IP Library Granted Patent US 12,650,451
Granted Patent B2
US 12,650,451 · App. 18/305,769 · Granted Jun 9, 2026

Shielding for capacitance sensing

Inventor: Donald Enzinna (Lockport, NY)
Assignee: Advanced Energy Industries, Inc.
G01R27/2605G01R15/00
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Quick Facts
Patent No.
US 12,650,451
App. No.
18/305,769
Granted
Jun 9, 2026
Kind
B2
Abstract

Systems, methods, and apparatuses for measuring capacitance of a load. The method includes applying, via a conductor, a time-varying voltage signal with a DC offset to the load. At least a portion of the conductor is shielded with a shield and the time-varying voltage signal is applied to the shield. The conductor is coupled to the load and one or more power-related parameters of the conductor are monitored to monitor the capacitance of the load.

Claims (42)

1 . A method for determining capacitance of a load, the method comprising:

producing a time-varying voltage signal by amplifying a low-voltage version of the time-varying voltage signal;

producing a DC source voltage;

injecting the low-voltage version of the time-varying voltage signal onto the DC source voltage to produce a low voltage version of the time-varying voltage signal with a DC offset;

amplifying the low voltage version of the time-varying voltage signal with the DC offset to produce a time-varying voltage signal with the DC offset;

applying, via a conductor, the time-varying voltage signal with the DC offset to the load;

shielding at least a portion of the conductor with a shield;

applying the time-varying voltage signal to the shield;

coupling the conductor to the load; and

monitoring one or more power-related parameters of the conductor to monitor the capacitance of the load.

2 . The method of claim 1 , wherein shielding the conductor comprises co-axially shielding the conductor.

3 . The method of claim 2 , wherein shielding the conductor includes shielding the conductor with a wrapped foil shield.

4 . The method of claim 1 , wherein at least a portion of the conductor comprises a trace on a printed circuit board, and wherein shielding the conductor comprises shielding the trace with conductive layers above and below the trace.

5 . The method of claim 1 , wherein monitoring comprises measuring current in the conductor and calculating the capacitance based upon the measured current.

6 . The method of claim 1 , wherein the injecting comprises injecting the low-voltage version of the time-varying voltage signal onto the DC source voltage with a summing amplifier.

7 . The method of claim 1 , wherein amplifying the low voltage version of the time-varying voltage signal with the DC offset comprises amplifying the low voltage version of the time-varying voltage signal with a gain to produce the time-varying voltage signal with the DC offset.

8 . The method of claim 1 , comprising:

coupling the conductor to an electrostatic chuck; and

monitoring one or more power-related parameters of the conductor to monitor a combined capacitance of the electrostatic chuck and a workpiece positioned on the electrostatic chuck.

9 . The method of claim 8 , comprising:

shielding at least a portion of the electrostatic chuck to nullify stray capacitances in the electrostatic chuck.

10 . An apparatus for sensing capacitance of a load, the apparatus comprising:

a DC source to provide a DC source voltage;

a varying signal source to provide a low-voltage version of a time-varying voltage signal;

a signal injector configured to inject the low-voltage version of the time-varying voltage signal onto the DC source voltage to produce a low voltage version of the time-varying voltage signal with a DC offset;

a first amplifier to amplify the low voltage version of the time-varying voltage signal with the DC offset to produce a time-varying voltage signal with the DC offset; and

a second amplifier to amplify the low-voltage version of the time-varying voltage signal to produce the time-varying voltage signal;

an output node to couple to a conductor;

a shield node to couple to a shield for the conductor;

power circuitry configured to:

apply the time-varying voltage signal to the shield node; and

apply, to the output node, the time-varying signal with the DC offset; and

a capacitance monitor to sense the capacitance of the load by monitoring one or more power-related parameters of the conductor.

11 . The apparatus of claim 10 , wherein the output node is coaxially arranged with the shield node.

12 . The apparatus of claim 11 , comprising a coaxial cable, the coaxial cable comprising an inner conductor configured to couple to the output node and a shield conductor configured to couple to the shield node.

13 . The apparatus of claim 12 , wherein the shield conductor comprises a wrapped foil.

14 . The apparatus of claim 12 , wherein the capacitance monitor comprises a current monitor to monitor current and determine the capacitance of the load based upon the monitored current.

15 . The apparatus of claim 14 , wherein the current monitor includes one or more of a flux gate sensor, a resistive shunt sensor, a hall effect sensor, and a current mirror circuit.

16 . The apparatus of claim 10 , comprising a printed circuit board, the printed circuit board comprising:

a trace coupled to the conductor; and

conductive layers above and below the trace.

