Display device, including a sealing layer with different thicknesses and manufacturing method thereof
According to one embodiment, a display device includes a lower electrode, a rib including a pixel aperture, a partition on the rib, an upper electrode contacting the partition, an organic layer between the lower and upper electrodes, and a sealing layer covering a display element and the partition, the display element including the lower electrode, the upper electrode and the organic layer. The sealing layer includes a first portion which is located above the rib and has a first thickness, and a second portion which is located above the lower electrode exposed from the rib through the pixel aperture and has a second thickness less than the first thickness.
1 . A display device comprising:
a lower electrode;
a rib which covers an end portion of the lower electrode and comprises a pixel aperture from which part of the lower electrode is exposed;
a partition provided on the rib;
an upper electrode which faces the lower electrode and is in contact with the partition;
an organic layer which is provided between the lower electrode and the upper electrode and emits light based on a potential difference between the lower electrode and the upper electrode; and
a sealing layer which continuously covers a display element and the partition, the display element including the lower electrode, the upper electrode and the organic layer, wherein
the sealing layer includes:
a first portion which is located above the rib and has a first thickness; and
a second portion which is located above the lower electrode exposed from the rib through the pixel aperture and has a second thickness less than the first thickness.
2 . The display device of claim 1 , wherein
the first portion surrounds the second portion as seen in plan view.
3 . The display device of claim 1 , wherein
the second thickness is less than or equal to half the first thickness.
4 . The display device of claim 1 , wherein
the first thickness is greater than a height of the partition, and
the second thickness is less than the height of the partition.
5 . The display device of claim 1 , wherein
the first thickness is greater than or equal to 1.0 μm, and
the second thickness is less than 1.0 μm.
6 . The display device of claim 5 , wherein
the second thickness is greater than or equal to 0.1 μm.
7 . The display device of claim 1 , wherein
a distance between the partition and the second portion is greater than or equal to a height of the partition.
8 . The display device of claim 1 , wherein
the partition comprises:
a lower portion provided on the rib; and
an upper portion provided on the lower portion and protruding relative to a side surface of the lower portion,
the upper electrode is in contact with the side surface, and
the first portion covers part of the side surface.
9 . A manufacturing method of a display device, including:
forming a lower electrode above a substrate;
forming a rib which covers an end portion of the lower electrode and comprises a pixel aperture from which part of the lower electrode is exposed;
forming a partition on the rib;
forming an organic layer which covers the lower electrode through the pixel aperture;
forming an upper electrode which covers the organic layer and is in contact with the partition;
forming a sealing layer which continuously covers a display element and the partition, the display element including the lower electrode, the upper electrode and the organic layer; and
reducing a thickness of, of the sealing layer, a portion located above the lower electrode exposed from the rib through the pixel aperture.
10 . The manufacturing method of claim 9 , wherein
the reducing the thickness includes:
providing a resist on, of the sealing layer, a portion which covers the partition; and
reducing a thickness of, of the sealing layer, a portion exposed from the resist by etching.
11 . The manufacturing method of claim 9 , wherein
after the reduction of the thickness, the sealing layer includes:
a first portion which is located above the rib and has a first thickness; and
a second portion which is located above the lower electrode exposed from the rib through the pixel aperture and has a second thickness less than the first thickness.
12 . The manufacturing method of claim 11 , wherein
the first portion surrounds the second portion as seen in plan view.
13 . The manufacturing method of claim 11 , wherein
the second thickness is less than or equal to half the first thickness.
14 . The manufacturing method of claim 11 , wherein
the first thickness is greater than a height of the partition, and
the second thickness is less than the height of the partition.
15 . The manufacturing method of claim 11 , wherein
the first thickness is greater than or equal to 1.0 μm, and
the second thickness is less than 1.0 μm.
16 . The manufacturing method of claim 15 , wherein
the second thickness is greater than or equal to 0.1 μm.
17 . The manufacturing method of claim 11 , wherein
a distance between the partition and the second portion is greater than or equal to a height of the partition.
18 . The manufacturing method of claim 11 , wherein
the partition comprises:
a lower portion provided on the rib; and
an upper portion provided on the lower portion and protruding relative to a side surface of the lower portion,
the upper electrode is in contact with the side surface, and
the first portion covers part of the side surface.