IP Library Granted Patent US 12,220,927
Granted Patent B2
US 12,220,927 · App. 18/252,847 · Granted Feb 11, 2025

Thermal head

Inventors: Kazuyuki Hoshi (Tokyo, JP); Hiroshi Kokuta (Tokyo, JP); Tatsuyuki Takahashi (Tokyo, JP)
Assignee: SATO HOLDINGS KABUSHIKI KAISHA
B41J2/33505B41J2/3358
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Quick Facts
Patent No.
US 12,220,927
App. No.
18/252,847
Granted
Feb 11, 2025
Kind
B2
Abstract

An embodiment of the present invention is a thermal head including: a heat dissipation plate having a first surface of a substantially rectangular shape in a plane view, and a second surface that is on an opposite side to the first surface; a board attached to the heat dissipation plat in such a manner as to extend from the first surface to the second surface, via a first end part interposed between the first surface and the second surface; a heating part having a plurality of heating elements, the heating part being disposed on the board over the first surface; and surface-mount devices mounted on the board over the second surface.

Claims (22)

1. A thermal head comprising:

a heat dissipation plate having a first surface of a substantially rectangular shape in a plane view, and a second surface that is on an opposite side to the first surface;

a board attached to the heat dissipation plat in such a manner as to extend from the first surface to the second surface, via a first end part interposed between the first surface and the second surface;

a heating part having a plurality of heating elements, the heating part being disposed on the board over the first surface; and

surface-mount devices mounted on the board over the second surface.

2. The thermal head according to claim 1 , wherein

the board comprises an opening part that exposes a portion of the first surface of the heat dissipation plate.

3. The thermal head according to claim 2 , wherein the portion of the first surface exposed by the opening part and a surface of the heating part are in substantially the same reference plane.

4. The thermal head according to claim 3 , further comprising a pair of shafts extending outward from both ends of the heat dissipation plate in a plan view.

5. The thermal head according to claim 3 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that projects in a direction perpendicular to the first surface.

6. The thermal head according to claim 5 , wherein the plate member comprises a projecting part extending over longitudinal direction of a second end part that is opposite to the first end part of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.

7. The thermal head according to claim 2 , further comprising a pair of shafts extending outward from both ends of the heat dissipation plate in a plan view.

8. The thermal head according to claim 7 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that projects in a direction perpendicular to the first surface.

9. The thermal head according to claim 8 , wherein the plate member comprises a projecting part extending over longitudinal direction of a second end part that is opposite to the first end part of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.

10. The thermal head according to claim 2 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that projects in a direction perpendicular to the first surface.

11. The thermal head according to claim 10 , wherein the plate member comprises a projecting part extending over longitudinal direction of a second end part that is opposite to the first end part of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.

12. The thermal head according to claim 1 , further comprising a pair of shafts extending outward from both ends of the heat dissipation plate in a plan view.

13. The thermal head according to claim 12 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that projects in a direction perpendicular to the first surface.

14. The thermal head according to claim 1 , wherein the surface-mount devices include a memory chip and a connector for receiving a signal from the outside.

15. The thermal head according to claim 1 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that projects in a direction perpendicular to the first surface.

16. The thermal head according to claim 15 , wherein the plate member comprises a projecting part extending over longitudinal direction of a second end part that is opposite to the first end part of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.

17. The thermal head according to claim 13 , wherein the plate member comprises a projecting part extending over longitudinal direction of a second end part that is opposite to the first end part of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.

Assignments (2)
CHANGE OF NAME Recorded Jul 1, 2025
From: SATO HOLDINGS KABUSHIKI KAISHA
To: SATO CORPORATION
Reel/Frame 072085/0034 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2023
From: HOSHI, KAZUYUKI; KOKUTA, HIROSHI; TAKAHASHI, TATSUYUKI
To: SATO HOLDINGS KABUSHIKI KAISHA
Reel/Frame 063629/0580 →
Priority Claims (1)
JP 2020-191682 · Nov 18, 2020 · national
Continuity (1)
Related Publication 20240001688A1 · Jan 4, 2024
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