Bonding films
Bonding films comprising PEEK-PEoEK copolymers are compatible with polyaryletherketone chemistry thereby providing joined polyaryletherketone polymer parts with high fracture toughness and overall good mechanical properties.
1 . An assembly comprising a first component comprising a polymer (P1), a second component comprising a polymer (P2) and a film comprising at least one PEEK-PEoEK copolymer, the PEEK-PEoEK copolymer comprising at least 50 mol. %, collectively, of repeat units (R PEEK ) and repeat units (R PEoEK ), relative to a total number of moles of repeat units in the PEEK-PEoEK copolymer, wherein:
repeat units (R PEEK ) are repeat units of formula:
and
repeat units (R PEoEK ) are repeat units of formula:
where each R 1 and R 2 , equal to or different from each other, is at each occurrence independently selected from the group consisting of halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine, and quaternary ammonium;
each a and b is independently selected from integers ranging from 0 to 4;
the PEEK-PEoEK copolymer comprises the repeat units (R PEEK ) and (R PEoEK ) in a molar ratio (R PEEK )/(R PEoEK ) ranging from 95/5 to 5/95; and
said film being positioned between and bonded to said first and second components; and
wherein the film has a thickness of from 15 to 800 μm.
2 . The assembly of claim 1 , wherein the repeat units (R PEEK ) are repeat units of formula:
and/or
the repeat units (R PEoEK ) are repeat units of formula:
3 . The assembly of claim 1 wherein the PEEK-PEoEK copolymer has a molar ratio (R PEEK )/(R PEEK ) in the range from 90/10 to 55/45.
4 . The assembly of claim 1 wherein the PEEK-PEoEK copolymer has a melting temperature (T m ) of less than or equal to 320° C., as measured by differential scanning calorimetry (DSC) according to ASTM D3418-03, E1356-03, E794-06.
5 . The assembly of claim 1 wherein the PEEK-PEoEK copolymer has a solubility of below 0.2% wt in N-methylpyrrolidone (NMP), N,N-dimethylacetamide (DMAc) and N,N-dimethylformamide (DMF), when determined at a temperature of 150° C. or less.
6 . The assembly of claim 1 , wherein polymer (P1) and polymer (P2) are independently selected from the group consisting of polyaryletherketones, polyamides, polyetherimides, polyamideimides, polysulfones, polyethersulfones, polyarylethers, polycarbonates, liquid crystal polymers, polyphenylene sulfides, polyarylenes (polyphenylenes), polyphthalamides, polyaromatic esters, and blends thereof.
7 . The assembly of claim 1 , wherein polymer (P1) and polymer (P2) are independently selected from the group consisting of polyaryletherketones, polyetherimides, polyamideimides, polysulfones, polyethersulfones, polyphenylene sulfides, polyphthalamides, and blends thereof.
8 . The assembly of claim 1 wherein polymer (P1) and polymer (P2) are independently selected from PEKK polymers with a T/I ratio in a range from 55/45 to 85/15.
9 . The assembly of claim 1 wherein the first component is a composite material comprising one or more layers comprising fibers and polymer (P1) and/or the second component is a composite material comprising one or more layers comprising fibers and polymer (P2).
10 . The assembly of claim 9 wherein the fibers are carbon or glass fibers.
11 . A method of making the assembly of claim 1 which comprises steps of: arranging the film between the first component comprising a polymer (P1) and the second component comprising a polymer (P2); and subjecting the film to a temperature (T m x ), wherein the temperature (T m x ) is suitable to melt the film but not to melt polymer (P1) and polymer (P2).
12 . The method of claim 11 wherein temperature (T m x ) is greater than the melting temperature of the film and lower than the melting temperature of polymer (P1) and polymer (P2).
13 . The method of claim 11 which further comprises the steps of: arranging the film between the first component comprising a polymer (P1) and the second component comprising a polymer (P2); and subjecting the film to a temperature (T m x ) within the range 280° C. to 315° C.
14 . The method of claim 11 wherein, whilst the film is being subjected to said temperature (T m x ), pressure is applied to consolidate the components.
15 . An assembly comprising a first component comprising a polymer (P1), a second component comprising a polymer (P2) and a film comprising at least one PEEK-PEOEK copolymer, the PEEK-PEoEK copolymer comprising at least 50 mol. %, collectively, of repeat units (R PEEK ) and repeat units (R PEoEK ), relative to a total number of moles of repeat units in the PEEK-PEoEK copolymer, wherein:
repeat units (R PEEK ) are repeat units of formula:
repeat units (R PEoEK ) are repeat units of formula:
where each R 1 and R 2 , equal to or different from each other, is at each occurrence independently selected from the group consisting of halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine, and quaternary ammonium;
each a and b is independently selected from integers ranging from 0 to 4;
the PEEK-PEoEK copolymer comprises the repeat units (R PEEK ) and (R PEoEK ) in a molar ratio (R PEEK )/(R PEoEK ) ranging from 95/5 to 5/95; and
said film being positioned between and bonded to said first and second components;
wherein the first component is a composite material comprising one or more layers comprising fibers and polymer (P1) and/or the second component is a composite material comprising one or more layers comprising fibers and polymer (P2), and
wherein the fibers are carbon or glass fibers.