17 . The apparatus of claim 10 , wherein the signal injector comprises a summing amplifier.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2023
From: ENZINNA, DONALD
To: ADVANCED ENERGY INDUSTRIES, INC.
Reel/Frame 063714/0500 →
Continuity (1)
Related Publication 20240353456A1 · Oct 24, 2024
References Cited (113)
US 3913015A · Bronaugh et al. · 1975 [cited by applicant]
US 4027203A · Moran et al. · 1977 [cited by applicant]
US 4876534A · Mead et al. · 1989 [cited by applicant]
US 5017871A · Mueller et al. · 1991 [cited by applicant]
US 5075869A · Holler et al. · 1991 [cited by applicant]
US 5103367A · Horwitz et al. · 1992 [cited by applicant]
US 5436555A · Locke · 1995 [cited by examiner]
US 5436790A · Blake et al. · 1995 [cited by applicant]
US 5437040A · Campbell et al. · 1995 [cited by applicant]
US 5489888A · Jagiella · 1996 [cited by examiner]
US 5539323A · Davis, Jr. · 1996 [cited by examiner]
US 5546005A · Rauchwerger · 1996 [cited by examiner]
US 5882492A · Manley et al. · 1999 [cited by applicant]
US 6095084A · Shamouilian · 2000 [cited by examiner]
US 6430022B2 · Leeser · 2002 [cited by applicant]
US 6486681B1 · Weber · 2002 [cited by examiner]
US 6670622B2 · Heike et al. · 2003 [cited by applicant]
US 7558045B1 · Onate et al. · 2009 [cited by applicant]
US 7656169B2 · Scheckenbach · 2010 [cited by examiner]
US 8108328B2 · Hench · 2012 [cited by applicant]
US 8514544B2 · McAnn et al. · 2013 [cited by applicant]
US 8638109B2 · De Boer et al. · 2014 [cited by applicant]
US 9146259B2 · Blake et al. · 2015 [cited by applicant]
US 9322850B2 · Wood et al. · 2016 [cited by applicant]
US 9496793B2 · Bruwer et al. · 2016 [cited by applicant]
US 10260388B2 · Potyrailo et al. · 2019 [cited by applicant]
US 10837991B2 · Sugita et al. · 2020 [cited by applicant]
US 11280811B2 · Enzinna · 2022 [cited by applicant]
US 11817340B2 · Herman · 2023 [cited by applicant]
US 12019099B2 · Enzinna · 2024 [cited by applicant]
US 12038464B2 · Enzinna · 2024 [cited by applicant]
US 12379233B2 · Enzinna · 2025 [cited by applicant]
US 20020004186A1 · Lochschmied · 2002 [cited by applicant]
US 20030080755A1 · Kobayashi · 2003 [cited by examiner]
US 20030160512A1 · Muldoon · 2003 [cited by applicant]
US 20040075442A1 · Iannello · 2004 [cited by examiner]
US 20040149221A1 · Koshimizu et al. · 2004 [cited by applicant]
US 20050199341A1 · Delp et al. · 2005 [cited by applicant]
US 20050220984A1 · Sun et al. · 2005 [cited by applicant]
US 20060011591A1 · Sellers · 2006 [cited by applicant]
US 20070103092A1 · Millner et al. · 2007 [cited by applicant]
US 20080055813A1 · Son · 2008 [cited by applicant]
US 20080203070A1 · Ilic et al. · 2008 [cited by applicant]
US 20090033353A1 · Yu et al. · 2009 [cited by applicant]
US 20090200281A1 · Hampton · 2009 [cited by applicant]
US 20090267620A1 · Takimoto · 2009 [cited by examiner]
US 20100008016A1 · Onate et al. · 2010 [cited by applicant]
US 20100231229A1 · Harris et al. · 2010 [cited by applicant]
US 20110032654A1 · McAnn et al. · 2011 [cited by applicant]
US 20130003250A1 · Morimoto et al. · 2013 [cited by applicant]
US 20130257048A1 · Neddermeyer, III et al. · 2013 [cited by applicant]
US 20160303983A1 · Rotay et al. · 2016 [cited by applicant]
US 20160377758A1 · Dorrough · 2016 [cited by examiner]
US 20170108540A1 · Davis et al. · 2017 [cited by applicant]
US 20170162415A1 · Uehara et al. · 2017 [cited by applicant]
US 20170330772A1 · Yamazawa · 2017 [cited by applicant]
US 20170334295A1 · Turner et al. · 2017 [cited by applicant]
US 20170338081A1 · Yamazawa · 2017 [cited by applicant]
US 20170355337A1 · Lamesch · 2017 [cited by examiner]
US 20170358431A1 · Dorf et al. · 2017 [cited by applicant]
US 20180120357A1 · Takenaka · 2018 [cited by applicant]
US 20190066982A1 · Sato et al. · 2019 [cited by applicant]
US 20190170791A1 · Hetzler et al. · 2019 [cited by applicant]
US 20190190242A1 · Douglas · 2019 [cited by examiner]
US 20200211886A1 · Kashimura · 2020 [cited by examiner]
US 20200400719A1 · Enzinna · 2020 [cited by applicant]
US 20200403397A1 · Nakagawa et al. · 2020 [cited by applicant]
US 20200411356A1 · Fujii et al. · 2020 [cited by applicant]
US 20210028713A1 · Iyer et al. · 2021 [cited by applicant]
US 20210237610A1 · Zheng et al. · 2021 [cited by applicant]
