Inkjet printer with temperature controlled substrate support

1. A method, comprising:

using a gas cushion substrate support to support a substrate, the gas cushion substrate support comprising a metal support surface and a plurality of holes formed through the metal support surface;

flowing a gas through a gas conduit and through the plurality of holes to form a gas cushion between the substrate and the metal support surface to support the substrate;

depositing a print material on the substrate while the substrate is supported by the gas cushion; and

thermally controlling the substrate by adjusting a flowrate of the gas, adjusting a temperature of the gas using a thermal control system coupled to the gas conduit, or both.

2. The method of claim 1 , wherein thermally controlling the substrate further comprises:

measuring a temperature of the gas flowing through the gas conduit; and

adjusting a flowrate of the gas flowing through the gas conduit based on the measured gas temperature.

3. The method of claim 1 , wherein thermally controlling the substrate further comprises:

measuring a temperature of the gas flowing through the gas conduit; and

adjusting a temperature of the gas flowing through the gas conduit based on the measured gas temperature.

4. The method of claim 1 , wherein thermally controlling the substrate further comprises:

measuring a temperature of the substrate while the substrate is supported by the gas cushion; and

adjusting a flowrate of the gas flowing through the gas conduit based on the measured substrate temperature.

5. The method of claim 1 , wherein thermally controlling the substrate further comprises:

measuring a temperature of the substrate while the substrate is supported by the gas cushion; and

adjusting a temperature of the gas flowing through the gas conduit based on the measured substrate temperature.

6. The method of claim 1 , wherein the plurality of holes is a first plurality, the gas is a first gas, the gas conduit is a first gas conduit, and the gas cushion is a first gas cushion, and further comprising flowing a second gas through a second gas conduit and through a second plurality of holes formed through the metal support surface to form a second gas cushion between the substrate and the metal support surface to support the substrate, wherein the first plurality of holes is at a central region of the substrate support and the second plurality of holes is at an edge region of the substrate support.

7. The method of claim 6 , further comprising adjusting a flowrate of the first gas independent of a flowrate of the second gas.

8. The method of claim 7 , further comprising independently adjusting a temperature of the first gas and the second gas.

9. The method of claim 1 , further comprising controlling a temperature of the gas using a heat exchanger coupled to the gas conduit.

10. The method of claim 1 , wherein the substrate support comprises a plurality of sections, each having a metal support surface and a plurality of holed formed through the metal support surface, flowing a gas through a gas conduit and through the plurality of holes comprises flowing the gas through the plurality of holes of each of the sections to form a gas cushion, and thermally controlling the substrate comprises adjusting a temperature of flowrate of gas to each of the sections using the thermal control system.

11. The method of claim 1 , wherein thermally controlling the substrate further comprises thermally coupling the substrate with the metal support surface.

12. A method, comprising:

using a gas cushion substrate support to support a substrate, the gas cushion substrate support comprising a metal support surface and a plurality of holes formed through the metal support surface;

flowing a gas through a gas conduit and through the plurality of holes to form a gas cushion between the substrate and the metal support surface to support the substrate;

exhausting gas from the gas cushion through a plurality of gas escape passages formed through the gas cushion substrate support;

depositing a print material on the substrate while the substrate is supported by the gas cushion; and

thermally controlling the substrate by adjusting a flowrate of the gas, adjusting a temperature of the gas using a thermal control system coupled to the gas conduit, or both.

13. The method of claim 12 , wherein the flowing a gas through a gas conduit and through the plurality of holes to form a gas cushion comprises flowing the gas through a gas flow passage formed in a support plate of the gas cushion substrate support to a gap between the support plate and a top member of the gas cushion substrate support that provides the support surface.

14. The method of claim 13 , wherein the gas escape passages are formed through the top member and the support plate.

15. The method of claim 12 , wherein thermally controlling the substrate further comprises:

measuring a temperature of the gas flowing through the gas conduit, a temperature of the substrate, or both; and

adjusting the flowrate or temperature of the gas flowing through the gas conduit based on the measured gas temperature, substrate temperature, or both.

16. The method of claim 12 , wherein thermally controlling the substrate further comprises thermally coupling the substrate and the metal support surface.

17. The method of claim 12 , wherein thermally controlling the substrate comprises adjusting a temperature of the gas using a thermal control system that comprises a thermal unit that circulates and controls a thermal medium and a heat exchanger that thermally couples the thermal medium with the gas.

18. The method of claim 17 , wherein the thermal control system controls thermal flux of the heat exchanger by controlling flowrate of the thermal medium.

19. A method, comprising:

using a gas cushion substrate support to support a substrate, the gas cushion substrate support comprising a metal top member, a support plate, and a plurality of holes formed through the metal support member and the support plate;

flowing a gas through a gas conduit and through the plurality of holes to form a gas cushion between the substrate and the metal support surface to support the substrate;

exhausting gas from the gas cushion through a plurality of gas escape passages formed through the top member and the support plate;

depositing a print material on the substrate while the substrate is supported by the gas cushion;

controlling the gas cushion by controlling a flowrate of the gas; and

thermally controlling the substrate by adjusting a temperature of the gas using a thermal control system coupled to the gas conduit, the thermal control system comprising a thermal unit that circulates and controls a thermal medium and a heat exchanger that thermally couples the thermal medium with the gas.

20. The method of claim 19 , wherein the top member is a porous body.