 , wherein the thermoformed article comprises structures having at least one of a different width, height, or length than structures of the structured film.

7 . The method of claim 1 , wherein the structures comprise nanostructures having a height or width of less than 1 micron.

8 . The method of claim 1 , wherein the structures comprise microstructures having a height, or width of less than 1 mm.

9 . The method of claim 1 , wherein the thermoformable planar base layer comprises a thermoplastic or an uncured thermoset organic polymer.

10 . The method of claim 1 , wherein the structured surface layer comprises an organic polymer material that is sufficiently crosslinked, wherein the organic polymer material lacks a thermal melt or softening temperature below the decomposition temperature of the crosslinked organic polymer material.

11 . The method of claim 1 , wherein the structured surface layer comprises a thermoplastic polymer having a greater thermal melt or softening transition than the thermoformable planar base layer.

12 . The method of claim 11 , wherein thermoforming the structured film into an article utilizes a thermoforming temperature that is less than the thermal melt or softening transition of the structured surface layer.

13 . The method of claim 1 , wherein the thermoforming comprises contacting the thermoformable planar base layer or structured surface layer with a mold.

14 . The method of claim 1 , wherein the structured film comprises peak structures and adjacent valleys, and wherein the peak structures comprise at least one of: posts, domes, ribs, prisms, or cube-corner elements.

15 . The method of claim 1 , wherein the structured film or thermoformed article comprises peak structures and adjacent valleys, wherein the valleys have a maximum width ranging from 1 micron to 250 microns, and wherein the peak structures have a side wall angle of greater than 10 degrees.

16 . The method of claim 1 , wherein the organic polymeric material of the structured surface layer comprises one or more of: a (meth)acrylic polymer or a urethane acylate oligomer.

17 . The method of claim 1 , wherein the organic polymer material of the structured surface layer comprises one or more of a (meth)acrylic polymer or a polyvinyl acetal polymer.

18 . The method of claim 1 , wherein the organic polymeric material of the structured surface layer has a tensile elongation at break of greater than 50%, as measured at 23° C.

19 . The method of claim 1 , wherein the structured surface layer comprises a plurality of segments.

20 . The method of claim 19 , wherein at least a portion of the segments of the structured surface layer separate during thermoforming.

Assignments (2)

Continuity (3)

References Cited (206)