Manufacturing method of display device
According to an embodiment, a manufacturing method allows the manufacture of a display device including a partition including a lower portion provided on a rib including a pixel aperture and an upper portion protruding from a side surface of the lower portion. The method includes forming a lower electrode, forming a rib layer, forming a lower layer, forming an upper layer, forming a resist, forming the rib by a first etching process, forming the upper portion by a second etching process after the first etching process, and forming the lower portion by a third etching process after the second etching process.
1 . A manufacturing method of a display device comprising a partition including a lower portion and an upper portion, the lower portion being provided on a rib comprising a pixel aperture overlapping a display element, the upper portion protruding from a side surface of the lower portion, the method including:
forming a lower electrode of the display element;
forming a rib layer formed of a material of the rib on the lower electrode;
forming a lower layer formed of a material of the lower portion on the rib layer;
forming an upper layer formed of a material of the upper portion on the lower layer;
forming a resist on the upper layer;
forming the rib comprising the pixel aperture overlapping the lower electrode by removing, of the upper layer, the lower layer and the rib layer, a portion exposed from the resist by a first etching process;
forming the upper portion by reducing widths of the resist and the upper layer by a second etching process after the first etching process; and
forming the lower portion by making a width of the lower layer less than a width of the upper portion by a third etching process after the second etching process.
2 . The manufacturing method of claim 1 , wherein
the first etching process includes:
first dry etching for removing, of the upper layer, a portion exposed from the resist;
second dry etching for removing, of the lower layer, a portion exposed from the resist; and
third dry etching for removing, of the rib layer, a portion exposed from the resist.
3 . The manufacturing method of claim 1 , wherein
the second etching process includes:
ashing for reducing the width of the resist; and
fourth dry etching for removing, of the upper layer, a portion exposed from the resist after the ashing.
4 . The manufacturing method of claim 1 , wherein
the third etching process includes isotropic wet etching.
5 . The manufacturing method of claim 1 , wherein
the second etching process includes fourth dry etching for reducing the widths of the resist and the upper layer by affecting both the resist and the upper layer.
6 . The manufacturing method of claim 1 , wherein
before the second etching process is applied, the resist includes a pair of thin portions and a thick portion between the pair of thin portions.
7 . The manufacturing method of claim 1 , further including
forming an organic layer and an upper electrode for constituting the display element together with the lower electrode by vapor deposition after the formation of the partition.
8 . The manufacturing method of claim 7 , further including
forming a sealing layer which continuously covers the display element and the partition.
9 . The manufacturing method of claim 7 , wherein
a shadow area in which a thickness decreases toward the side surface of the lower portion is formed on the rib, and
the shadow area is entirely located on the rib and does not overlap the pixel aperture.
10 . The manufacturing method of claim 9 , further including
forming a cap layer including a plurality of transparent thin films which cover the upper electrode, wherein
in the shadow area, a thickness of the cap layer decreases toward the side surface of the lower portion.