Vapor chamber and electronic apparatus
A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.
1. A vapor chamber comprising:
a first metal plate;
a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate;
a plurality of supporting columns rising between the first metal plate and the second metal plate inside the sealed space, and
a wick stored inside the sealed space,
wherein
the first metal plate has a through-hole communicating with the sealed space;
the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space, and
the supporting columns are placed at positions surrounding the through-hole.
2. The vapor chamber according to claim 1 , wherein
the metal block includes:
a base portion embedded in the through-hole, and
a flange portion having an outer shape larger than the base portion, the flange portion being joined to an outer surface of the first metal plate.
3. The vapor chamber according to claim 1 ,
wherein the metal block includes:
a base portion embedded in the through-hole, and
a flange portion having an outer shape larger than the base portion, the flange portion being joined to an inner surface of the first metal plate inside the sealed space.
4. The vapor chamber according to claim 1 , wherein
the wick is put on an inner surface of the first metal plate inside the sealed space and makes contact with the metal block.
5. An electronic apparatus comprising:
a chassis;
a heat generator provided inside the chassis; and
a vapor chamber provided inside the chassis and configured to absorb heat generated from the heat generator,
wherein the vapor chamber includes:
a first metal plate having a through-hole,
a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate,
a plurality of supporting columns rising between the first metal plate and the second metal plate inside the sealed space,
a wick stored inside the sealed space, and
a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space;
wherein
the supporting columns are placed at positions surrounding the through-hole, and
the outer surface of the metal block is connected to the heat generator.
6. The electronic apparatus according to claim 5 , further comprising:
a substrate on which the heat generator is mounted, the substrate being placed generally in parallel with the vapor chamber,
wherein
the heat generator includes:
a first heat generator, and
a second heat generator having a projection height from the substrate, the projection height being larger than a projection height of the first heat generator from the substrate;
the through-hole includes:
a first through-hole, and
a second through-hole formed at a position different from the first through-hole in the first metal plate; and
the metal block includes:
a first metal block inserted into the first through-hole and having an outer surface connected to the first heat generator, and
a second metal block inserted into the second through-hole and having a plate thickness thinner than a plate thickness of the first metal block by a difference between the projection height of the first heat generator and the projection height of the second heat generator, the second metal block having an outer surface connected to the second heat generator.