IP Library Granted Patent US 11,923,255
Granted Patent B2
US 11,923,255 · App. 18/296,493 · Granted Mar 5, 2024

Methods for manufacturing an electronic device

Inventors: Chia-Hsiung Chang (Miao-Li County, TW); Ting-Kai Hung (Miao-Li County, TW); Hsiao-Lang Lin (Miao-Li County, TW)
Assignee: INNOLUX CORPORATION
H01L22/22H01L25/167H01L25/50H01L33/44H01L33/52H01L33/62H01L27/1214H01L33/50H01L33/60H01L2933/0041H01L2933/005H01L2933/0066
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Quick Facts
Patent No.
US 11,923,255
App. No.
18/296,493
Granted
Mar 5, 2024
Kind
B2
Abstract

Methods for manufacturing an electronic device are provided. A representative method includes providing a substrate. The substrate has an active layer, a first patterned metal layer passing through a passivation layer to electrically connected to the active layer, a second patterned metal layer passing through an insulating layer to electrically connected to the first patterned metal layer, and a metal layer under the second patterned metal layer. A part of the metal layer does not serve as a portion of a thin film transistor, and the part of the metal layer serves as a portion of a gate line. The method includes providing a carrier substrate supporting a plurality of elements, conducting a testing to the elements, transferring the elements from the carrier substrate to the second patterned metal layer of the substrate, and fixing the elements to the substrate.

Claims (10)

1. A method for manufacturing an electronic device comprising:

providing a substrate, the substrate having an active layer, a first patterned metal layer passing through a passivation layer to electrically connected to the active layer, a second patterned metal layer passing through an insulating layer to electrically connected to the first patterned metal layer, and a metal layer under the second patterned metal layer, wherein a part of the metal layer does not serve as a portion of a thin film transistor, and the part of the metal layer serves as a portion of a gate line;

providing a carrier substrate supporting a plurality of elements;

conducting a testing to the plurality of elements;

transferring at least one of the plurality of elements from the carrier substrate to the second patterned metal layer of the substrate; and

fixing the at least one of the plurality of elements to the substrate.

2. The method of claim 1 , wherein the testing comprises photoluminescence testing.

3. The method of claim 1 , wherein the testing comprises electroluminescence testing.

4. The method of claim 1 , wherein conducting the testing comprises determining whether the at least one of the plurality of elements is good or defective.

5. The method of claim 1 , further comprising determining a first group of the plurality of elements as good and a second group of the plurality of elements as defective, and transferring the first group of the plurality of elements from the carrier substrate to the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2023
From: CHANG, CHIA-HSIUNG; HUNG, TING-KAI; LIN, HSIAO-LANG
To: INNOLUX CORPORATION
Reel/Frame 063242/0798 →