Multi-pitch ball grid array
A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.
1. A system comprising:
a ball grid array (BGA) package;
an integrated circuit; and
a printed circuit board (PCB) comprising a plurality of layers and a first plurality of pads disposed on a top layer of the plurality of layers,
wherein the BGA package includes a BGA substrate and an array of BGA connectors, a second plurality of pads on the BGA substrate attached to the integrated circuit and a third plurality of BGA pads deposited as an array on a side of the BGA substrate opposite the pads attached to the integrated circuit and connected to the BGA connectors,
wherein the first plurality of pads are distributed on the top layer in a pattern matching the third plurality of pads on the BGA package,
wherein the BGA connectors include BGA signal connectors and BGA ground connectors,
wherein differential pairs of the BGA signal connectors are deposited on the BGA package,
wherein a first pad of a first differential pair is separated from a second pad of the first differential pair at a first center-on-center distance defined by a first pitch P1,
wherein each pair of the differential pairs is configured to transmit a signal as a voltage difference across a first pad and a second pad of the respective differential pair,
wherein BGA ground connectors are deposited on the BGA package at least a second center-on-center distance from adjacent differential pairs of BGA connectors defined by a second pitch P2,
wherein P2=M*P1 and M is greater than one, and
wherein the differential pairs of BGA signal connectors on the BGA package are separated from adjacent BGA ground connectors on the BGA package by a third center-on-center distance defined by the second pitch.
2. The system of claim 1 , wherein the BGA connectors further include VDD connectors in a section of the BGA substrate, wherein additional BGA ground connectors in the section on the BGA package are separated from adjacent VDD connectors on the BGA package by a third pitch P3, P3=N*P1, wherein 0<N<1.
3. The system of claim 1 ,
wherein portions of the array of BGA connectors on the BGA package are arranged as rows and columns of BGA connectors, with the differential pairs of BGA signal connectors deposited in adjacent rows in the same column,
wherein columns of the BGA connectors in the array of BGA connectors are separated as a function of the second pitch, wherein rows of the BGA connectors that do include a signal connector that is one of the differential pairs of signal connectors are separated as a function of the first pitch and wherein rows of the BGA connectors that do not include a BGA signal connector that is one of the differential pairs of signal connectors are separated as a function of the second pitch.
4. The system of claim 1 , wherein the array of connectors includes solder balls.
5. The system of claim 1 , wherein the first pitch is 1.0 mm and the second pitch is 1.25 mm.
6. The system of claim 1 , wherein each differential pair of the differential pairs of signal pads is separated from an adjacent differential pair of signal pads by a single row of ground pads or a single column of ground pads.
7. The system of claim 1 ,
wherein the first plurality of pads includes ground pads and differential pairs of signal pads on the PCB, and
wherein the PCB further comprises antipads in areas of the PCB where spaces were created by separating the differential pairs of signal pads from adjacent ground pads by the second pitch that are larger than antipads in other areas of the PCB.
8. The system of claim 7 , wherein the signal pads are coupled to the antipads.
9. A system comprising:
a ball grid array (BGA) package;
an integrated circuit; and
a printed circuit board (PCB) comprising a plurality of layers and a first plurality of pads disposed on a top layer of the plurality of layers,
wherein the BGA package includes a BGA substrate and an array of BGA connectors, a second plurality of pads on the BGA substrate attached to the integrated circuit and a third plurality of BGA pads deposited as an array on a side of the BGA substrate opposite the pads attached to the integrated circuit and connected to the BGA connectors,
wherein the first plurality of pads are distributed on the top layer in a pattern matching the third plurality of pads on the BGA package,
wherein the BGA connectors include BGA signal connectors and BGA ground connectors,
wherein differential pairs of the BGA signal connectors are deposited on the BGA package,
wherein a first pad of a first differential pair is separated from a second pad of the first differential pair at a first center-on-center distance defined by a first pitch P1,
wherein each pair of the differential pairs is configured to transmit a signal as a voltage difference across a first pad and a second pad of the respective differential pair,
wherein BGA ground connectors are deposited on the BGA package at least a second center-on-center distance from adjacent differential pairs of BGA connectors defined by a second pitch P2,
wherein P2=M*P1 and M is greater than one,
wherein the differential pairs of BGA signal connectors on the BGA package are separated from adjacent BGA ground connectors on the BGA package by a third center-on-center distance defined by the second pitch,
wherein the first plurality of pads of the PCB includes differential pairs of signal pads and ground pads,
wherein each pad of the differential pairs of signal pads of the first plurality of pads of the PCB and each pad of the ground pads of the first plurality of pads of the PCB is configured to receive one of the BGA connectors,
wherein a first pad of a first differential pair of signal pads on the top layer of the PCB is separated from a second pad of the first differential pair by a first center-on-center distance defined by the first pitch P1,
wherein ground pads of the PCB are separated by a second center-on-center distance defined by the second pitch P2 from adjacent differential pairs of signal pads of the PCB, and
wherein the differential pairs of signal pads of the PCB are separated from adjacent ground pads of the PCB by a third center-on-center distance defined by the second pitch.