IP Library › Granted Patent US 12,715,068
Granted Patent B2
US 12,715,068 · App. 18/251,616 · Granted Aug 25, 2026

Laser-processing apparatus with debris removal system and integrated beam dump and methods of operating the same

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Quick Facts
Patent No.
US 12,715,068
App. No.
18/251,616
Granted
Aug 25, 2026
Kind
B2
Assignments (2)
INTELLECTUAL PROPERTY AGREEMENT SUPPLEMENT Recorded Jul 18, 2023
From: MKS INSTRUMENTS, INC.; NEWPORT CORPORATION; ELECTRO SCIENTIFIC INDUSTRIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 064318/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2023
From: NEUFELD, CORIE; DUNN, ZACHARY; NUCKOLLS, TIMOTHY; WILLEY, JEREMY
To: ELECTRO SCIENTIFIC INDUSTRIES, INCORPORATED
Reel/Frame 063541/0025 →
Continuity (2)
Provisional Application 63113378 · Nov 13, 2020
Related Publication 20230415264A1 · Dec 28, 2023
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