IP Library Granted Patent US 12,336,301
Granted Patent B2
US 12,336,301 · App. 18/319,489 · Granted Jun 17, 2025

Electro-static discharge protection devices having a low trigger voltage

Inventors: Young Bum Eom (Chungcheongbuk-do, KR); Myoung Chul Lim (Chungcheongbuk-do, KR)
Assignee: SK HYNIX SYSTEM IC (WUXI) CO., LTD.
H10D89/713H02H9/046
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Quick Facts
Patent No.
US 12,336,301
App. No.
18/319,489
Granted
Jun 17, 2025
Kind
B2
Abstract

An electro-static discharge (ESD) protection device includes a first well region and a second well region disposed to contact each other, a first diffusion region and a second diffusion region disposed in the first well region spaced apart from each other, a third diffusion region and a fourth diffusion region disposed in the second well region spaced apart from each other, a fifth diffusion region of the second conductivity type disposed in the first well region spaced apart from the first and second diffusion regions, a resistive pattern coupled to the first diffusion region through a first contact plug, a first electrode coupled to the second diffusion region through a second contact plug and electrically coupled to the resistive pattern, and a second electrode coupled to the third diffusion region through a third contact plug and coupled to the fourth diffusion region through a fourth contact plug.

Claims (21)

1. An electro-static discharge (ESD) protection device comprising:

a first well region of a first conductivity type;

a second well region of a second conductivity type disposed to contact with the first well region;

a first diffusion region of the first conductivity type disposed in the first well region;

a second diffusion region of the second conductivity type disposed in the first well region spaced apart from the first diffusion region;

a third diffusion region of the second conductivity type disposed in the second well region;

a fourth diffusion region of the first conductivity type disposed in the second well region spaced apart from the third diffusion region; a fifth diffusion region of the second conductivity type disposed in the first well region spaced apart from the first and second diffusion regions;

a resistive pattern coupled to the first diffusion region through a first contact plug;

a first electrode coupled to the second diffusion region through a second contact plug and electrically coupled to the resistive pattern; and

a second electrode coupled to the third diffusion region through a third contact plug and coupled to the fourth diffusion region through a fourth contact plug,

wherein the fourth diffusion region, the third diffusion region/the second well region, and the first diffusion region correspond to an emitter, a base, and a collector of a first bipolar junction transistor, respectively,

wherein the third diffusion region/the second well region, the first diffusion region/the first well region, and the second diffusion region correspond to a collector, a base, and an emitter of a second bipolar junction transistor, respectively,

wherein the third diffusion region/the second well region, the first diffusion region/the first well region, and the fifth diffusion region correspond to a collector, a base, and an emitter of a third bipolar junction transistor, respectively,

wherein the first bipolar junction transistor and the second bipolar junction transistor are components of a silicon controlled rectifier (SCR),

wherein the first electrode is commonly coupled to the second diffusion region and the fifth diffusion region, and

wherein a side surface of the first electrode is in direct contact with a side surface of the resistive pattern over the first diffusion region.

2. The ESD protection device of claim 1 , wherein the first electrode is coupled to the fifth diffusion region through a fifth contact plug.

3. The ESD protection device of claim 1 , wherein the fifth diffusion region has an impurity concentration which is higher than an impurity concentration of the second well region.

4. The ESD protection device of claim 1 , further comprising a sixth diffusion region of the first conductivity type disposed in the first well region spaced apart from the first diffusion region, the second diffusion region, and the fifth diffusion region.

5. The ESD protection device of claim 4 , wherein the sixth diffusion region has an impurity concentration which is higher than an impurity concentration of the first well region.

6. The ESD protection device of claim 5 , wherein the sixth diffusion region is electrically floated.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2024
From: SK HYNIX SYSTEM IC INC.
To: SK HYNIX SYSTEM IC (WUXI) CO., LTD.
Reel/Frame 067889/0779 →