Nozzle-droplet combination techniques to deposit fluids in substrate locations within precise tolerances
An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different print head/substrate scan offsets, offsets between print heads, the use of different nozzle drive waveforms, and/or other techniques. Optionally, patterns of fill variation can be introduced so as to mitigate observable line effects in a finished display device. The disclosed techniques have many other possible applications.
1. A method of processing a substrate, comprising:
for each nozzle of a printhead for ejecting a liquid onto the substrate, receiving data representing an expected droplet volume produced by the nozzle in association with one or more waveforms;
receiving data representing a desired volume of the liquid to be deposited in each of a plurality of locations of the substrate;
for each location, obtaining a tolerance range for aggregate volume deposited in the location, the tolerance range surrounding the desired volume for the location;
for each location, selecting a plurality of combinations of nozzles and waveforms that can be used to deposit droplets of the liquid in the location such that the expected droplet volumes of each selected combination of nozzles and waveforms sum to a value within the tolerance range for the location;
from the selected combinations, identifying a combination of nozzles and waveforms that maximizes a number of locations receiving the liquid in one scan of the printhead;
depositing droplets at the locations using the corresponding identified nozzle and waveform combination for each location to form a liquid layer; and
processing the liquid layer to form a solid layer on the substrate.
2. The method of claim 1 , wherein the identified combinations of nozzles and waveforms for two adjacent locations having the same tolerance range are different.
3. The method of claim 1 , wherein one nozzle is selected to deposit more than one droplet at one location of the substrate.
4. The method of claim 1 , wherein depositing the droplets at the locations comprises relatively moving the substrate and the printhead according to a plurality of scan paths and adjusting the printhead according to the selected nozzles.
5. The method of claim 1 , wherein the processing comprises exposing the liquid layer to ultraviolet light, wherein the depositing and the exposing are performed in a controlled atmosphere free of ambient air.
6. The method of claim 1 , wherein at least two tolerance ranges are different.
7. The method of claim 1 , wherein the solid layer is an encapsulation layer.
8. The method of claim 1 , wherein depositing droplets at the locations using the corresponding identified nozzle and waveform combination for each location comprises concurrently depositing droplets at two different locations.
9. The method of claim 1 , further comprising measuring a characteristic of droplets ejected from each nozzle using at least one waveform while the droplet is in flight.
10. A method of processing a substrate, comprising:
for each nozzle of a printhead for ejecting a liquid onto the substrate, receiving data representing an expected droplet volume produced by the nozzle in association with one or more waveforms;
receiving data representing a desired volume of the liquid to be deposited in each of a plurality of locations of the substrate;
for each location, obtaining a tolerance range for aggregate volume deposited in the location, the tolerance range surrounding the desired volume for the location;
for each location, selecting a plurality of combinations of nozzles and waveforms that can be used to deposit droplets of the liquid in the location such that the expected droplet volumes of each selected combination of nozzles and waveforms sum to a value within the tolerance range for the location;
from the selected combinations, identifying a combination of nozzles and waveforms that minimizes a number of scans of the printhead needed to form a liquid layer on the substrate;
depositing droplets at the locations using the corresponding identified nozzle and waveform combination for each location to form the liquid layer; and
processing the liquid layer to form a solid layer on the substrate.
11. The method of claim 10 , wherein the identified combinations of nozzles and waveforms for two adjacent locations having the same tolerance range are different.
12. The method of claim 10 , wherein one nozzle is selected to deposit more than one droplet at one location of the substrate.
13. The method of claim 10 , wherein depositing the droplets at the locations comprises relatively moving the substrate and the printhead according to a plurality of scan paths and adjusting the printhead according to the selected nozzles.
14. The method of claim 10 , wherein the processing comprises exposing the liquid layer to ultraviolet light, wherein the depositing and the exposing are performed in a controlled atmosphere free of ambient air.
15. The method of claim 10 , wherein at least two tolerance ranges are different.
16. The method of claim 10 , wherein the solid layer is an encapsulation layer.
17. The method of claim 10 , wherein depositing droplets at the locations using the corresponding identified nozzle and waveform combination for each location comprises concurrently depositing droplets at two different locations.
18. The method of claim 10 , further comprising measuring a characteristic of droplets ejected from each nozzle using at least one waveform while the droplet is in flight.
19. A method of processing a substrate, comprising:
for each nozzle of a printhead for ejecting a liquid onto the substrate, receiving data representing an expected droplet volume produced by the nozzle in association with one or more waveforms;
receiving data representing a desired volume of the liquid to be deposited in each of a plurality of locations of the substrate;
for each location, obtaining a tolerance range for aggregate volume deposited in the location, the tolerance range surrounding the desired volume for the location;
for each location, selecting a plurality of combinations of nozzles and waveforms that can be used to deposit droplets of the liquid in the location such that the expected droplet volumes of each selected combination of nozzles and waveforms sum to a value within the tolerance range for the location;
from the selected combinations, identifying a combination of nozzles and waveforms that minimizes a variance in deposited volume;
depositing droplets at the locations using the corresponding identified nozzle and waveform combination for each location to form the liquid layer; and
processing the liquid layer to form a solid layer on the substrate.
20. The method of claim 19 , wherein at least two tolerance ranges are different.