BIODEGRADABLE ELECTROCHEMICAL DEVICE WITH BARRIER LAYER
An electrochemical device is disclosed and may include an electrolyte composition disposed between the anode and the cathode and a water vapor barrier which may include a biodegradable material, where the water vapor barrier is disposed to prevent water vapor escaping from the electrochemical device. The water vapor barrier further may include poly lactic acid or a metalized coating. The water vapor barrier further may further include multiple layers and have a water vapor transmission rate (WVTR) less than or equal to 2 wt % over 24 hours. Embodiments of the water vapor barrier may also include a polymeric biodegradable material or a metalized coating disposed onto the biodegradable material. The water vapor barrier may also include multiple layers and may have a water vapor transmission rate (WVTR) less than or equal to 1 mg per cm 2 over 24 hours.
1 . An electrochemical device comprising:
an anode;
a cathode;
an electrolyte composition disposed between the anode and the cathode; and
a water vapor barrier comprising a biodegradable material, wherein the water vapor barrier comprising the biodegradable material is disposed to reduce water vapor escaping from the electrochemical device.
2 . The electrochemical device of claim 1 , wherein the water vapor barrier further comprises polylactic acid (PLA).
3 . The electrochemical device of claim 1 , wherein the water vapor barrier further comprises a metalized coating.
4 . The electrochemical device of claim 3 , wherein the metalized coating comprises aluminum.
5 . The electrochemical device of claim 1 , wherein the water vapor barrier further comprises multiple layers.
6 . The electrochemical device of claim 1 , wherein the water vapor barrier further comprises a moisture impermeable layer.
7 . The electrochemical device of claim 6 , wherein the moisture impermeable layer comprises metal.
8 . The electrochemical device of claim 7 , wherein the metal layer has a thickness of from about 1 μm to about 150 μm.
9 . The electrochemical device of claim 1 , wherein the anode is printed directly onto the water vapor barrier.
10 . The electrochemical device of claim 1 , wherein the cathode is printed directly onto the water vapor barrier.
11 . A water vapor barrier, comprising:
a biodegradable material, the biodegradable material comprising a polymer; and
a metal layer coating disposed onto the biodegradable material.
12 . The water vapor barrier of claim 11 , wherein the polymer comprises polylactic acid (PLA).
13 . The water vapor barrier of claim 11 , wherein the metal layer comprises aluminum.
14 . The water vapor barrier of claim 11 , further comprising multiple layers.
15 . The water vapor barrier of claim 11 , wherein the metal layer has a thickness of from about 1 μm to about 150 μm.
16 . The water vapor barrier of claim 11 , further comprising:
an anode;
a cathode; and
an electrolyte composition disposed between the anode and the cathode; and
a water vapor barrier comprising a biodegradable material enclosing the anode, the cathode, and the electrolyte composition; and
wherein the anode, the cathode, and the electrolyte composition are enclosed by the water vapor barrier.
17 . An electrochemical device comprising:
an anode;
a cathode;
an electrolyte composition disposed between the anode and the cathode; and
a water vapor barrier comprising a biodegradable material, wherein:
the water vapor barrier comprising the biodegradable material is disposed to prevent water vapor escaping from the electrochemical device; and
the water vapor barrier comprising the biodegradable material further comprises a polylactic acid (PLA) layer and a metal layer; and
the electrochemical device has a water vapor transmission rate (WVTR) less than or equal to 1 mg per cm 2 over 24 hours.
18 . The electrochemical device of claim 17 , wherein the water vapor barrier further comprises multiple layers.
19 . The electrochemical device of claim 17 , wherein the metal layer has a thickness of from about 0.1 μm to about 10 μm.
20 . The electrochemical device of claim 17 , wherein the metal layer has a thickness of from about 20 μm to about 150 μm.