INTEGRATED RESISTOR-TRANSISTOR-CAPACITOR SNUBBER
A circuit includes a metal-oxide semiconductor field-effect transistor (MOSFET) and a snubber circuit coupled between a drain and a source of the MOSFET. The snubber circuit includes a transistor disposed in parallel to the MOSFET. The transistor has a floating gate. The circuit further includes a capacitor in series with the transistor, and a resistor disposed parallel to the capacitor.
1 . A circuit comprising:
a metal-oxide semiconductor field-effect transistor (MOSFET) including a gate, a source, and a drain; and
a snubber circuit coupled between the drain and the source, the snubber circuit including:
a transistor disposed in parallel to the MOSFET, the transistor having a floating gate;
a capacitor in series with the transistor; and
a resistor disposed parallel to the capacitor.
2 . The circuit of claim 1 , wherein the drain of the MOSFET is capacitively coupled to the floating gate of the transistor such that a voltage at the drain of the MOSFET couples a voltage value to the floating gate.
3 . The circuit of claim 2 , wherein the transistor has a gate-source threshold voltage, and wherein when the voltage value coupled to the floating gate exceeds the gate-source threshold voltage of the transistor, the transistor turns on to charge the capacitor.
4 . The circuit of claim 3 , wherein the resistor conducts leakage current to reduce or prevent charging of the capacitor.
5 . The circuit of claim 2 , wherein the capacitor charges to a voltage (Vcap) up to a difference in a drain-to-source voltage of the MOSFET and a drain-to-source voltage of the transistor.
6 . The circuit of claim 2 , wherein when the voltage value coupled to the floating gate falls below a gate threshold value the transistor turns off to stop charging the capacitor.
7 . The circuit of claim 1 , wherein the MOSFET and the snubber circuit are monolithically integrated in a semiconductor die.
8 . The circuit of claim 7 , wherein the MOSFET is fabricated in a first active area of the semiconductor die, and the transistor is fabricated in a second active area of the semiconductor die, the second active area having an area that is less than fifteen percent of an area of the first active area.
9 . The circuit of claim 1 , wherein a capacitor voltage divider is disposed between a drain of the transistor and a source of the transistor to determine a voltage at the floating gate of the transistor.
10 . The circuit of claim 1 , wherein the transistor having a floating gate is a shielded gate vertical trench MOSFET with a floating shield plate.
11 . The circuit of claim 10 , wherein the resistor is a first resistor, and the circuit further comprises a second resistor disposed across the floating gate and the floating shield plate.
12 . A semiconductor die comprising:
a metal-oxide semiconductor field-effect transistor (MOSFET) including a gate, a source, and a drain; and
a snubber circuit including a transistor disposed in parallel to the MOSFET between the source and the drain, the transistor having a floating gate.
13 . The semiconductor die of claim 12 , wherein the MOSFET is fabricated in a first active area, and the transistor is fabricated in a second active area of the semiconductor die, the second active area having an area that is less than 15 percent of an area of the first active area.
14 . The semiconductor die of claim 12 , wherein the snubber circuit further comprises:
a capacitor in series with the transistor; and
a resistor disposed parallel to the capacitor.
15 . The semiconductor die of claim 14 , wherein the capacitor and the resistor are monolithically integrated with the transistor on the semiconductor die.
16 . The semiconductor die of claim 12 , wherein the snubber circuit further comprises a capacitor voltage divider between a drain and a source of the transistor to set a voltage at the floating gate.
17 . A method comprising:
disposing a snubber circuit in parallel with a switching element, the snubber circuit including a snubber transistor having a floating gate;
integrating the snubber circuit with the switching element on a semiconductor die; and
capacitively coupling a voltage on a drain of the switching element to the floating gate of the snubber transistor.
18 . The method of claim 17 , wherein the switching element is a MOSFET fabricated in a first active area of the semiconductor die, and the snubber transistor is fabricated in a second active area of the semiconductor die, the second active area having an area that is less than 15 percent of an area of the first active area.
19 . The method of claim 17 , wherein the snubber circuit further comprises:
a capacitor in series with the snubber transistor; and
a resistor disposed parallel to the capacitor.
20 . The method of claim 17 , further comprising disposing a capacitor voltage divider between a drain and a source of the snubber transistor to set a voltage at the floating gate.