Manufacturing method of display device and evaporation device
According to one embodiment, a processing substrate is prepared. An organic layer is formed. An etching stopper layer is formed. The forming the etching stopper layer includes, in a first mode, inclining an evaporation source, and depositing a material emitted from the evaporation source while relative positions of the evaporation source and the processing substrate are changed, and in a second mode, inclining the evaporation source in a manner different from the first mode, and depositing the material emitted from the evaporation source while the relative positions of the evaporation source and the processing substrate are changed in an opposite manner of the first mode.
1 . An evaporation device comprising:
a chamber comprising a carry-in entrance and a carry-out exit;
an evaporation source accommodated in the chamber; and
a mechanism which changes relative positions of a processing substrate conveyed to the chamber and the evaporation source, wherein
the evaporation device is configured such that
in a first mode, the evaporation source inclines with respect to a normal of the processing substrate, and a material emitted from the evaporation source is deposited on the processing substrate while the mechanism changes the relative positions of the evaporation source and the processing substrate, and
in a second mode, the evaporation source inclines with respect to the normal of the processing substrate in a manner different from the first mode, and the material emitted from the evaporation source is deposited on the processing substrate while the mechanism changes the relative positions of the evaporation source and the processing substrate in an opposite manner of the first mode.
2 . The evaporation device of claim 1 , comprising, as the mechanism, a conveyance mechanism which conveys the processing substrate in a forward direction from the carry-in entrance to the carry-out exit in the first mode, and conveys the processing substrate in a backward direction from the carry-out exit to the carry-in entrance in the second mode, wherein
the evaporation source is secured to the chamber, inclines in a conveyance direction of the processing substrate in the first mode, and inclines in an opposite direction of the first mode in the conveyance direction of the processing substrate in the second mode.
3 . The evaporation device of claim 2 , further configured such that
the processing substrate is carried in the chamber,
in the first mode, the material emitted from the evaporation source is deposited while the processing substrate is conveyed in the forward direction,
in the second mode, the material emitted from the evaporation source is deposited while the processing substrate is conveyed in the backward direction,
in the first mode, the material emitted from the evaporation source is deposited while the processing substrate is conveyed in the forward direction, and
the processing substrate is carried out of the chamber.
4 . The evaporation device of claim 3 , wherein
a conveyance speed at which the conveyance mechanism conveys the processing substrate is greater than or equal to three times a conveyance speed at which the processing substrate is conveyed before the processing substrate is carried in the chamber or after the processing substrate is carried out of the chamber.
5 . The evaporation device of claim 4 , wherein
the conveyance speed of the processing substrate in the first mode is faster than the conveyance speed of the processing substrate in the second mode.
6 . The evaporation device of claim 1 , wherein
the material emitted from the evaporation source is a mixture of magnesium and silver.