IP Library Granted Patent US 12,674,771
Granted Patent B2
US 12,674,771 · App. 18/279,792 · Granted Jul 7, 2026

Methods and apparatus for integrating diamond with LED towards on-chip quantum sensing

Inventors: Zhiqin Chu (Hong Kong, CN); Jixiang Jing (Hong Kong, CN); Feng Xu (Hong Kong, CN)
Assignee: VERSITECH LIMITED
G01N24/006G01N24/10H10H20/811H10H20/8215
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,674,771
App. No.
18/279,792
Granted
Jul 7, 2026
Kind
B2
Abstract

A small volume optoelectronic chip contains an LED chip with a diamond having nitrogen-vacancy centers embedded therein. The LED chip generates light having a first wavelength, and the diamond with nitrogen-vacancy centers generates light having a second wavelength after excitement with light having the first wavelength. The diamond may also be on or adjacent the LED.

Claims (20)

1 . An optoelectronic chip, comprising:

an LED chip having embedded therein a diamond with nitrogen-vacancy centers, wherein the LED chip generates light having a first wavelength, and the diamond with nitrogen-vacancy centers generates light having a second wavelength after excitement with light having the first wavelength.

2 . The optoelectronic chip according to claim 1 , wherein the LED chip is a GaN LED chip.

3 . The optoelectronic chip according to claim 1 , wherein the diamond with nitrogen-vacancy centers comprises bulk diamond or diamond nanoparticles.

4 . The optoelectronic chip according to claim 3 , wherein the diamond nanoparticles are comprised within an optical adhesive glue.

5 . The optoelectronic chip according to claim 1 having a size of 100 mm 3 or less.

6 . The optoelectronic chip according to claim 1 having a size of 10 mm 3 or less.

7 . The optoelectronic chip according to claim 1 having a size of 1 mm 3 or less.

8 . The optoelectronic chip according to claim 1 , wherein the LED chip is a GaN LED chip, and the first wavelength is from 375 nm to 521 nm.

9 . The optoelectronic chip according to claim 1 , wherein the LED chip is a GaN LED chip, and the first wavelength is from 375 nm to 521 nm, and the second wavelength is from 625 nm to 700 nm.

10 . A quantum sensing device, comprising:

an LED chip;

a diamond with nitrogen-vacancy centers embedded in the LED chip, wherein the LED chip generates light having a first wavelength, and the diamond with nitrogen-vacancy centers generates light having a second wavelength after excitement with light having the first wavelength;

a microwave antenna, one side of the microwave antenna adjacent the LED chip;

a photodiode on another side of the microwave antenna; and

a light modulator between the LED chip and the diamond.

11 . The quantum sensing device according to claim 10 , wherein the diamond with nitrogen-vacancy centers is embedded in the LED chip.

12 . The quantum sensing device according to claim 10 , wherein the diamond with nitrogen-vacancy centers is adjacent to a first surface of the LED chip, and the microwave antenna is adjacent to a second surface of the LED chip.

13 . The quantum sensing device according to claim 10 , wherein the LED chip is a GaN LED chip.

14 . The quantum sensing device according to claim 10 having a size of 100 mm 3 or less.

Assignments (2)
CHANGE OF NAME Recorded May 1, 2026
From: VERSITECH LIMITED
To: UNIVERSITY OF HONG KONG VERSITECH LIMITED
Reel/Frame 075506/0542 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2023
From: CHU, ZHIQIN; JING, JIXIANG; XU, FENG
To: VERSITECH LIMITED
Reel/Frame 064767/0623 →
Continuity (2)
Provisional Application 63155354 · Mar 2, 2021
Related Publication 20240167970A1 · May 23, 2024
References Cited (11)
US 9823313B2 · Hahn · 2017 [cited by examiner]
US 10901054B1 · Chen et al. · 2021 [cited by applicant]
US 12326486B2 · Meijer · 2025 [cited by examiner]
US 20050253159A1 · Creswick · 2005 [cited by examiner]
US 20150362151A1 · Van Bommel et al. · 2015 [cited by applicant]
US 20170343618A1 · Hahn · 2017 [cited by examiner]
US 20190317173A1 · Connolly et al. · 2019 [cited by applicant]
US 20200057117A1 · Nishibayashi et al. · 2020 [cited by applicant]
CN 105137126A · 2015 [cited by applicant]
CN 108061548A · 2018 [cited by applicant]
International Search Report and Written Opinion in corresponding International Application No. PCT/CN2022/076011, mailed Apr. 28, 2022, 5 pages. [cited by applicant]