US 20210245622A1 · Wang et al. · 2021 [cited by applicant]
US 20220244294A1 · Enzinna · 2022 [cited by applicant]
US 20220283200A1 · Friedrich et al. · 2022 [cited by applicant]
US 20220334160A1 · Enzinna · 2022 [cited by applicant]
US 20220367225A1 · Herman · 2022 [cited by applicant]
US 20230134296A1 · Benjamin et al. · 2023 [cited by applicant]
US 20230141067A1 · Oliveti · 2023 [cited by applicant]
US 20230204643A1 · Hatanaka · 2023 [cited by examiner]
US 20230231543A1 · Van Zyl · 2023 [cited by applicant]
US 20230298920A1 · Golovkov et al. · 2023 [cited by applicant]
US 20240125832A1 · Enzinna · 2024 [cited by applicant]
US 20240426884A1 · Enzinna · 2024 [cited by applicant]
AU 2011267897A1 · 2013 [cited by applicant]
EP 1418668A1 · 2004 [cited by applicant]
JP H08256027A · 1996 [cited by applicant]
KR 1020180048337A · 2018 [cited by applicant]
KR 1020190040198A · 2019 [cited by applicant]
WO WO2013001098A2 · 2013 [cited by examiner]
WO 2015120419A1 · 2015 [cited by applicant]
WO 2019044258A1 · 2019 [cited by applicant]
WO 2020205339A1 · 2020 [cited by applicant]
KIPO, Notice of Grounds for Rejection issued in Korean Patent Application No. 10-2022-7001560, Feb. 19, 2025. [cited by applicant]
PCT, International Search Report and Written Opinion issued in PCT/US2024/058374, Jan. 24, 2025, 20 pages. [cited by applicant]
Astacio-Oquendo, Giovanni, “Office Action Regarding U.S. Appl. No. 16/901,746”, May 27, 2021, p. 36, Published in: US. [cited by applicant]
Astacio-Oquendo, Giovanni, Non-Final Office Action issued in U.S. Appl. No. 17/676,885, filed Nov. 9, 2023, 38 pages. [cited by applicant]
CNIPA, Notification of the First Office Action issued in CN Application No. 202080051937.5, Oct. 30, 2024, 21 pages. [cited by applicant]
EPO, Extended European Search Report issued in EP Application No. 20825717.0, Jun. 16, 2023, 14 pages. [cited by applicant]
KIPO, “International Search Report and Written Opinion Re International Application No. PCT/US2022/020507”, Jul. 14, 2022, p. 9, Published in: WO. [cited by applicant]
National Instruments—NI (ni.com): “Floating Signal Sources” via link https:/Avww.ni.com/docs/en-US/bundle/usb-6008-6009-feature/page/float-sig-sourc20esi.gnahl% i2m0solur#ce:%20˜is: otptiecaxl %t20=isAol%ato2rs0%2fC%l20… [cited by applicant]
Nguyen, Hoai an D, Final office action issued in U.S. Appl. No. 17/694,731, filed Oct. 25, 2023, 46 pages. [cited by applicant]
Nguyen, Hoai an D, Office action issued in U.S. Appl. No. 17/694,731, filed Jun. 8, 2023, 35 pages. [cited by applicant]
PCT, “International Search Report and Written Opinion Regarding International Application No. PCT/US2020/037838”, Aug. 14, 2020, p. 13, Published in: AU. [cited by applicant]
PCT, “International Search Report and Written Opinion Regarding International Application No. PCT/US2022/020536”, Jul. 14, 2022, p. 9, Published in: KR. [cited by applicant]
PCT, International Preliminary Report on Patentability issued in PCT/2020/037838, Dec. 30, 2021, 9 pages. [cited by applicant]
PCT, International Preliminary Report on Patentability issued in PCT/2022/020507, Sep. 28, 2023, 6 pages. [cited by applicant]
PCT, International Preliminary Report on Patentability issued in PCT/US2022/020536, Nov. 9, 2023, 6 pages. [cited by applicant]
Trek, Inc., “The Electrostatic Semiconductor Wafer Clamping/Chucking System (ESC)”, Trek Application Note No. 6002 , 2013, pp. 1-8. [cited by applicant]
CNIPA, Notification of the second office action issued in CN Application No. 202080051937.5, May 14, 2025, 11 pages. [cited by applicant]
PCT, International Search Report and Written Opinion issued in PCT/US2025/015206, Apr. 10, 2025, 17 pages. [cited by applicant]
Final Office Action received for U.S. Appl. No. 17/694,731, mailed on Oct. 25, 2023, 15 pages. [cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 18/678,637, mailed on Jan. 12, 2026 10 pages. [cited by applicant]
Office Action received for Great Britain Patent Application No. 2512737.4, mailed on Feb. 2, 2026, 8 pages. [cited by applicant]
Office Action received for Korean Patent Application No. 10-2023-7035392, mailed on Nov. 7, 2025, 12 pages (6 pages of English Translation and 6 pages of Original Document). [cited by applicant]